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    ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD
    11.
    发明申请
    ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20230007114A1

    公开(公告)日：2023-01-05

    申请号：US17738550

    申请日：2022-05-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sunggun CHO ,  Bokgyu SONG ,  Wonhee CHOI

    IPC: H04M1/02 ,  H05K1/18 ,  H05K1/02

    Abstract: An electronic device is provided. The electronic device includes a first housing including a first through hole, a flexible printed circuit board including a plurality of layers, a first portion of the flexible printed circuit board disposed to pass through the through hole, a bonding member being disposed between the plurality of layers constituting the first portion, and a waterproofing member formed to surround at least part of the first portion of the flexible printed circuit board.

    HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME
    12.
    发明申请
    HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20210144866A1

    公开(公告)日：2021-05-13

    申请号：US17152076

    申请日：2021-01-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chongkun CHO ,  Sunggun CHO ,  Wonhee CHOI

    IPC: H05K5/00 ,  H05K5/02

    Abstract: A housing of an electronic device and an electronic device are provided. The housing of an electronic device including at least one plate includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member comprising a second surface being substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface comprises a protrusion protruding from the first surface toward the plate by a predetermined height, a first recess formed in from the first surface by a predetermined depth, and a second recess formed in from the first surface deeper than the first recess.

    INTEGRATED CIRCUIT DEVICE
    13.
    发明公开
    INTEGRATED CIRCUIT DEVICE 审中-公开

    公开(公告)号：US20240196602A1

    公开(公告)日：2024-06-13

    申请号：US18490212

    申请日：2023-10-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Wonhee CHOI ,  Daejin NAM ,  Sunguk JANG

    IPC: H10B12/00 ,  H01L29/423

    CPC classification number: H10B12/485 ,  H01L29/42356 ,  H10B12/482 ,  H10B12/488

    Abstract: An integrated circuit device includes a substrate having an active region, a word line extending in the substrate in a first horizontal direction, a bit line extending on the word line in a second horizontal direction, a bit line contact electrically connecting the bit line to the active region, a doping contact connecting the bit line contact to the active region, a cell pad having a horizontal width greater than that of the active region, a buried contact that digs into one side wall of the cell pad, and a conductive landing pad facing the bit line in the first horizontal direction. The doping contact includes a first doping contact and a second doping contact, and a thickness of the first doping contact in the vertical direction is less than that of the second doping contact in the vertical direction.

    ELECTRONIC APPARATUS COMPRISING WATERPROOF STRUCTURE
    14.
    发明公开
    ELECTRONIC APPARATUS COMPRISING WATERPROOF STRUCTURE 审中-公开

    公开(公告)号：US20230371192A1

    公开(公告)日：2023-11-16

    申请号：US18360275

    申请日：2023-07-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sunggun CHO ,  Dongik LEE ,  Minyee AN ,  Wonhee CHOI ,  Hyunseung YOON ,  Heekang YUN ,  Waneui JUNG

    IPC: H05K5/02 ,  H05K5/06

    CPC classification number: H05K5/0247 ,  H05K5/069 ,  H05K5/0278

    Abstract: According to an embodiment of the present disclosure, an electronic apparatus comprises: a housing; a first connector positioned on a printed circuit board accommodated in the housing and comprising a first hole configured to receive a first external connector; a second connector comprising a second hole configured to receive a second external connector; a first seal having a ring shape positioned in the first connector around the first hole; and a second seal having a ring shape positioned in the second connector around the second hole, wherein, based on the first seal being compressed in a first direction by the housing, the second seal may be compressed by the housing in a second direction perpendicular to the first direction.

    ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE
    15.
    发明申请
    ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE 有权

    公开(公告)号：US20220255576A1

    公开(公告)日：2022-08-11

    申请号：US17591712

    申请日：2022-02-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sunggun CHO ,  Jongkeun KIM ,  Wonhee CHOI ,  Jaehee KIM ,  Hwamok PARK ,  Minyee AN ,  Dongik LEE

    IPC: H04B1/3888 ,  G06F1/16 ,  H05K1/18 ,  H04M1/02

    Abstract: Disclosed is an electronic device includes a flexible circuit board passing via a first through-hole included in a first housing and a second through-hole included in a second housing, a first support bracket disposed to support the flexible circuit board while covering the first through-hole, a second support bracket disposed to support the flexible circuit board while covering the second through-hole, a first waterproof member disposed to face a partial area of the first through-hole from the first support bracket and inserted into the partial area of the first through-hole, a second waterproof member inserted into the remaining areas of the first through-hole, a third waterproof member disposed to face a partial area of the second through-hole from the second support bracket and inserted into the partial area of the second through-hole, a fourth waterproof member inserted into the remaining areas of the second through-hole.

    ELECTRONIC DEVICE WITH BONDING STRUCTURE
    16.
    发明申请
    ELECTRONIC DEVICE WITH BONDING STRUCTURE 有权

    公开(公告)号：US20210089085A1

    公开(公告)日：2021-03-25

    申请号：US17112121

    申请日：2020-12-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Daehyeong PARK ,  Jongmin CHOI ,  Jaehee KIM ,  Jongkeun KIM ,  Hun KIM ,  Donghyun BYUN ,  Uyhyeon JEONG ,  Iksu JUNG ,  Sunggun CHO ,  Chongkun CHO ,  Wonhee CHOI ,  Seunghyun HWANG ,  Byounguk YOON ,  Minsung LEE

    IPC: G06F1/16

    Abstract: An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front plate and the rear plate and at least partially constructed of a metal material, wherein the front plate includes a first edge having a first length and extending in a third direction, a second edge having a second length longer than the first length and extending in a fourth direction orthogonal to the third direction, a third edge parallel to the first edge, having the first length, and extending in the third direction from the second edge, a fourth edge parallel to the second edge, having the second length, and extending in the fourth direction from the first edge, a first region in which the third edge and the fourth edge meet, and a second region in which the second edge and the third edge meet, a display viewable through the front plate, and an adhesive layer constructed in a closed-curve shape along the first edge, second edge, third edge, and fourth edge of the front plate, wherein, when viewed from above the display, a width of the adhesive layer in the first region and the second region is greater than a width of the adhesive layer outside the first region and the second region.

    HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME
    17.
    发明申请
    HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200253064A1

    公开(公告)日：2020-08-06

    申请号：US16750693

    申请日：2020-01-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chongkun CHO ,  Sunggun CHO ,  Wonhee CHOI

    IPC: H05K5/00 ,  H05K5/02

    Abstract: A housing of an electronic device and an electronic device are provided. The housing of an electronic device including at least one plate includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member comprising a second surface being substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface comprises a protrusion protruding from the first surface toward the plate by a predetermined height, a first recess formed in from the first surface by a predetermined depth, and a second recess formed in from the first surface deeper than the first recess.

    UNMANNED AERIAL VEHICLE
    18.
    发明申请
    UNMANNED AERIAL VEHICLE 审中-公开

    公开(公告)号：US20180319490A1

    公开(公告)日：2018-11-08

    申请号：US15965617

    申请日：2018-04-27

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Seung-Chul BAEK ,  Wonhee CHOI ,  Sang-In BAEK ,  Min-Woo YOO ,  Byoung-Uk YOON ,  Min-Sung LEE ,  Jong-Chul CHOI

    IPC: B64C27/48 ,  B64C39/02

    CPC classification number: B64C11/02 ,  B64C39/024 ,  B64C2201/027 ,  B64C2201/042 ,  B64C2201/108

    Abstract: An unmanned aerial vehicle according to various embodiments includes: a housing; a communication circuit, wherein the communication circuit establishes wireless communication with an external controller; and a plurality of propulsion systems connected to the housing, wherein the propulsion systems include: a motor; a rotation shaft having an axis extending in a first direction, wherein a first end is connected to the motor, and wherein the rotation shaft is rotates in a first direction by the motor; a cap structure fixed to the second end of the rotation shaft, a propeller including: a hub including a through-hole formed in the first direction, such that the rotation shaft rotatably passes through the through-hole, wherein the propeller is detachably connected to the cap structure, such that, when an external force is exerted on the blade, the propeller is released from the cap structure to be freely movable along the axis toward the motor.

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