公开(公告)号：US11696390B2

公开(公告)日：2023-07-04

申请号：US17100121

申请日：2020-11-20

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Suhyung Hwang ,  Mina Iskander ,  Rajneesh Kumar ,  Darryl Sheldon Jessie

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q21/29 ,  H01Q23/00 ,  H05K1/02 ,  H01Q1/48 ,  H01Q21/06 ,  H05K1/18

CPC classification number: H05K1/0219 ,  H01Q1/2283 ,  H01Q1/48 ,  H01Q1/526 ,  H01Q21/061 ,  H05K1/0225 ,  H05K1/0227 ,  H05K1/0278 ,  H01Q21/29 ,  H01Q23/00 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/09681 ,  H05K2201/10098

Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

公开(公告)号：US11495873B2

公开(公告)日：2022-11-08

申请号：US16810621

申请日：2020-03-05

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Rajneesh Kumar ,  Suhyung Hwang ,  Jaehyun Yeon ,  Mohammad Ali Tassoudji ,  Darryl Sheldon Jessie ,  Ameya Galinde

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US11406006B2

公开(公告)日：2022-08-02

申请号：US17122820

申请日：2020-12-15

Applicant: QUALCOMM Incorporated

Inventor： Xiaoming Chen ,  Darryl Sheldon Jessie

IPC: H05K1/02 ,  H05K1/11

Abstract: Certain aspects of the present disclosure generally relate to a circuit board with ground vias offset from associated ground bumps. One example circuit board generally includes a first signal connection terminal configured to connect a signal line of the circuit board to an integrated circuit (IC); a ground plane having a first ground connection terminal disposed adjacent to the first signal connection terminal, the first ground connection terminal being configured to provide a ground connection between the ground plane and the IC; and a first ground via associated with and disposed adjacent to the first ground connection terminal and coupled to the ground plane, wherein, from an overhead view of the circuit board, the first ground via is located at a position that is offset from a first axis on which the first signal connection terminal and the first ground connection terminal are disposed.

公开(公告)号：US11322855B2

公开(公告)日：2022-05-03

申请号：US16748707

申请日：2020-01-21

Applicant: QUALCOMM Incorporated

Inventor： Darryl Sheldon Jessie ,  Mina Iskander ,  Avantika Sodhi

IPC: H01Q21/00 ,  H01Q19/02

Abstract: A transmission line network is provided that includes a slow-wave transmission line to couple a first terminal to a first antenna. The transmission line network also includes a conventional transmission line to couple a second terminal to a second antenna.

公开(公告)号：US11139224B2

公开(公告)日：2021-10-05

申请号：US16704789

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi Zhang ,  Rajneesh Kumar ,  Li-Sheng Weng ,  Darryl Sheldon Jessie ,  Suhyung Hwang ,  Jeahyeong Han ,  Xiaoming Chen ,  Jaehyun Yeon

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L21/67 ,  H01L23/31

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

公开(公告)号：US20210028539A1

公开(公告)日：2021-01-28

申请号：US16520140

申请日：2019-07-23

Applicant: QUALCOMM Incorporated

Inventor： Hong Bok WE ,  Jaehyun Yeon ,  Suhyung Hwang ,  Darryl Sheldon Jessie

IPC: H01Q3/08 ,  H01Q3/01 ,  H01Q1/08

Abstract: Methods and apparatuses for enhancing antenna modules with flexible portion are presented. An apparatus includes an antenna module having a first portion, a first antenna on the first portion, a second portion, a second antenna on the second portion, and a flexible portion physically connecting the first portion and the second portion. The flexible portion is arrangeable such that the first antenna and the second antenna are oriented to receive radio frequency signals from different directions or to transmit the radio frequency signals to different directions. At least one radio frequency integrated circuit is on the first portion. The first antenna and the second antenna, via the flexible portion, share the radio frequency integrated circuit for radio frequency signal transmission or reception.