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公开(公告)号：US11502710B2
公开(公告)日：2022-11-15
申请号：US16933054
申请日：2020-07-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Kang Ta Jo , Seong Jong Cheon , Se Jong Kim , Ho Taek Song , Jang Ho Park , Yoo Sam Na , Jae Hyouck Choi , Young Sik Hur
Abstract: A front-end module includes: a substrate including a first connection member in which at least one first insulating layer and at least one first wiring layer are alternately stacked, a second connection member in which at least one second insulating layer and at least one second wiring layer are alternately stacked, and a core member disposed between the first and second connection members; a radio-frequency component mounted on a surface of the substrate and configured to amplify a main band of an input RF signal or filter bands outside the main band; an inductor disposed on a surface of the core member and electrically connected to the radio-frequency component; and a ground plane disposed on another surface of the core member. The core member includes a core insulating layer thicker than an insulating layer among at least one first insulating layer and the at least one second insulating layer.
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公开(公告)号：US11335991B2
公开(公告)日：2022-05-17
申请号：US16937981
申请日：2020-07-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu Kim , Young Sik Hur , Yoo Sam Na , Won Gi Kim , Young Bal Kim , Soo Ki Choi , Ho Kyung Kang , Young Kyoon Im , Seong Jong Cheon
Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.
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公开(公告)号：US10171114B2
公开(公告)日：2019-01-01
申请号：US15678444
申请日：2017-08-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seong Jong Cheon , Sung Jae Yoon , Hyun Jin Yoo , Se Jong Kim
Abstract: A radio frequency switch apparatus includes switching circuits connected between respective signal terminals and an antenna terminal. Each of the switching circuits includes a series switching circuit and a shunt switching circuit configured to switch a signal band on and off. An inductor circuit includes an inductor device connected between at least one shunt switching circuit of the switching circuits and a ground. The inductor device suppresses noise and passes the signal band by being resonant with a capacitance present upon the shunt switching circuit being turned off.
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公开(公告)号：US10044341B2
公开(公告)日：2018-08-07
申请号：US15390849
申请日：2016-12-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yoo Sam Na , Jong Mo Lim , Yoo Hwan Kim , Hyun Hwan Yoo , Hyun Jin Yoo , Seong Jong Cheon
Abstract: A radio frequency switch circuit is described including a radio frequency switch and a coupler. The radio frequency switch includes a first band switch circuit connected between a first signal port and a common port, and configured to switch a first band signal. The coupler includes a first coupling wiring, disposed adjacent to a signal wiring formed between the common port of the radio frequency switch and an antenna port, and configured to form a first coupling signal with the signal wiring. A resonant frequency of the first coupling wiring is based on an inductance of the first coupling wiring and a capacitance of the radio frequency switch.
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公开(公告)号：US11658393B2
公开(公告)日：2023-05-23
申请号：US17354425
申请日：2021-06-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu Kim , Young Sik Hur , Yoo Sam Na , Won Gi Kim , Young Bal Kim , Soo Ki Choi , Ho Kyung Kang , Young Kyoon Im , Seong Jong Cheon
CPC classification number: H01Q1/2283 , H01Q1/085 , H01Q21/28 , H04B1/04 , H04B1/16
Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.
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Patent Agency Ranking
公开(公告)号：US11387556B2
公开(公告)日：2022-07-12
申请号：US16670636
申请日：2019-10-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kang Ta Jo , Seong Jong Cheon
Abstract: A frontend module includes an antenna terminal, and a duplexer including a first filter connected to the antenna terminal and a first terminal, configured to perform cellular communications within a 3.3 GHz to 4.2 GHz band, and a second filter connected to the antenna terminal and a second terminal, configured to perform Wi-Fi communications within a 5.15 GHz to 5.950 GHz band, wherein each of the first filter and the second filter includes an LC filter, and a portion of an operating time period of the first filter overlaps a portion of an operating time period of the second filter.
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公开(公告)号：US11159147B2
公开(公告)日：2021-10-26
申请号：US16655282
申请日：2019-10-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Kang Ta Jo , Seong Jong Cheon
IPC: H01Q5/00 , H03H11/34 , H03H7/01 , H03H9/54 , H01Q1/24 , H03H11/28 , H01Q1/22 , H01Q5/335 , H03H11/24
Abstract: A front end module includes: a first antenna terminal; a second antenna terminal; a switch including a plurality of first side terminals on a first side and a plurality of second side terminals on a side opposite to the first side, each of the first side terminals being connected to one of the first antenna terminal and the second antenna terminal; a first filter connected to the first antenna terminal; a second filter connected to the first antenna terminal; a third filter connected to one of the second side terminals; and a fourth filter connected to one of the second side terminals. The third filter and the fourth filter are connected to one of the first antenna terminal and the second antenna terminal.
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公开(公告)号：US10951195B2
公开(公告)日：2021-03-16
申请号：US16520385
申请日：2019-07-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Seong Jong Cheon , Jeong Hae Kim
Abstract: An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.
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公开(公告)号：US10931254B2
公开(公告)日：2021-02-23
申请号：US16434473
申请日：2019-06-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seong Jong Cheon , Hyung Jin Lee , Jeong Hae Kim
Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.
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公开(公告)号：US10217711B2
公开(公告)日：2019-02-26
申请号：US15789070
申请日：2017-10-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Jae Yoon , Seong Jong Cheon
IPC: H01L21/56 , H01L23/31 , H01L23/433 , H01L23/498 , H01L23/552 , H01L25/065
Abstract: A semiconductor package includes a ground electrode formed on an upper surface of a substrate, a first electronic component disposed on the upper surface of the substrate, a sealing member sealing the electronic component, and a shielding member surrounding the first electronic component and disposed in the sealing member.
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