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公开(公告)号:US11125931B2
公开(公告)日:2021-09-21
申请号:US16757221
申请日:2018-10-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin Hyun Cho , Go Hyun Kim , Heongseog Lee , Hyun Jun Jung , Jong Hee Han
Abstract: The present disclosure relates to a display apparatus including a display panel, a light guide panel disposed in the rear of the display panel, a light source disposed adjacent to a side surface of the light guide panel, a quantum dot conversion member disposed to be inclined with respect to the light source, including quantum dot particles, and configured to convert properties of light emitted from the light source, and a transparent member including a first surface facing the light source, a second surface facing the quantum dot conversion member, and a third surface disposed adjacent to the side surface of the light guide panel, wherein the transparent member is configured to transmit at least one part of the light incident on the third surface to the side surface of the light guide panel and reflect the other part of the light to the inside thereof.
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公开(公告)号:US10100164B2
公开(公告)日:2018-10-16
申请号:US14530208
申请日:2014-10-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seo Joon Lee , Jin Sub Kim , Hyong Jun Yoo , Min Chul Jung , Jin Hyun Cho
Abstract: A manufacturing method that forms a multilayer thin film on the inner surface of a housing forming a transparent appearance of an electronic product to provide a deep metal texture and an electronic product having a metal texture provided at the inner surface of the housing. The multilayer thin film manufacturing method includes reforming an inner surface of a housing having an outer surface and the inner surface through plasma processing, depositing at least one hardness reinforcement layer on the inner surface, and depositing a color layer on the hardness reinforcement layer.
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公开(公告)号:US20180238643A1
公开(公告)日:2018-08-23
申请号:US15437231
申请日:2017-02-20
Applicant: IBT Co., Ltd. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sang Koo Park , Jin Hyun Cho
CPC classification number: B23P15/26 , F28D15/0233 , F28D15/0283 , F28D15/04
Abstract: Disclosed herein is an outdoor plate-type vacuum heat transfer apparatus. This apparatus is configured by sequentially layering an inorganic sheet 320, a mesh member 330, and a support frame 340 in a slim internal space of a plate-type container defined by first and second plates 310 and 350. A small amount of heat transfer medium is inserted into the internal space in a vacuum state.
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14.
公开(公告)号:US09999139B2
公开(公告)日:2018-06-12
申请号:US14972530
申请日:2015-12-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin Hyun Cho , Hyong Jun Yoo , Seo Joon Lee , Min Chul Jung , Hyun Jun Jung
IPC: H05K3/46 , C23C14/34 , H05K3/00 , C23C14/00 , C23C14/06 , C23C14/08 , C23C14/20 , C23C14/35 , C23C28/00 , H04M1/02
CPC classification number: H05K3/46 , C23C14/0015 , C23C14/0042 , C23C14/0641 , C23C14/08 , C23C14/205 , C23C14/34 , C23C14/352 , C23C28/322 , C23C28/34 , C23C28/345 , H04M1/0283 , H05K3/0041 , H05K2203/085 , H05K2203/095
Abstract: A multilayer thin film and a method of depositing a multilayer thin film on a surface of a product is provided. The multilayer thin film includes a first layer including a non-conductive material coupled to an object, a second layer including a metallic material coupled to the first layer, and a third layer including a non-conductive material coupled to the second layer.
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公开(公告)号:US09417494B2
公开(公告)日:2016-08-16
申请号:US13724702
申请日:2012-12-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung Kyun Kim , Sung Ki Kim , Sru Kim , Jin Sub Kim , Jun Seok An , Kye Hoon Lee , Heong Seog Lee , Jin Hyun Cho
IPC: G09F13/04 , G09F13/08 , G02F1/1345 , G06F1/32 , F21V29/00 , H05K7/20 , G02F1/1335 , G02F1/1333
CPC classification number: G02F1/13452 , F21V29/50 , G02F1/133385 , G02F1/1336 , G02F1/133603 , G02F1/133608 , G02F2001/133628 , G06F1/32 , G09F13/04 , G09F13/0413 , H05K7/20963
Abstract: A display module including a backlight to more effectively dissipate heat generated at light emitting diodes (LEDs) and heat dissipation units to effectively dissipate heat generated at driver chips and prevent movement of the driver chips by attaching porous fillers to the heat dissipation units, and a display apparatus having the same are provided. The display module includes a display panel, a backlight disposed on a rear side of the display panel and including a plurality of printed circuit boards, a bottom chassis adapted to accommodate the backlight unit and provided with a plurality of seating grooves, a driving printed circuit board, a plurality of flexible printed circuit films which electrically connect the display panel and the driving printed circuit board, at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit and provided with a porous filler.
Abstract translation: 一种显示模块,包括背光,以更有效地散发在发光二极管(LED)和散热单元处产生的热量,以有效地散发在驱动器芯片处产生的热量,并通过将多孔填料附着到散热单元来防止驱动器芯片的移动,以及 提供具有该显示装置的显示装置。 显示模块包括显示面板,设置在显示面板的后侧的背光,并且包括多个印刷电路板,适于容纳背光单元并具有多个安置槽的底部底座,驱动印刷电路 多个柔性印刷电路膜,其将显示面板和驱动印刷电路板电连接,至少一个散热器,设置在相应的柔性印刷电路的相对表面上并设置有多孔填料。
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公开(公告)号:US09992908B2
公开(公告)日:2018-06-05
申请号:US14988098
申请日:2016-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Joon Kang , Jin Hyun Cho , Jung Kyun Kim , Jin Soo Pyo
IPC: H05K7/20 , G02F1/1333
CPC classification number: H05K7/20154 , G02F1/133385 , G02F2201/36
Abstract: Provided is a display apparatus including: a case having an inlet; and an outlet; a display module disposed in the case and including a display panel configured to display an image; and a heat exchange device configured to receive heat from the display module and including: a first portion provided in a first cooling passage, air in the first passage moving over the display module; and a second portion provided in a second cooling passage, air in the second cooling passage moving over the heat exchange device, wherein heat generated from the display module is transferred to the first portion via the air in the first cooling passage, wherein the heat transferred to the first portion is transferred to the second portion, and wherein the air suctioned through the inlet is heat-exchanged in the second cooling passage with the second portion and discharged through the outlet.
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公开(公告)号:US09845535B2
公开(公告)日:2017-12-19
申请号:US14291652
申请日:2014-05-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin Sub Kim , Hyong Jun Yoo , Min Chul Jung , Hyun Jun Jung , Jin Hyun Cho
CPC classification number: C23C28/34 , C23C14/0015 , C23C14/3485 , C23C28/00 , C23C28/322 , C23C30/005 , Y10T428/264 , Y10T428/31522 , Y10T428/31544 , Y10T428/31678 , Y10T428/31681 , Y10T428/31699
Abstract: Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.
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