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公开(公告)号：US20150027627A1
公开(公告)日：2015-01-29
申请号：US14513421
申请日：2014-10-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
CPC classification number: H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
Abstract translation: 一种刚性柔性印刷电路板的制造方法，其特征在于，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。
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12.发明申请公开(公告)号：US20140021164A1
公开(公告)日：2014-01-23
申请号：US14031779
申请日：2013-09-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE , Dek Gin YANG , Dong Gi AN , Jae Ho SHIN
IPC: H05K3/06
Abstract: A method for manufacturing a multilayer rigid flexible printed circuit board that includes a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.
Abstract translation: 一种多层刚性柔性印刷电路板的制造方法，其特征在于，包括具有在其一面或两面上形成有电路图案的柔性膜的柔性区域和形成在所述电路图案上的激光阻挡层。 以及刚性区域，其形成在柔性区域附近并且在延伸部分的一个或两个表面上包括延伸到柔性区域的柔性膜的两侧的多个图案层。
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公开(公告)号：US20220190479A1
公开(公告)日：2022-06-16
申请号：US17208139
申请日：2021-03-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE , Chang Gun OH , Hyun Kyung PARK , Je Sang PARK , Sang Ho JEONG , Yong Duk LEE
Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.
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Patent Agency Ranking
公开(公告)号：US20180376584A1
公开(公告)日：2018-12-27
申请号：US16118558
申请日：2018-08-31
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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15.发明申请公开(公告)号：US20170118833A1
公开(公告)日：2017-04-27
申请号：US15398803
申请日：2017-01-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE , Dek Gin YANG , Dong Gi AN , Jae Ho SHIN
CPC classification number: H05K3/06 , H05K1/0218 , H05K1/0278 , H05K1/028 , H05K1/09 , H05K3/0035 , H05K3/281 , H05K3/386 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/0707 , H05K2203/0554 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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16.发明申请公开(公告)号：US20140345911A1
公开(公告)日：2014-11-27
申请号：US14282490
申请日：2014-05-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE , Jee Hoon Kim , Jae Ho Shin , Hyung Ju Cho
CPC classification number: H05K3/4691 , Y10T156/10
Abstract: A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
Abstract translation: 具有刚性区域和柔性区域的刚性柔性印刷电路板在一个实施例中包括：基底衬底，其包括刚性区域中的一部分和柔性区域中的一部分; 覆盖层，形成在基底基板上; 形成在所述覆盖层上并形成在所述刚性区域中的第一绝缘层; 形成在所述第一绝缘层上的第二绝缘层; 以及形成在第二绝缘层上的外层电路层。 还描述了制造具有刚性区域和柔性区域的刚性柔性印刷电路板的方法。
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公开(公告)号：US20140124475A1
公开(公告)日：2014-05-08
申请号：US13827241
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE
IPC: H05K3/00
CPC classification number: H05K3/0097 , H05K3/0035 , H05K3/0047 , H05K3/421 , H05K2201/09509 , H05K2203/1536 , H05K2203/1545
Abstract: The present invention relates to a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board including: preparing two copper clad laminates, each consisting of an insulating layer and copper foil layers laminated on upper and lower surfaces of the insulating layer; bonding the two copper clad laminates after disposing the lower copper foil layers of the copper clad laminates to face each other; processing a via hole passing through the upper copper foil layer and the insulating layer of each copper clad laminate; fill-plating a via electrode inside the via hole and forming a circuit layer on an outer layer of the copper clad laminate; separating the bonded copper clad laminates; and patterning the lower copper foil layer of the separated copper clad laminate is provided.
Abstract translation: 本发明涉及印刷电路板的制造方法。 一种制造印刷电路板的方法，包括：制备两层铜箔层压板，每层覆盖层叠在绝缘层的上表面和下表面上的绝缘层和铜箔层; 在将覆铜层压板的下铜箔层布置成彼此面对之后，将两个覆铜层压板接合; 加工穿过上铜箔层的通孔和每个覆铜层压板的绝缘层; 在通孔内填充通孔电极并在覆铜层压板的外层上形成电路层; 分离粘合的铜包覆层压板; 并且提供分离的覆铜层压板的下铜箔层的图案化。
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公开(公告)号：US20130220535A1
公开(公告)日：2013-08-29
申请号：US13771834
申请日：2013-02-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
IPC: H05K3/00
CPC classification number: H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
Abstract: The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
Abstract translation: 本发明涉及制造刚柔柔性印刷电路板的方法，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。
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