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公开(公告)号：US20100212434A1
公开(公告)日：2010-08-26
申请号：US12779657
申请日：2010-05-13
CPC分类号： G01L19/0023 , G01F1/363 , G01F1/48 , Y10T29/49002 , Y10T29/49826
摘要： A flow sensor apparatus that utilizes a pressure sensor with media isolated electrical connections. A cap can be attached to topside of the pressure sensor over a diaphragm to protect bond pads and wire bonds from a fluid media. A flow channel can be etched on the cap with an opening and exit on the sides of the cap so that liquid can flow through the flow channel. An inlet port and an outlet port can be attached to the channel's opening and exit to allow for fluid flow over the diaphragm. The flow channel creates a larger pressure over portions of the diaphragm that increases the deflection of the diaphragm, which increases an output signal of the pressure sensor. V-grooves can be created on two sides of the pressure sensor and in the cap to create the channel for the fluid in and out of the cap's cavity.
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12.发明申请公开(公告)号：US20100122580A1
公开(公告)日：2010-05-20
申请号：US12273912
申请日：2008-11-19
IPC分类号： G01L7/00
CPC分类号： G01L19/0023 , G01F1/363 , G01F1/48 , Y10T29/49002 , Y10T29/49826
摘要： A flow sensor apparatus that utilizes a pressure sensor with media isolated electrical connections. A cap can be attached to topside of the pressure sensor over a diaphragm to protect bond pads and wire bonds from a fluid media. A flow channel can be etched on the cap with an opening and exit on the sides of the cap so that liquid can flow through the flow channel. An inlet port and an outlet port can be attached to the channel's opening and exit to allow for fluid flow over the diaphragm. The flow channel creates a larger pressure over portions of the diaphragm that increases the deflection of the diaphragm, which increases an output signal of the pressure sensor. V-grooves can be created on two sides of the pressure sensor and in the cap to create the channel for the fluid in and out of the cap's cavity.
摘要翻译： 一种使用具有介质隔离电气连接的压力传感器的流量传感器装置。 盖可以通过隔膜连接到压力传感器的顶部，以保护接合垫和引线接合与流体介质。 可以在盖上蚀刻流动通道，其开口和出口在盖的侧面上，使得液体可以流过流动通道。 入口和出口可以连接到通道的开口和出口，以允许流体流过隔膜。 流动通道在膜片的部分上产生较大的压力，这增加了膜片的偏转，这增加了压力传感器的输出信号。 可以在压力传感器和盖子的两侧上形成V形槽，以形成流体进出盖体腔体的通道。
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13.发明授权公开(公告)号：US07626377B2
公开(公告)日：2009-12-01
申请号：US12032763
申请日：2008-02-18
申请人： Wayne T. Kilian , Gilberto Morales
发明人： Wayne T. Kilian , Gilberto Morales
IPC分类号： G01R15/20
CPC分类号： H01L29/82 , G01R33/07 , H01L27/22 , H01L43/065
摘要： A Hall-effect device with a merged and/or non-merged complementary structure in order to cancel stress induced offsets includes an n-type epitaxial Hall element and a p-type Hall element. The p-type Hall element can be implanted directly on top of the n-type epitaxial Hall element. The merged Hall elements can be biased in parallel to provide a zero-bias depletion layer throughout for isolation. The output of the p-type Hall element can be connected to the geometrically corresponding output of the n-type epitaxial Hall element through a suitable resistance. The output signal can be taken at the outputs of the n-type element. The Hall-effect device can be constructed utilizing standard processes.
摘要翻译： 具有合并和/或非合并互补结构以消除应力引起的偏移的霍尔效应器件包括n型外延霍尔元件和p型霍尔元件。 p型霍尔元件可以直接注入在n型外延霍尔元件的顶部。 合并的霍尔元件可以平行偏置，以提供整个零偏压耗尽层用于隔离。 p型霍尔元件的输出可以通过适当的电阻连接到n型外延霍尔元件的几何相应的输出。 输出信号可以在n型元件的输出处获取。 霍尔效应装置可以利用标准方法构建。
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公开(公告)号：US20090096040A1
公开(公告)日：2009-04-16
申请号：US11973966
申请日：2007-10-11
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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15.发明授权Small gauge pressure sensor using wafer bonding and electrochemical etch stopping 有权使用晶圆接合和电化学蚀刻停止的小型压力传感器公开(公告)号：US07493822B2
公开(公告)日：2009-02-24
申请号：US11825237
申请日：2007-07-05
IPC分类号： G01L9/06
CPC分类号： G01L9/0042 , G01L9/0054
摘要： A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
摘要翻译： 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸，然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度，或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。
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公开(公告)号：US07205622B2
公开(公告)日：2007-04-17
申请号：US11038881
申请日：2005-01-20
IPC分类号： H01L29/82
CPC分类号： H01L43/065 , G01R33/077
摘要： A vertical Hall effect apparatus, including methods thereof. A substrate layer can be provided upon which an epitaxial layer is formed. The epitaxial layer is surrounded vertically by one or more isolation layers. Additionally, an oxide layer can be formed above the epitaxial layer. A plurality of Hall effect elements can be formed within the epitaxial layer(s) and below the oxide layer, wherein the Hall effect elements sense the components of an arbitrary magnetic field in the plane of the wafer and perpendicular to the current flow in the hall element. A plurality of field plates can be formed above the oxide layer to control the inherited offset due to geometry control and processing of the vertical Hall effect apparatus, while preventing the formation of an output voltage of the vertical Hall effect apparatus at zero magnetic fields thereof.
摘要翻译： 一种垂直霍尔效应装置，包括其方法。 可以提供形成外延层的衬底层。 外延层被一个或多个隔离层垂直包围。 另外，可以在外延层的上方形成氧化物层。 多个霍尔效应元件可以形成在外延层内并在氧化物层的下面，其中霍尔效应元件感测晶片平面中任意磁场的分量，并垂直于霍尔电流中的电流 元件。 可以在氧化物层上方形成多个场板，以控制由于垂直霍尔效应装置的几何形状控制和处理而导致的遗传偏移，同时防止垂直霍尔效应装置的输出电压在其零磁场下形成。
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公开(公告)号：US06528340B2
公开(公告)日：2003-03-04
申请号：US09753834
申请日：2001-01-03
IPC分类号： H01L2100
CPC分类号： G01L9/0042 , G01L9/0055 , G01P2015/084
摘要： A method of forming a composite diaphragm for a pressure transducer is disclosed. The method comprises providing a substrate layer having a first conductivity type and a first surface. Positive implants are deposited in the first surface of the substrate layer, and an epitaxial layer is grown on the first surface of the substrate layer so that the positive implants form positive diffusions in the epitaxial layer. An oxide pattern is formed on the epitaxial layer, and a top layer is deposited over the epitaxial layer and oxide pattern. The substrate layer and positive diffusions of the epitaxial layer are then etched to form the composite diaphragm. The positive diffusions can be patterned so that the resulting etched structure has improved diaphragm performance characteristics. For example, the remaining pattern can include a plurality of bosses and interconnecting battens so that the diaphragm has a relatively high burst pressure and a high output signal with improved linearity at low pressures.
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公开(公告)号：US08082798B2
公开(公告)日：2011-12-27
申请号：US12857380
申请日：2010-08-16
IPC分类号： G01L1/00
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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公开(公告)号：US20110252882A1
公开(公告)日：2011-10-20
申请号：US12762797
申请日：2010-04-19
CPC分类号： G01F1/6845 , G01F15/14 , Y10T29/49002
摘要： A robust sensor, such as a robust flow sensor or pressure sensor, is provided. In one illustrative embodiment, a robust flow sensor includes one or more flow sensor components secured relative to a membrane, and a substrate for supporting the membrane. In some cases, the one or more flow sensor components may be substantially thermally isolated from the substrate by the membrane. One or more wire bond pads may be situated adjacent to a first side of the substrate and may be provided for communicating signals relative to the one or more flow sensor components. A top cap may be situated adjacent to the first side of the substrate and secured relative to the substrate. The top cap may define at least part of a fluid inlet and/or an outlet of the flow sensor assembly, and may at least partially define a flow channel that extends from the inlet, past at least one of the one or more flow sensor components, and out the outlet of the flow sensor assembly. The top cap may be structured and attached relative to the first side of the substrate such that the one or more wire bond pads are not exposed to a fluid in the flow channel, but are accessible for electrical connection to an external device. While a flow sensor is used as an example, it is contemplated that any suitable sensor may be used, as desired.
摘要翻译： 提供鲁棒的传感器，例如鲁棒的流量传感器或压力传感器。 在一个说明性实施例中，坚固的流量传感器包括相对于膜固定的一个或多个流量传感器部件和用于支撑膜的基板。 在一些情况下，一个或多个流量传感器组件可以通过膜与衬底基本上热隔离。 一个或多个引线接合焊盘可以位于与衬底的第一侧相邻的位置，并且可被设置用于相对于一个或多个流量传感器部件传送信号。 顶盖可以位于邻近衬底的第一侧并相对于衬底固定。 顶盖可以限定流量传感器组件的流体入口和/或出口的至少一部分，并且可以至少部分地限定从入口延伸通过一个或多个流量传感器部件中的至少一个的流动通道 ，并从流量传感器组件的出口排出。 顶盖可以相对于基板的第一侧被构造和附接，使得一个或多个引线接合焊盘不暴露于流动通道中的流体，而是可访问以用于与外部设备的电连接。 虽然使用流量传感器作为示例，但是可以设想，可以根据需要使用任何合适的传感器。
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公开(公告)号：US20100301435A1
公开(公告)日：2010-12-02
申请号：US12857380
申请日：2010-08-16
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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