公开(公告)号：US20240416394A1

公开(公告)日：2024-12-19

申请号：US18799283

申请日：2024-08-09

Applicant: SEMES CO., LTD.

Inventor： Tae-Keun KIM ,  Kyeong Min LEE ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  H01L21/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

公开(公告)号：US20240173738A1

公开(公告)日：2024-05-30

申请号：US18502487

申请日：2023-11-06

Applicant: SEMES CO., LTD.

Inventor： Yong Jun KIM ,  Tae-keun KIM ,  Junhee CHOI ,  Kang Sul KIM ,  Kyeong Min LEE

IPC: B05C5/00 ,  B05C13/00

CPC classification number: B05C5/001 ,  B05C13/00 ,  H01L21/02057

Abstract: Provided is a substrate processing apparatus and substrate processing method capable of allowing a liquid chemical to penetrate deeply into patterns of a substrate, the substrate processing apparatus including a housing for forming a treatment space where a substrate is processed, a substrate supporter mounted in the treatment space to rotate about a rotational axis, and provided to support the substrate, a liquid chemical supplier provided above the substrate supporter to eject a liquid chemical toward an upper surface of the substrate supported by the substrate supporter, and an ejector provided at a side of the treatment space to eject a heat transfer medium with a temperature different from the temperature of the liquid chemical onto the substrate.

公开(公告)号：US20230215740A1

公开(公告)日：2023-07-06

申请号：US17843919

申请日：2022-06-17

Applicant: SEMES CO., LTD.

Inventor： Won Young KANG ,  Tae Keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Min Hee CHO

IPC: H01L21/67 ,  B08B3/10 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B3/10 ,  H01L21/68764 ,  H01L21/02057

Abstract: There are provided a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a stage on which a substrate is seated, in a chamber; and a treatment liquid supply apparatus supplying a treatment liquid containing a solvent and a solute onto the substrate, wherein the treatment liquid supply apparatus supplies the treatment liquid onto the substrate while moving from a center of the substrate to an outer peripheral surface of the substrate.