公开(公告)号：US20240319592A1

公开(公告)日：2024-09-26

申请号：US18491310

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changheon LEE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Mijeong KIM ,  Sunyoung LEE ,  Kyuhyun IM ,  Jinwon JEON ,  Jungha CHAE ,  Sunghyun HAN

IPC: G03F7/004 ,  G03F7/038

CPC classification number: G03F7/0042 ,  G03F7/0048 ,  G03F7/0382

Abstract: Provided are a resist composition and a method of forming a pattern using the same, wherein the resist composition may include an organometallic compound represented by Formula 1 below, and a polymer including a repeating unit represented by Formula 2 below.




For a description of M11, R11, R12, n, A21, L21 to L23, A21 to a23, R21 to R22, b22, and p in Formula 1 and Formula 2, the specification is referred to.

公开(公告)号：US20230173798A1

公开(公告)日：2023-06-08

申请号：US18162801

申请日：2023-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong JEON ,  A Ra JO ,  Jungha CHAE ,  Sun Jin SONG ,  Boreum JEONG

IPC: B32B27/08 ,  B32B27/28

CPC classification number: B32B27/08 ,  B32B27/281 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2457/20 ,  B32B2307/418 ,  B32B2255/10 ,  B32B2250/03

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.

公开(公告)号：US20200377658A1

公开(公告)日：2020-12-03

申请号：US16994636

申请日：2020-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08L79/08 ,  C08G73/10

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, R1 to R3, R10, R12, R13, a, b, c, d, A, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US20180148543A1

公开(公告)日：2018-05-31

申请号：US15816079

申请日：2017-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Chanjae AHN ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08J5/18

CPC classification number: C08G73/14 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide film having tensile modulus of greater than or equal to about 5 gigapascals, and yellowness index of less than 2.5, when measured at a thickness of the film between 50 micrometers to 100 micrometers, wherein the polyimide film is a reaction product of a combination including an aromatic dianhydride and an aromatic diamine, wherein the aromatic dianhydride includes 4,4′-oxydiphthalic anhydride.

公开(公告)号：US20170342224A1

公开(公告)日：2017-11-30

申请号：US15602616

申请日：2017-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Jungha CHAE ,  Chanjae AHN ,  Kyeong-sik JU

IPC: C08J5/18 ,  C08G73/14 ,  G06F1/16

Abstract: A poly(amide-imide) copolymer film having a tensile modulus of greater than or equal to 5.4 GPa, and a yellowness index of less than or equal to 3.6, wherein the poly(amide-imide) copolymer film is a reaction product of an aromatic dianhydride including biphenyl tetracarboxylic dianhydride and 4,4′-hexafluoroisopropylidene diphthalic dianhydride, an aliphatic dianhydride including 1,2,3,4-cyclobutane tetracarboxylic dianhydride, an aromatic diamine including 2,2-bis(trifluoromethyl) benzidine, and an aromatic dicarbonyl compound including terephthaloyl dichloride.

公开(公告)号：US20250147419A1

公开(公告)日：2025-05-08

申请号：US18620240

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungha CHAE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Mijeong KIM ,  Sunyoung LEE ,  Jiyoun LEE ,  Changheon LEE ,  Jinwon JEON

IPC: G03F7/027

Abstract: Provided are a resist composition and a pattern formation method using the same, the resist composition including a first organometallic compound represented by one of Formulae 1-1 to 1-4 and a second organometallic compound represented by Formula 2: wherein M11, M21, L11 to L14, L21 to L24, a11 to a14, a21 to a24, R11 to R14, R21 to R24, b11 to b14, b21 to b24, Y11 to Y13, and X11 to X13 in Formulae 1-1 to 1-4 and 2 are as described in the specification.

公开(公告)号：US20250147415A1

公开(公告)日：2025-05-08

申请号：US18635761

申请日：2024-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunyoung LEE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Jiyoun LEE ,  Kyuhyun IM ,  Jinwon JEON ,  Jungha CHAE ,  Minyoung HA

IPC: G03F7/004

Abstract: Provided are a resist composition and a pattern formation method using the same. The resist composition may include an organometallic compound represented by one of Formulae 1-1 to 1-4, and an additive represented by Formula 2: wherein M11, L11 to L14, a11 to a14, R11 to R14, b11 to b14, Y11 to Y13, X11 to X13, Y21, Y22, L21, and a21 in Formulae 1-1 to 1-4 and 2 are described in the specification.

公开(公告)号：US20240094633A1

公开(公告)日：2024-03-21

申请号：US18150012

申请日：2023-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungha CHAE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Minsang KIM ,  Hana KIM ,  Hyeran KIM ,  Youngmin NAM ,  Changheon LEE ,  Kyuhyun IM

IPC: G03F7/004 ,  C07C65/30 ,  G03F7/20

CPC classification number: G03F7/0045 ,  C07C65/30 ,  G03F7/2006

Abstract: Provided are a carboxylate salt represented by Formula 1, a photoresist composition including the carboxylate salt represented by Formula 1, and a method of forming a pattern by using the photoresist composition






wherein, in Formula 1, A11, R11 to R15, b15, n11, n12, and M+ are described in the specification.

公开(公告)号：US20240043592A1

公开(公告)日：2024-02-08

申请号：US18068365

申请日：2022-12-19

Applicant: Samsung Electronics Co., Ltd.,

Inventor： Minsang KIM ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Chanjae AHN ,  Jungha CHAE ,  Sungwon CHOI ,  Minyoung HA

IPC: C08F220/18 ,  C07C381/12 ,  G03F7/039 ,  G03F7/038 ,  C08F212/14

CPC classification number: C08F220/1807 ,  C07C381/12 ,  G03F7/039 ,  G03F7/038 ,  C08F212/24

Abstract: Provided are a polymer including a repeating unit represented by Formula 1, a photoresist composition including the polymer, and a method of forming a pattern by using the photoresist composition:




wherein the details of R11, L11, a11, A11−, and B11+in Formula 1 are provided in the present specification.

公开(公告)号：US20190048145A1

公开(公告)日：2019-02-14

申请号：US16059541

申请日：2018-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08L79/08

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, R1 to R3, R10, R12 , R13, a, b, c, d, A, X, n7 and n8 are the same as defined in the specification.