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    METHOD FOR MANUFACTURING EXTERIOR HOUSING AND ELECTRONIC DEVICE COMPRISING SAME
    11.
    发明申请
    METHOD FOR MANUFACTURING EXTERIOR HOUSING AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20180249586A1

    公开(公告)日：2018-08-30

    申请号：US15751212

    申请日：2016-05-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young-Gyun KIM ,  Minjung KIM ,  Jeeyoung OH ,  Gyoosug LEE

    IPC: H05K5/02 ,  B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  B29C43/02 ,  B29C43/00 ,  B29C43/52 ,  B29C43/50 ,  H05K5/00

    Abstract: An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.

    SEMICONDUCTOR PACKAGE
    12.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250105100A1

    公开(公告)日：2025-03-27

    申请号：US18977556

    申请日：2024-12-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyeonjeong HWANG ,  Minjung KIM ,  Dongkyu KIM ,  Taewon YOO

    IPC: H01L23/49 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18

    Abstract: Disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. A material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.

    SEMICONDUCTOR PACKAGE COMPRISING ADHESION ENHANCER LAYER AND METHOD OF FABRICATING THE SAME
    13.
    发明申请
    SEMICONDUCTOR PACKAGE COMPRISING ADHESION ENHANCER LAYER AND METHOD OF FABRICATING THE SAME 有权

    公开(公告)号：US20250022764A1

    公开(公告)日：2025-01-16

    申请号：US18412770

    申请日：2024-01-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minjung KIM ,  Solji SONG ,  Jiseok YEO ,  Hyojun YOON ,  Dongjin LEE ,  Yoonseok CHOI

    IPC: H01L23/31 ,  H01L23/00 ,  H01L25/065

    Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate including bonding pads on a upper surface thereof and external connectors on a lower surface thereof, a first chip structure connected to the package substrate with a bonding wire and disposed on the package substrate, a second chip structure disposed on the package substrate and disposed next to the first chip structure, and a mold layer covering the package substrate, the first chip structure, and the second chip structure, wherein the first chip structure includes a plurality of semiconductor dies that are sequentially stacked, the second chip structure includes a second semiconductor substrate, an oxide layer on the second semiconductor substrate, and an adhesion enhancer layer disposed on the oxide layer and in contact with the mold layer, heights of the first chip structure and the second chip structure are the same.

    AUDIO DATA PROCESSING METHOD AND DEVICE THEREOF
    16.
    发明公开
    AUDIO DATA PROCESSING METHOD AND DEVICE THEREOF 审中-公开

    公开(公告)号：US20230262387A1

    公开(公告)日：2023-08-17

    申请号：US18138461

    申请日：2023-04-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyunil AN ,  Shinhyuck KANG ,  Dongmoon OK ,  Injune CHOI ,  Minjung KIM

    IPC: H04R3/00 ,  G10K11/178

    CPC classification number: H04R3/005 ,  G10K11/1781 ,  H04R2420/07

    Abstract: An electronic device includes: at least one microphone; a main processing circuit; and an audio processing circuit, wherein the main processing circuit is configured to: obtain, via the at least one microphone, first audio data including a first number of audio channels, the first number being greater than or equal to one; receive second audio data including a second number of audio channels from an external device connected to the electronic device, the second number being greater than or equal to one; and provide the first audio data and the second audio data to the audio processing circuit, and wherein the audio processing circuit is configured to: produce a single audio stream including a third number of audio channels by using the first number of audio channels of the first audio data and the second number of audio channels of the second audio data; and provide the single audio stream to the main processing circuit.

    METHOD FOR MANUFACTURING EXTERIOR HOUSING AND ELECTRONIC DEVICE COMPRISING SAME
    18.
    发明申请
    METHOD FOR MANUFACTURING EXTERIOR HOUSING AND ELECTRONIC DEVICE COMPRISING SAME 有权

    公开(公告)号：US20230088491A1

    公开(公告)日：2023-03-23

    申请号：US17994113

    申请日：2022-11-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young-Gyun KIM ,  Minjung KIM ,  Jeeyoung OH ,  Gyoosug LEE

    IPC: H05K5/02 ,  B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  H04M1/02 ,  H05K5/00 ,  B32B1/00 ,  B29C43/00 ,  B29C43/02 ,  B29C43/50 ,  B29C43/52

    Abstract: An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.

    SERVER AND CONTROLLING METHOD THEREOF
    19.
    发明申请
    SERVER AND CONTROLLING METHOD THEREOF 有权

    公开(公告)号：US20220301017A1

    公开(公告)日：2022-09-22

    申请号：US17836424

    申请日：2022-06-09

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Minjung KIM ,  Kwangwon KO ,  Heejin KIM ,  Jongchul PARK

    IPC: G06Q30/02 ,  G06N3/04 ,  G06N7/00

    Abstract: A server includes a communicator, a memory configured to store a first neural network model trained to predict winning probability distribution for a bidding price based on advertisement history data of an advertiser and a second neural network model, and a processor configured to, based on receiving a bidding request from an external server, obtain response probability data of a user based on user information included in the bidding request, obtain a first winning probability distribution by inputting data with respect to an auction of an advertiser and the response probability data of the user to the first neural network model and obtain a second winning probability distribution by inputting noise data to the second neural network model, and identify a bidding price based on the first and second winning probability distributions and control the communicator to transmit the identified bidding price to the external server.

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