公开(公告)号：US20240359234A1

公开(公告)日：2024-10-31

申请号：US18645540

申请日：2024-04-25

Applicant: SEIKO EPSON CORPORATION

Inventor： Akihiko TSUNOYA ,  Takayuki YOKOYAMA

IPC: B22F10/14 ,  B22F3/10 ,  B22F10/40 ,  B33Y10/00

CPC classification number: B22F10/14 ,  B22F3/1021 ,  B22F10/40 ,  B33Y10/00

Abstract: A method for manufacturing a three-dimensional shaped object includes: a step of stacking a layer containing a first inorganic powder and a first binder to form a first component, the first component being bonded to a second component containing a second inorganic powder and a second binder by a heat treatment; and a support body forming step of forming, by stacking the layer, a support body which is removed after the heat treatment. The heat treatment is executed on an aggregate. The support body is formed in the aggregate to support an overhang portion from below between the first component and the second component. The support body forming step includes: a step of forming a support main body portion by stacking the layer containing the first inorganic powder and the first binder; a step of forming a first contact portion in contact with the first component in the aggregate by stacking a layer containing a third inorganic powder having a melting point higher than that of the first inorganic powder and the second inorganic powder; and a step of forming a second contact portion in contact with the second component in the aggregate.

公开(公告)号：US20220203443A1

公开(公告)日：2022-06-30

申请号：US17558769

申请日：2021-12-22

Applicant: Seiko Epson Corporation

Inventor： Akihiko TSUNOYA

IPC: B22F7/06 ,  B22F3/22 ,  B22F10/10

Abstract: A production method for producing a product by joining a first part containing an inorganic powder and a binder to a second part containing an inorganic powder and a binder is provided. The production method includes a first step of forming the first part by a three-dimensional shaping apparatus, a second step of forming the second part, a third step of assembling the first part and the second part, thereby obtaining an assembly, a fourth step of heating the assembly at a first temperature, and a fifth step of heating the assembly at a second temperature higher than the first temperature after the fourth step, wherein the first part has a first region that comes in contact with the second part and a second region that does not come in contact with the second part, and a melting point of the binder contained in the first region is lower than a melting point of the binder contained in the second region.

公开(公告)号：US20220033664A1

公开(公告)日：2022-02-03

申请号：US17389832

申请日：2021-07-30

Applicant: SEIKO EPSON CORPORATION

Inventor： Kozo SHITAGAMI ,  Eiji OKAMOTO ,  Akihiko TSUNOYA

IPC: C09D11/037 ,  C09D11/12 ,  C09D11/108 ,  B33Y70/00

Abstract: A molding composition contains a powder, a wax, an adhesive component, a molding component, and a plasticizer, in which a melt flow rate of the adhesive component at 190° C. is 200 g/10 min or more, and a density of the plasticizer is 1.0 g/cm3 or less.

公开(公告)号：US20220027537A1

公开(公告)日：2022-01-27

申请号：US17381732

申请日：2021-07-21

Applicant: Seiko Epson Corporation

Inventor： Akihiko TSUNOYA

IPC: G06F30/27 ,  G06N20/00

Abstract: A machine learning device includes: a data acquisition unit configured to acquire first data including shape data representing a target shape of a three-dimensional shaped object and additional shape data representing a target shape of an additional portion to be added to the three-dimensional shaped object in order to prevent deformation of the three-dimensional shaped object during manufacturing, and second data related to the deformation of the three-dimensional shaped object; a storage unit configured to store a learning data set including a plurality of the first data and a plurality of the second data; and a learning unit configured to learn a relationship between the first data and the second data by executing machine learning using the learning data set.

公开(公告)号：US20210178700A1

公开(公告)日：2021-06-17

申请号：US17121111

申请日：2020-12-14

Applicant: SEIKO EPSON CORPORATION

Inventor： Akihiko TSUNOYA

IPC: B29C64/393 ,  B29C64/35 ,  B29C64/245 ,  B29C64/209 ,  B29C64/295 ,  B29C64/232

Abstract: A three-dimensional shaping device that shapes a three-dimensional shaped object by stacking a layer includes: a shaping table on which the three-dimensional shaped object and a quality control shaped object are shaped; an injecting unit configured to inject a shaping material of the three-dimensional shaped object and the quality control shaped object; a moving mechanism configured to move the shaping table and the injecting unit relatively to each other; monitoring units configured to monitor a shaping state of the quality control shaped object; and a control unit configured to control the injecting unit, the moving mechanism, and the monitoring units to form the layer. The injecting unit injects, onto the shaping table, the solid shaping material heated into a plasticized state under the control of the control unit, and the control unit forms the layer based on monitoring results of the monitoring units.

公开(公告)号：US20200062978A1

公开(公告)日：2020-02-27

申请号：US16489318

申请日：2018-01-18

Applicant: Seiko Epson Corporation

Inventor： Takeshi MIYASHITA ,  Eiji OKAMOTO ,  Akihiko TSUNOYA ,  Naoko SHIMA ,  Makoto KATO

IPC: C09D11/322 ,  B33Y10/00 ,  B33Y70/00 ,  B22F3/105 ,  B29C64/165 ,  C09D11/36 ,  C09D11/037 ,  C09D11/033 ,  C09D11/106 ,  C09D11/107

Abstract: A three-dimensional shaped article producing composition is provided and contains a plurality of particles, a solvent for dispersing the particles, and a binder having a function to temporarily bind the particles to one another in a state where the solvent is removed, wherein a volume-based average particle diameter of the particles is 0.1 μm or more and less than 50 μm, and a content ratio of the binder is 1.5 vol % or more and 10 vol % or less.

公开(公告)号：US20180250877A1

公开(公告)日：2018-09-06

申请号：US15911589

申请日：2018-03-05

Applicant: Seiko Epson Corporation

Inventor： Eiji OKAMOTO ,  Akihiko TSUNOYA ,  Masaya ISHIDA

IPC: B29C64/165 ,  B29C64/209 ,  B29C64/336

Abstract: There is provided a paste for use in producing a three-dimensional shaped article, the paste containing a solvent, a binder that is soluble in the solvent, support layer forming first particles, and a material having a decomposition temperature lower than a sintering temperature of the support layer forming first particles, in which the material is contained in a volume of greater than or equal to 20% and less than or equal to 60% with respect to a total volume of the support layer forming first particles and the material being 100%. By using such a paste, a highly accurate three-dimensional shaped article can be produced.

公开(公告)号：US20180093326A1

公开(公告)日：2018-04-05

申请号：US15700653

申请日：2017-09-11

Applicant: Seiko Epson Corporation

Inventor： Masaya ISHIDA ,  Eiji OKAMOTO ,  Akihiko TSUNOYA

IPC: B22F3/11 ,  B22F3/00 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y40/00 ,  B29C64/165 ,  B29C64/40

CPC classification number: B22F3/1121 ,  B22F1/0059 ,  B22F3/008 ,  B22F3/1021 ,  B29C64/112 ,  B29C64/165 ,  B29C64/30 ,  B29C64/40 ,  B29K2033/12 ,  B29K2077/00 ,  B29K2105/04 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  C04B35/00 ,  C04B35/111 ,  C04B35/63468 ,  C04B38/0615 ,  C04B2111/00181 ,  C04B2235/5436 ,  C04B2235/6026 ,  C04B2235/658 ,  C04B38/0054 ,  C04B38/0074

Abstract: A three-dimensional shaped-article manufacturing composition of the invention is a three-dimensional shaped-article manufacturing composition which is used for manufacturing of a three-dimensional shaped article. The composition described above includes a plurality of shaped-article forming grains forming a substantive portion of the three-dimensional shaped article; a void forming material forming voids in the three-dimensional shaped article; a solvent dispersing the shaped-article forming grains and the void forming material; and a binder dissolved in the solvent. The content of the void forming material is 5 to 50 parts by volume with respect to 100 parts by volume of the shaped-article forming grains.

公开(公告)号：US20180029124A1

公开(公告)日：2018-02-01

申请号：US15645192

申请日：2017-07-10

Applicant: Seiko Epson Corporation

Inventor： Eiji OKAMOTO ,  Masaya ISHIDA ,  Akihiko TSUNOYA

IPC: B22F3/105 ,  B33Y30/00 ,  B23K26/342 ,  B33Y50/02 ,  B29C64/245 ,  B29C64/188 ,  B33Y10/00 ,  B33Y40/00

CPC classification number: B22F3/1055 ,  B22F3/008 ,  B22F3/1021 ,  B22F2003/1057 ,  B22F2003/1058 ,  B22F2999/00 ,  B23K26/342 ,  B29C64/188 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

Abstract: A three-dimensional shaped article shaping stage, which is used in a three-dimensional shaped article production apparatus for producing a three-dimensional shaped article by stacking layers to form a stacked body, is attachable to and detachable from the production apparatus, has a forming surface on which the stacked body is to be formed, and in which an organic film having a lower melting point than a constituent material is formed on the forming surface, is used. By using such a shaping stage, it becomes possible to easily separate the stacked body of the three-dimensional shaped article formed by stacking layers on the shaping stage from the shaping stage.

公开(公告)号：US20240326333A1

公开(公告)日：2024-10-03

申请号：US18616774

申请日：2024-03-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu WATANABE ,  Akihiko TSUNOYA

IPC: B29C64/245 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B29C64/245 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02

Abstract: A three-dimensional shaping device includes a stage having a shaping surface formed with a first, second, third, and fourth groove, a discharge unit configured to supply a shaping material to the shaping surface, a moving mechanism configured to relatively move the stage and the discharge unit, and a control unit configured to control the discharge unit and the moving mechanism. The control unit is configured to execute a control of forming a first shaping line in the first groove, a control of forming a second shaping line in the second groove, a control of forming a third shaping line in the third groove, a control of forming a fourth shaping line in the fourth groove, a control of forming a first floor layer that couples the first and second shaping lines, and a control of forming a second floor layer that couples the third and fourth shaping lines.