公开(公告)号：US10794928B2

公开(公告)日：2020-10-06

申请号：US15975294

申请日：2018-05-09

Applicant: Robert Bosch GmbH

Inventor： Benny Pekka Herzogenrath ,  Denis Gugel ,  Rolf Scheben ,  Rudy Eid

IPC: G01P15/08 ,  B81B3/00

Abstract: A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.

公开(公告)号：US10753742B2

公开(公告)日：2020-08-25

申请号：US15767271

申请日：2016-11-09

Applicant: Robert Bosch GmbH

Inventor： Reinhard Neul ,  Torsten Ohms ,  Robert Maul ,  Mirko Hattass ,  Christian Hoeppner ,  Odd-Axel Pruetz ,  Benjamin Schmidt ,  Rolf Scheben ,  Friedjof Heuck

IPC: G01C19/5747 ,  G01C19/5712

Abstract: A micromechanical rate-of-rotation sensor includes a first Coriolis element. The micromechanical rate-of-rotation sensor further includes a first drive beam arranged along the first Coriolis element. The first drive beam is coupled via a first spring to the first Coriolis element. The micromechanical rate-of-rotation sensor further includes a first drive electrode carrier extending from the first drive beam in a direction opposite to the first Coriolis element. The first drive electrode carrier is configured to carry a multiplicity of first drive electrodes extending parallel to the first drive beam.

公开(公告)号：US09571938B2

公开(公告)日：2017-02-14

申请号：US14558993

申请日：2014-12-03

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Rolf Scheben ,  Ricardo Ehrenpfordt

IPC: H04R23/00 ,  H04R19/00 ,  B81B3/00 ,  H04R19/04 ,  H04R29/00

CPC classification number: H04R19/005 ,  B81B3/0018 ,  B81B3/0021 ,  B81B2201/0221 ,  B81B2201/0257 ,  B81B2201/0285 ,  H04R19/04 ,  H04R29/004

Abstract: A capacitive MEMS microphone element is described which may be used optionally for detecting acoustic signals (microphone mode) or for detecting ultrasound signals in a defined frequency range (ultrasound mode). In the layered structure of the MEMS microphone element, at least two carrier elements for the two electrode sides of a capacitor system are formed one above the other and at a distance from one another for signal detection. At least one of the two carrier elements is sound pressure-sensitive and at least one of the two electrode sides includes at least two electrode segments which are electrically contactable independent of one another, which together with the at least one electrode of the other electrode side form partial capacitances which are independent of one another.

Abstract translation: 描述了可以可选地用于检测声信号（麦克风模式）或用于在限定的频率范围（超声模式）中检测超声信号的电容式MEMS麦克风元件。 在MEMS麦克风元件的分层结构中，用于电容器系统的两个电极侧的至少两个载体元件彼此之间并且彼此间隔一定距离地形成用于信号检测。 两个载体元件中的至少一个是声压敏的，并且两个电极侧中的至少一个包括彼此独立地电接触的至少两个电极段，这两个电极段与另一个电极侧的至少一个电极 形成彼此独立的部分电容。

公开(公告)号：US20170026754A1

公开(公告)日：2017-01-26

申请号：US15211137

申请日：2016-07-15

Applicant: Robert Bosch GmbH

Inventor： Thomas Buck ,  Fabian Purkl ,  Michael Stumber ,  Ricardo Ehrenpfordt ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: H04R7/14 ,  H04R17/02 ,  H04R7/18

CPC classification number: H04R7/14 ,  B81B3/0072 ,  H04R7/18 ,  H04R17/02 ,  H04R19/005 ,  H04R19/04 ,  H04R23/006 ,  H04R31/006 ,  H04R2201/003

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract translation: 对于MEMS部件，在形成有至少一个声压敏膜片元件的层结构中，跨越层结构中的开口或空腔，并借助于至少一个压敏电路检测其偏转 在隔膜元件的附接区域中设置元件，设计措施可以在隔膜元件偏转的情况下有意地影响隔膜表面上的应力分布。 特别地，提供了将机械应力有意地引入隔膜元件的预定区域中的措施，从而放大测量信号。 为此，隔膜元件包括至少一个指定的弯曲区域，其由隔膜元件的结构限定，并且在相邻的隔膜部分发生声音作用的情况下更强烈地变形。

公开(公告)号：US20160356599A1

公开(公告)日：2016-12-08

申请号：US15116924

申请日：2015-01-21

Applicant: ROBERT BOSCH GMBH

Inventor： Robert Maul ,  Mirko Hattass ,  Rolf Scheben

IPC: G01C19/574

CPC classification number: G01C19/574 ,  G01C19/5719 ,  G01C19/5747

Abstract: A sensor drive includes at least one first seismic mass and an operating apparatus. The operating apparatus is configured to put the first seismic mass into oscillatory motion such that (i) a projection of the oscillatory motion of the first seismic mass onto a first spatial direction is a first harmonic oscillation of the first seismic mass at a first frequency, and (ii) a projection of the oscillatory motion of the first seismic mass onto a second spatial direction oriented at an angle to the first spatial direction is a second harmonic oscillation of the first seismic mass at a second frequency not equal to the first frequency. A method includes operating such a sensor device having at least one seismic mass.

Abstract translation: 传感器驱动器包括至少一个第一抗震块和操作装置。 操作装置被配置为将第一地震质量块放入振荡运动中，使得（i）第一地震质量块的振荡运动在第一空间方向上的投影是第一频率处的第一地震质量的一次谐波振荡， 以及（ii）将所述第一地震质量体的振荡运动投影到与第一空间方向成一定角度的第二空间方向上，是以不等于第一频率的第二频率的第一地震质量的二次谐波振荡。 一种方法包括操作具有至少一个地震质量的这种传感器装置。

公开(公告)号：US20160138666A1

公开(公告)日：2016-05-19

申请号：US14924135

申请日：2015-10-27

Applicant: Robert Bosch GmbH

Inventor： Christian HOEPPNER ,  Benjamin Schmidt ,  Mirko Hattass ,  Odd-Axel Pruetz ,  Robert Maul ,  Friedjof Heuck ,  Rolf Scheben ,  Torsten Ohms ,  Reinhard Neul

IPC: F16F1/02 ,  G01C19/56

CPC classification number: G01C19/56 ,  B81B2203/0163 ,  B81B2203/019 ,  B81C1/0019 ,  G01C19/5733

Abstract: A micromechanical spring for an inertial sensor, including segments of a monocrystalline base material, the segments having surfaces which are situated at a right angle to one another with respect to a plane of oscillation of the spring and normal to the plane of oscillation of the spring, the segments being manufactured in a crystal-direction-dependent etching process and each having two different orientations normal to the plane of oscillation, in which the spring includes a defined number of segments situated in a defined manner.

Abstract translation: 一种用于惯性传感器的微机械弹簧，包括单晶基材的段，所述段具有相对于弹簧的振荡平面彼此成直角的表面，并垂直于弹簧的摆动平面 ，所述片段以晶体方向依赖的蚀刻工艺制造，并且每个具有垂直于振荡平面的两个不同的取向，其中弹簧包括以限定的方式定位的限定数量的片段。

公开(公告)号：US12241743B2

公开(公告)日：2025-03-04

申请号：US18060052

申请日：2022-11-30

Applicant: Robert Bosch GmbH

Inventor： Alexander Tsapkolenko ,  Hartmut Ruf ,  Mirko Hofmann ,  Rolf Scheben

IPC: G01C19/5712 ,  G01C19/5776 ,  G01P15/08 ,  G01P15/18

Abstract: A sensor system. The sensor system includes a rotation rate sensor and a control unit, the rotation rate sensor including a seismic mass and being configured to drive a movement of the seismic mass with the aid of a driving force, the control unit being configured to detect a free fall of the sensor system and to deactivate the driving force in the event of a detection of the free fall. A method for securing a sensor system, in a detection step a free fall of the sensor system being detected by the control unit, and in a securing step the driving force being deactivated by the control unit, is also described.

公开(公告)号：US20180334381A1

公开(公告)日：2018-11-22

申请号：US15975294

申请日：2018-05-09

Applicant: Robert Bosch GmbH

Inventor： Benny Pekka Herzogenrath ,  Denis Gugel ,  Rolf Scheben ,  Rudy Eid

IPC: B81B7/02 ,  B81B7/00 ,  G01P15/08

Abstract: A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.

公开(公告)号：US10035696B2

公开(公告)日：2018-07-31

申请号：US15214193

申请日：2016-07-19

Applicant: Robert Bosch GmbH

Inventor： Fabian Purkl ,  Michael Stumber ,  Ricardo Ehrenpfordt ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: B81B3/00 ,  H04R17/02

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  H04R17/02 ,  H04R2201/003

Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

公开(公告)号：US09945669B2

公开(公告)日：2018-04-17

申请号：US14890559

申请日：2014-05-05

Applicant: Robert Bosch GmbH

Inventor： Thorsten Balslink ,  Rolf Scheben ,  Benjamin Schmidt ,  Ralf Ameling ,  Mirko Hattass ,  Burkhard Kuhlmann ,  Robert Maul

IPC: G01C19/00 ,  G01P3/44 ,  G01P9/00 ,  G01P15/08 ,  G01C19/5712

CPC classification number: G01C19/5712

Abstract: A rotation rate sensor for detecting a rotational movement of the rotation rate sensor about a rotational axis extending within a drive plane of the rotation rate sensor include: a first rotational element, a second rotational element and a drive structure moveable in parallel to the drive plane, the first rotational element being drivable about a first center of rotation to achieve a first rotational vibration in parallel to the drive plane, the second rotational element being drivable about a second center of rotation to achieve a second rotational vibration in parallel to the drive plane, the drive structure being (i) coupled to the first and second rotational elements, and (ii) configured to generate a drive mode in phase opposition of the first and second rotational vibrations.