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    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF
    12.
    发明申请
    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF 审中-公开

    公开(公告)号：US20190159352A1

    公开(公告)日：2019-05-23

    申请号：US16314362

    申请日：2017-06-19

    Applicant: BYD COMPANY LIMITED

    Inventor： Jian SUN ,  Liang CHEN ,  Guiwang ZHAO ,  Yingyuan WU ,  Xiangrong JIANG ,  Yunfei ZOU

    IPC: H05K5/02

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

    METAL COMPOSITE AND METHOD OF PREPARING THE SAME, METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME
    13.
    发明申请
    METAL COMPOSITE AND METHOD OF PREPARING THE SAME, METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME 有权
    金属复合材料及其制备方法，金属 - 树脂复合材料及其制备方法

    公开(公告)号：US20150079384A1

    公开(公告)日：2015-03-19

    申请号：US14554370

    申请日：2014-11-26

    Applicant: BYD COMPANY LIMITED

    Inventor： Xiao ZHANG ,  Lili TANG ,  Yun CHENG ,  Qiang GUO ,  Liang CHEN

    IPC: C23F1/20 ,  C23C26/00

    CPC classification number: C23F1/20 ,  B29C45/14311 ,  B29K2705/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2605/00 ,  C23C26/00 ,  C25D11/16 ,  C25D11/18 ,  C25D11/24 ,  Y10T428/24997

    Abstract: A metal composite, a method of preparing the metal composite, a metal-resin composite, and a method of preparing the metal-resin composite are provided. The metal composite comprises: a metal substrate comprising a first layer formed on a surface of the metal substrate and an anodic oxidation layer formed on the first layer. The first layer comprises a first pore having an average diameter of about 10 nanometers to about 1 millimeter, and the metal composite comprises aluminum alloy or aluminum. The anodic oxidation layer comprises a second layer contacted with the first layer of the metal substrate and a third layer formed on an outer surface of the second layer, and the second layer comprises a second pore having an average diameter of about 10 nanometers to about 800 microns, and the third layer comprises a third pore having an average diameter of about 10 nanometers to about 800 microns.

    Abstract translation: 提供金属复合材料，金属复合材料的制备方法，金属 - 树脂复合材料和金属 - 树脂复合材料的制备方法。 金属复合体包括：金属基板，包括形成在金属基板的表面上的第一层和形成在第一层上的阳极氧化层。 第一层包括平均直径约10纳米至约1毫米的第一孔，金属复合材料包括铝合金或铝。 阳极氧化层包括与金属基底的第一层接触的第二层和形成在第二层的外表面上的第三层，第二层包括具有约10纳米至约800平均直径的第二孔 并且第三层包含平均直径约10纳米至约800微米的第三孔。

    ELECTRONIC DEVICE HOUSING, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
    14.
    发明申请
    ELECTRONIC DEVICE HOUSING, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20220104376A1

    公开(公告)日：2022-03-31

    申请号：US17418530

    申请日：2019-04-29

    Applicant: BYD COMPANY LIMITED

    Inventor： Lan MA ,  Haiyan JIN ,  Liang CHEN

    IPC: H05K5/03 ,  H04B1/3888

    Abstract: An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.

    BUMPER BRACKET, VEHICLE BODY FRONT END ASSEMBLY, AND VEHICLE
    18.
    发明申请
    BUMPER BRACKET, VEHICLE BODY FRONT END ASSEMBLY, AND VEHICLE 有权

    公开(公告)号：US20240425007A1

    公开(公告)日：2024-12-26

    申请号：US18823784

    申请日：2024-09-04

    Applicant: BYD COMPANY LIMITED

    Inventor： Yongrui LIN ,  Bo SUN ,  Zhiguang LIANG ,  Liang CHEN ,  Chao ZHU

    IPC: B60R19/26

    Abstract: A bumper bracket for connecting with a vehicle body, includes a mounting hole and a weakening portion. The mounting hole is configured to connect the bumper bracket to the vehicle body. In a front-rear direction of a vehicle, the weakening portion is disposed in front of the mounting hole, a projection of the mounting hole in the front-rear direction of the vehicle at least partially overlaps with a projection of the weakening portion in the front-rear direction of the vehicle, and a structural strength of the weakening portion is lower than a structural strength of a portion of the bumper bracket other than the weakening portion.

    LAMINATED GLASS AND PREPARATION METHOD THEREFOR, HOUSING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
    20.
    发明申请
    LAMINATED GLASS AND PREPARATION METHOD THEREFOR, HOUSING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20210387443A1

    公开(公告)日：2021-12-16

    申请号：US17286337

    申请日：2019-05-16

    Applicant: BYD COMPANY LIMITED

    Inventor： Haixia WANG ,  Lan MA ,  Liang CHEN ,  Liliang SHI

    IPC: B32B17/10

    Abstract: Provided is laminated glass and a preparation method thereof, an electronic device housing, and an electronic device. The laminated glass comprises at least two glass members and at least one adhesive film disposed in a stacked manner, where the glass members and the adhesive film are alternately disposed, wherein decorative layers are provided on surfaces of at least two of the glass members facing toward the adhesive film, and at least two of the decorative layers independently comprise at least one of an etched texture, an optical coating layer, and a pattern layer.

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