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    COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME
    11.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME 有权
    复合电子元件和安装板的板

    公开(公告)号：US20150109074A1

    公开(公告)日：2015-04-23

    申请号：US14315110

    申请日：2014-06-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Jin Woo HAHN ,  Joon Hwan KWAG ,  Kyoung No LEE ,  Myeong Gi KIM ,  Hwan Soo LEE

    IPC: H03H7/01

    CPC classification number: H03H7/0115 ,  H03H2001/0085

    Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.

    Abstract translation: 复合电子部件可以包括：复合体，包括由多个电介质层和第一和第二内部电极层叠的陶瓷体形成的电容器和由包括线圈的磁体形成的电感器; 输入端子，设置在复合体的第一端面上; 输出端子，包括设置在复合体的第二端面上的第一输出端子和设置在复合体的第二端面上的第二输出端子; 以及设置在所述复合体的电容器的上表面和下表面的一个或多个以及第一端面上的接地端子。 电容器与电感器相邻。

    INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
    12.
    发明申请
    INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电感元件及其制造方法

    公开(公告)号：US20150048920A1

    公开(公告)日：2015-02-19

    申请号：US14459963

    申请日：2014-08-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo LEE ,  Hye Yeon CHA ,  Young Sik CHOI ,  Sung Kwon WI

    IPC: H01F27/24 ,  C25D7/00 ,  H01F41/02 ,  C25D5/02

    CPC classification number: C25D7/00 ,  C25D5/022 ,  H01F17/0006 ,  H01F41/041

    Abstract: Disclosed herein is an inductor element having an internal electrode in which a first plating layer and a second plating layer having a coil shape are embedded, the inductor element including: a first plating layer formed on a support member; an insulating layer covering the first plating layer and provided with an opening which exposes an upper surface of the first plating layer; and a second plating layer filled in the opening, whereby the inductor element in which the internal electrode having a high aspect ratio is embedded is implemented.

    Abstract translation: 本发明公开了一种具有内部电极的电感器元件，其中嵌入有第一镀层和第二镀层，所述电感元件包括：形成在支撑构件上的第一镀层; 绝缘层，覆盖所述第一镀层并设置有露出所述第一镀层的上表面的开口; 以及填充在开口中的第二镀层，由此实现其中嵌入有高纵横比的内部电极的电感器元件。

    CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    13.
    发明申请
    CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    芯片电子元件及其制造方法

    公开(公告)号：US20150028983A1

    公开(公告)日：2015-01-29

    申请号：US14261988

    申请日：2014-04-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Han Wool RYU ,  Gwang Hwan HWANG ,  Kwi Jong LEE ,  Hwan Soo LEE ,  Hang Kyu CHO

    IPC: H01F27/255 ,  H01F27/28 ,  H01F41/02 ,  H01F27/29

    CPC classification number: H01F1/15308 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  Y10T29/49155

    Abstract: A magnetic paste composition for a chip electronic component, a chip electronic component, and a manufacturing method therof are provided. The chip electronic component is capable of being manufactured in a thin-film to allow for thinness and miniaturization thereof, thereby preventing a deterioration in efficiency thereof due to core loss even under high frequency and high current conditions. The chip electronic component exhibits high permeability, high efficiency, and a high Isat value by decreasing porosity.

    Abstract translation: 提供了一种用于芯片电子部件的磁性糊剂组合物，芯片电子部件和制造方法。 芯片电子部件能够以薄膜制造以允许其薄型化和小型化，从而即使在高频和高电流条件下也能防止由于铁损而导致的效率的劣化。 芯片电子元件通过降低孔隙率表现出高渗透性，高效率和高Isat值。

    POWER INDUCTOR AND METHOD OF MANUFACTURING THE SAME
    14.
    发明申请
    POWER INDUCTOR AND METHOD OF MANUFACTURING THE SAME 有权
    功率电感器及其制造方法

    公开(公告)号：US20140184374A1

    公开(公告)日：2014-07-03

    申请号：US13843740

    申请日：2013-03-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Moon Soo PARK ,  Hwan Soo LEE ,  Hye Yeon CHA

    IPC: H01F27/255 ,  H01F41/00

    CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/048 ,  Y10T29/4902

    Abstract: There is provided a power inductor, including a magnetic body including a substrate having coils formed thereon, a first metal-polymer complex layer formed on upper and lower surfaces of the substrate, and a second metal-polymer complex layer formed on upper and lower surfaces of the first metal-polymer complex layer and including a higher content of a polymer than that included in the first metal-polymer layer.

    Abstract translation: 提供了一种功率电感器，包括：磁体，包括其上形成有线圈的基板;形成在基板的上表面和下表面上的第一金属 - 聚合物复合层;以及形成在上表面和下表面上的第二金属 - 聚合物复合层 的第一金属 - 聚合物复合层并且包含比包含在第一金属 - 聚合物层中的聚合物更高的含量。

    COIL COMPONENT
    16.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20220351883A1

    公开(公告)日：2022-11-03

    申请号：US17866976

    申请日：2022-07-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo LEE ,  Yoon Hee CHO ,  Sung Min SONG

    IPC: H01F1/14 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F41/02 ,  H01F27/255 ,  H01F27/30

    Abstract: A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.

    COIL COMPONENT
    17.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20200279687A1

    公开(公告)日：2020-09-03

    申请号：US16402520

    申请日：2019-05-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Gun Woo KOO ,  Sung Min SONG ,  Hwan Soo LEE ,  Hwi Dae KIM

    IPC: H01F27/29 ,  H01F27/28 ,  H01F27/32 ,  H01F41/12 ,  H01F41/04

    Abstract: A coil component includes a body, an internal insulating layer disposed in the body, and a coil portion disposed on the internal insulating layer. The coil portion includes first and second coil patterns disposed on opposing surfaces of the internal insulating layer, respectively, first main and first auxiliary lead-out portions extending from the first coil pattern and respectively exposed to a front surface and one side surface of the body connected to each other, and second main and second auxiliary lead-out portions extending from the second coil pattern and respectively exposed to a rear surface and another side surface of the body connected to each other.

    INDUCTOR
    18.
    发明申请
    INDUCTOR 审中-公开

    公开(公告)号：US20190333688A1

    公开(公告)日：2019-10-31

    申请号：US16179575

    申请日：2018-11-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Min SONG ,  Hwan Soo LEE ,  Yoon Hee CHO ,  Yong Choon PARK

    IPC: H01F27/29 ,  H01F17/00 ,  H01F27/32 ,  H01F27/28

    Abstract: An inductor includes a body including a support member including a through-hole, an internal coil disposed on the support member, and an encapsulant encapsulating the support member and the internal coil; and an external electrode disposed on an external surface of the body and connected to the internal coil. The external electrode includes a conductive resin layer and a double conductive layer of a first conductive layer and a second conductive layer, disposed between the conductive resin layer and the internal coil.

    INDUCTOR
    19.
    发明申请
    INDUCTOR 审中-公开

    公开(公告)号：US20190244742A1

    公开(公告)日：2019-08-08

    申请号：US16114944

    申请日：2018-08-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Min SONG ,  Yoon Hee CHO ,  Hwan Soo LEE

    IPC: H01F27/28 ,  H01F17/00 ,  H01F27/32 ,  H01F27/255

    CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/324 ,  H01F2017/048 ,  H01F2027/2809

    Abstract: An inductor includes first and second external electrodes spaced apart from each other, a substrate disposed between the first and second external electrodes and having a first surface and a second surface opposing each other, and a conductive structure electrically connected to the first and second external electrodes. The conductive structure includes a first conductive pattern disposed on the first surface of the substrate, a second conductive pattern disposed on the second surface of the substrate, and at least one reinforcing portion. The first conductive pattern has a first side facing the first external electrode, the second conductive pattern has a second side facing the second external electrode, and the at least one reinforcing portion is electrically connected to at least one of the first and second sides and is interposed between the substrate and at least one of the first and second external electrodes.

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