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公开(公告)号：US20170097003A1
公开(公告)日：2017-04-06
申请号：US14873472
申请日：2015-10-02
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Chi-Fu CHEN
CPC classification number: F04D25/08 , F04D19/002 , F04D25/166 , F04D27/00 , F04D27/004 , F04D27/007 , F04D29/522 , G06F1/20 , G06F1/206 , H05K7/20727 , H05K7/20736 , H05K7/20836 , Y02D10/16
Abstract: A server rack assembly having a housing configured to receive at least one server sled. A first fan associated with the housing, the first fan having a first size and a second fan having a second size. The first fan and the second fan are operated at different speeds to maintain a predetermined temperature in the server rack assembly.
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公开(公告)号：US20240049425A1
公开(公告)日：2024-02-08
申请号：US17816889
申请日：2022-08-02
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Yu-Hung WANG
CPC classification number: H05K7/20272 , H05K7/20254 , G01M3/40 , G06F1/206
Abstract: A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.
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公开(公告)号：US20230422426A1
公开(公告)日：2023-12-28
申请号：US17846776
申请日：2022-06-22
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Wei-Ju CHEN
CPC classification number: H05K7/20145 , H05K7/20409 , H05K7/2049 , H05K5/0213 , H05K5/0226 , H05K5/03
Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
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14.发明公开公开(公告)号：US20230354556A1
公开(公告)日：2023-11-02
申请号：US17730913
申请日：2022-04-27
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH , Kang HSU
CPC classification number: H05K7/20409 , G06F1/206 , H05K5/06
Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.
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公开(公告)号：US20230262937A1
公开(公告)日：2023-08-17
申请号：US17670113
申请日：2022-02-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH , Kang HSU
CPC classification number: H05K7/20409 , B23P15/26 , F28D21/00 , F28F3/02 , F28F21/084 , H05K7/20727 , B23P2700/10 , F28D2021/0029
Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.
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Patent Agency Ranking
公开(公告)号：US20220190921A1
公开(公告)日：2022-06-16
申请号：US17119430
申请日：2020-12-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG
Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
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公开(公告)号：US20220174845A1
公开(公告)日：2022-06-02
申请号：US17247149
申请日：2020-12-01
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Te-Chuan WANG
IPC: H05K7/20
Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
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公开(公告)号：US20190239394A1
公开(公告)日：2019-08-01
申请号：US16048745
申请日：2018-07-30
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Yueh-Chang WU , Jhih-Bin GUAN
CPC classification number: H05K7/20736 , G06F1/20 , G06F11/0766 , G06F11/2015 , G06F11/3003 , H05K7/1492 , H05K7/20909 , H05K7/20945
Abstract: A system and method to ensure the proper operation of a power supply unit in an electronic device. The electronic device has a chassis with a length and a width that includes one area having electronic components. A system fan is located in the chassis relative to the electronic components to generate air flow in the direction of the length of the chassis through the electronic components. A power supply unit is located in parallel to the system fan relative to the width of the chassis. The power supply unit includes an AC input, a DC output and an internal fan. A controller is operable to control the system fan to reduce the air flow when the power supply unit turns on AC power to the AC input, or wakes up from a cold redundant state and outputs DC power from the DC output.
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公开(公告)号：US20190235597A1
公开(公告)日：2019-08-01
申请号：US16047382
申请日：2018-07-27
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH
Abstract: Systems and methods are provided for controlling two or more PSUs of a server system. An exemplary method comprises first determining whether the PSUs are switched on to an AC power source. If the PSUs are found not switched on to an AC power source, the method further comprises restarting the AC power source for the PSUs and completing a software-based recovery process. If the PSUs are found to be switched on to an AC power source, the method further comprises determining whether the PSUs meet a predefined criterion. If the PSUs do meet a predefined criterion, the method further comprises disabling a cold-redundancy mode for the PSUs. If the PSUs do not meet a predefined criterion, the method further comprises starting a wake-up process for a first PSU from a cold-redundancy mode.
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公开(公告)号：US20240268059A1
公开(公告)日：2024-08-08
申请号：US18165849
申请日：2023-02-07
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20209
Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.
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