公开(公告)号：US20230055947A1

公开(公告)日：2023-02-23

申请号：US17785709

申请日：2020-12-18

Applicant: SHOWA DENKO K.K.

Inventor： Yasunao MIYAMURA ,  Yasushi KADOWAKI ,  Kuniaki YAMATAKE ,  Masanao HARA ,  Shigeru YAMAKI ,  Hideki OHATA

IPC: G01P15/03

Abstract: An acceleration sensor is provided in which a sensitive color plate is provided between two polarizing plates that are in a crossed Nicol disposition, and a silver nanowire dispersion is disposed between the sensitive color plate and one of the polarizing plates.

公开(公告)号：US20220203738A1

公开(公告)日：2022-06-30

申请号：US17614977

申请日：2020-05-29

Applicant: SHOWA DENKO K.K.

Inventor： Shigeru YAMAKI

IPC: B41M3/00 ,  H01B5/14 ,  H01B13/00

Abstract: Provided is a transparent conducting film having a favorable optical property, favorable electrical property, and almost no in-plane resistance anisotropy. A method for producing a transparent conducting film provided with a conducting layer containing a metal nanowire and a binder resin, comprises steps of: preparing a coating liquid containing the metal nanowire and the binder resin, and coating the coating liquid on one main face of a transparent substrate, wherein, in the coating step, a bar-coat printing method is performed using a bar provided with a groove having a pitch (P) and a depth (H) which satisfy a ratio P/H of 5 to 30.

公开(公告)号：US20190330493A1

公开(公告)日：2019-10-31

申请号：US16465400

申请日：2017-11-29

Applicant: SHOWA DENKO K.K.

Inventor： Masahiko TOBA ,  Eri NAKAZAWA ,  Shigeru YAMAKI

IPC: C09D175/04 ,  C09D7/20 ,  H01B1/12 ,  B05D3/02

Abstract: A composition for a protective film for electroconductive patterns, including: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100° C., and (D2) a solvent having a boiling point that does not exceed 100° C., wherein the content of the solvent (D2) having a boiling point that does not exceed 100° C. is 30% to less than 70% by mass of total solvent in total. The composition can be cured by heating at a temperature not exceeding 100° C. for a heating time not exceeding 10 minutes.

公开(公告)号：US20170327737A1

公开(公告)日：2017-11-16

申请号：US15531802

申请日：2015-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Shigeru YAMAKI ,  Takashi SEKINE ,  Ayako YOKOYAMA

IPC: C09K11/02 ,  C08K3/32 ,  C09K11/70 ,  H01L33/50 ,  G02B1/04 ,  C08K7/18 ,  B82Y20/00

CPC classification number: C09K11/02 ,  B82Y20/00 ,  B82Y30/00 ,  C08F2/44 ,  C08F216/12 ,  C08F220/12 ,  C08K3/32 ,  C08K7/18 ,  C08K2201/001 ,  C08K2201/011 ,  C09K11/703 ,  G02B1/04 ,  H01L33/50 ,  H01L33/502 ,  H01L33/56 ,  H01L2933/0083 ,  Y10S977/774 ,  Y10S977/825 ,  Y10S977/95

Abstract: The present invention provides a curable composition containing semiconductor nanoparticles, which contains luminescent semiconductor nanoparticles having good dispersibility and has low viscosity and excellent formability. Al curable composition containing semiconductor nanoparticles, contains: a monofunctional (meth)acrylate compound (a) having a tricyclodecane structure; at least one compound (h) selected from among (meth)acrylate compounds (b1) having two or more (meth)acryloyloxy groups and compounds (b2) represented by formula (1); a polymerization initiator (c); and luminescent semiconductor nanoparticles (d). H2C═C(R1)—CH2—O—CH2—C(R2)═CH2 (1) (In formula (1). R1 and R2 each independently represent a hydrogen atom,an alkyl group having 1 to 4 carbon atoms, or an organic group having 4 to 10 carbon atoms having an ester bond)