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公开(公告)号:US12230893B2
公开(公告)日:2025-02-18
申请号:US17877972
申请日:2022-07-31
Applicant: QUALCOMM Incorporated
Inventor: Jefy Alex Jayamon , Jeremy Darren Dunworth
IPC: H01Q3/40
Abstract: A method of selecting an antenna beam includes: selecting a beam port of a first phase progression matrix having a first subset of antenna ports terminated in respective first characteristic impedances; selecting a beam port of a second phase progression matrix that is separate from the first phase progression matrix and has a second subset of antenna ports terminated in respective second characteristic impedances; and at least one of: combining a first receive signal portion from the selected beam port of the first phase progression matrix and a second receive signal portion from the selected beam port of the second phase progression matrix, or providing a first portion of a transmit signal to the selected beam port of the first phase progression matrix and a second portion of the transmit signal to the selected beam port of the second phase progression matrix.
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公开(公告)号:US12002769B2
公开(公告)日:2024-06-04
申请号:US18300256
申请日:2023-04-13
Applicant: QUALCOMM Incorporated
Inventor: Muhammad Hassan , Bhushan Shanti Asuri , Jeremy Darren Dunworth , Ravi Sridhara
CPC classification number: H01L23/60 , H03F3/195 , H03F3/245 , H03F2200/318 , H03F2200/441 , H03F2200/451 , H03F2200/541
Abstract: In certain aspects, a chip includes a pad, and a power amplifier having a first output and a second output. The chip also includes a transformer, wherein the transformer includes a first inductor coupled between a first terminal and a second terminal of the transformer, wherein the first terminal is coupled to the first output of the power amplifier, and the second terminal is coupled to the second output of the power amplifier. The transformer also includes a second inductor coupled between a third terminal and a fourth terminal of the transformer, wherein the third terminal is coupled to the pad. The chip also includes a first switch coupled to the fourth terminal, a shunt inductor coupled in parallel with the first switch, and a low-noise amplifier coupled to the third terminal.
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公开(公告)号:US20220077586A1
公开(公告)日:2022-03-10
申请号:US17016196
申请日:2020-09-09
Applicant: Qualcomm Incorporated
Inventor: Seong Heon Jeong , Mohammad Ali Tassoudji , Jeremy Darren Dunworth , Jon Lasiter , Ravindra Vaman Shenoy
Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.
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公开(公告)号:US11228086B2
公开(公告)日:2022-01-18
申请号:US16004466
申请日:2018-06-11
Applicant: QUALCOMM Incorporated
Inventor: Jon Lasiter , Ravindra Vaman Shenoy , Mohammad Ali Tassoudji , Seong Heon Jeong , Jeremy Darren Dunworth
Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.
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公开(公告)号:US09923524B2
公开(公告)日:2018-03-20
申请号:US15214857
申请日:2016-07-20
Applicant: QUALCOMM Incorporated
Inventor: Nicholas Michael Carbone , Jeremy Darren Dunworth , Hyunchul Park
CPC classification number: H03F1/3241 , H03F1/0261 , H03F1/3247 , H03F1/3282 , H03F3/211 , H03F3/245 , H03F3/68 , H03F2200/18 , H03F2200/451 , H03F2201/3212 , H03F2203/21106 , H03F2203/21131 , H03F2203/21181 , H03F2203/21193 , H04B1/0475 , H04B1/0483 , H04B2001/0416 , H04B2001/0425 , H04B2001/045 , H04W52/52
Abstract: Certain aspects of the present disclosure relate to methods and apparatus for power amplifier control. A power amplifier network includes a first path comprising a first power amplifier. The power amplifier network further includes a second path comprising a second power amplifier. The power amplifier network further includes a common input path to both the first path and the second path. The power amplifier network further includes a first power control network for controlling a first signal applied to the first power amplifier. The power amplifier network further includes a second power control network for controlling a second signal applied to the second power amplifier, wherein the first power control network is different from the second power control network.
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公开(公告)号:US09344038B2
公开(公告)日:2016-05-17
申请号:US14175111
申请日:2014-02-07
Applicant: QUALCOMM Incorporated
Inventor: Joonhoi Hur , Paul Joseph Draxler , Jeremy Darren Dunworth , Peter D Heidmann
CPC classification number: H03C7/025 , H04L27/22 , H04L27/361
Abstract: Exemplary embodiments are related to a tri-phase digital polar modulator. A device may include a modulator configured to generate a primary phase modulated signal including the most significant bits (MSBs) of a modulated signal, a leading phase modulated signal including a first least significant bits (LSB) of the modulated signal, and a lagging phase modulated signal including a second LSB of the modulated signal. The device may also include a combination unit configured to add the primary phase modulated signal, the leading phase modulated signal, and the lagging phase modulated signal.
Abstract translation: 示例性实施例涉及三相数字极化调制器。 设备可以包括调制器,其被配置为生成包括调制信号的最高有效位(MSB)的主相位调制信号,包括调制信号的第一最低有效位(LSB)的前置相位调制信号和滞后相位 调制信号包括调制信号的第二LSB。 该装置还可以包括被配置为添加主相位调制信号,前置相位调制信号和滞后相位调制信号的组合单元。
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公开(公告)号:US20150381401A1
公开(公告)日:2015-12-31
申请号:US14681008
申请日:2015-04-07
Applicant: QUALCOMM Incorporated
Inventor: Daniel Keyes Butterfield , Peiyuan Wang , Jeremy Darren Dunworth
CPC classification number: H04B1/0458 , H03F1/02 , H03F1/0205 , H03F1/32 , H03F3/005 , H03F3/19 , H03F3/21 , H03F3/211 , H03F3/24 , H03F3/45179 , H03F2200/331 , H03F2200/336 , H03F2200/451 , H03F2200/516 , H03F2200/537 , H03F2200/541 , H03F2203/21142 , H03F2203/45364 , H03M1/066 , H03M1/66 , H03M1/804 , H03M7/165 , H04B1/0475 , H04B2001/045 , H04L27/3416 , H04L27/36
Abstract: The present disclosure includes switched capacitor transmitter circuits and methods. In one embodiment, a digital data signal is thermometer encoded and a negative thermo-encoded signal is bit order reversed to control capacitors in a switched capacitor transmitter circuit. In another embodiment, the present disclosure includes a plurality of switched capacitor transmitter circuits coupled to inputs of an inductive network. The inductive network combines voltages from the switched capacitor transmitter circuits to produce a combined voltage on an output.
Abstract translation: 本公开包括开关电容发射机电路和方法。 在一个实施例中,数字数据信号是温度计编码的,负的热编码信号是位反转的,以控制开关电容发射器电路中的电容器。 在另一个实施例中,本公开包括耦合到感应网络的输入的多个开关电容发射器电路。 感应网络组合来自开关电容发射器电路的电压,以在输出端产生组合电压。
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公开(公告)号:US09088471B1
公开(公告)日:2015-07-21
申请号:US14465442
申请日:2014-08-21
Applicant: QUALCOMM Incorporated
Inventor: Hong Sun Kim , James Ian Jaffee , Paul Sheehy , Jeremy Darren Dunworth , Cheng-Han Wang , Prasad Srinivasa Siva Gudem , Ojas Mahendra Choksi , Jungdong Park
CPC classification number: H04L27/362 , H04L27/206 , H04L27/2071 , H04L27/364 , H04L2027/0016
Abstract: Certain aspects of the present disclosure provide methods and apparatus for performing quadrature combining and adjusting. One example circuit may include first through fourth mixing circuits. The first mixing circuit may multiply a radio frequency signal with a first local oscillating signal to generate a first frequency converted signal. The second mixing circuit may multiply a radio frequency (RF) signal with a second local oscillating signal, which may be about 90° out of phase with the first local oscillating signal, to generate a second frequency converted signal. The third and fourth mixing circuits may multiply the RF signal with the second and first signals, respectively, to generate third and fourth frequency converted signals, respectively. A first combining circuit may combine the first and third frequency converted signals, and a second combining circuit may combine the second and fourth frequency converted signals.
Abstract translation: 本公开的某些方面提供了用于执行正交组合和调整的方法和装置。 一个示例电路可以包括第一至第四混合电路。 第一混合电路可以将射频信号与第一本地振荡信号相乘以产生第一频率转换信号。 第二混合电路可以将射频(RF)信号与第二本地振荡信号相乘,该第二本地振荡信号可以与第一本地振荡信号相差约90°,以产生第二频率转换信号。 第三和第四混频电路可以分别将RF信号与第二和第一信号相乘,以分别产生第三和第四频率转换信号。 第一组合电路可以组合第一和第三频率转换信号,并且第二组合电路可以组合第二和第四频率转换信号。
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公开(公告)号:US11611424B2
公开(公告)日:2023-03-21
申请号:US17142194
申请日:2021-01-05
Applicant: QUALCOMM Incorporated
Inventor: Vasanthan Raghavan , Tao Luo , Junyi Li , Alexander Dorosenco , Robert Douglas , Jeremy Darren Dunworth , Allen Minh-Triet Tran
IPC: H04L5/14 , H04W72/044 , H04W72/04
Abstract: Aspects of the disclosure relate to an apparatus (e.g., a user equipment (UE)) configured to operate in a full-duplex mode. The apparatus may include at least one transmit chain configured to operate within a first frequency band and at least one receive chain configured to operate within a second frequency band. The apparatus may receive coordination information that is configured to mitigate the self-interference between the at least one transmit chain of the apparatus and the at least one receive chain of the apparatus. In some examples, the received coordination information includes at least one of subcarrier spacing coordination information, beam coordination information, or slot format index coordination information. In some examples, the apparatus may transmit a first signal while receiving a second signal based on at least the subcarrier spacing coordination information, the beam coordination information, or the slot format index coordination information to mitigate self-interference.
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公开(公告)号:US20210321415A1
公开(公告)日:2021-10-14
申请号:US17224004
申请日:2021-04-06
Applicant: QUALCOMM Incorporated
Inventor: Vasanthan Raghavan , Alexander Dorosenco , Tao Luo , Robert Douglas , Jeremy Darren Dunworth , Junyi Li , Allen Minh-Triet Tran
Abstract: Methods, systems, and devices for wireless communications are described for self-interference or cross-link interference measurements at a user equipment (UE). A UE may receive configuration information from a base station that indicates one or more slot format index (SFI) values that are compatible for cross-link interference or self-interference measurements. Based on the configured SFI(s), the UE may measure interference in multiple symbols, which may be used to estimate an amount of cross-link interference or self-interference, and the UE may transmit a measurement report to the base station. The base station, based on the measurement report, may identify one or more compatible SFIs, beam pairs, or combinations thereof, for subsequent communications with one or more UEs. The interference measurements may identify cross-link interference at the UE that results from transmissions of a different UE, or may identify self-interference of concurrent communications of multiple channels at a same UE.
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