公开(公告)号：US20210335724A1

公开(公告)日：2021-10-28

申请号：US17369654

申请日：2021-07-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  KyoWang Koo ,  SungWon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L25/065 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

公开(公告)号：US10910322B2

公开(公告)日：2021-02-02

申请号：US16220934

申请日：2018-12-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L21/00 ,  H01L23/552 ,  H01L21/311 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

公开(公告)号：US20200075502A1

公开(公告)日：2020-03-05

申请号：US16116485

申请日：2018-08-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  KyoWang Koo ,  SungWon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L21/56 ,  H01L21/78 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

公开(公告)号：US20240170416A1

公开(公告)日：2024-05-23

申请号：US18429080

申请日：2024-01-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L23/66 ,  H01L25/00 ,  H01L21/60

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/28 ,  H01L23/66 ,  H01L24/94 ,  H01L25/50 ,  H01L2021/60112

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US11784133B2

公开(公告)日：2023-10-10

申请号：US17136197

申请日：2020-12-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L21/00 ,  H01L23/552 ,  H01L21/311 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L21/31144 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/09 ,  H01L24/17

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

公开(公告)号：US11024585B2

公开(公告)日：2021-06-01

申请号：US16005348

申请日：2018-06-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Byung Joon Han ,  Il Kwon Shim ,  KyoungHee Park ,  Yaojian Lin ,  KyoWang Koo ,  In Sang Yoon ,  SeungYong Chai ,  SungWon Cho ,  SungSoo Kim ,  Hun Teak Lee ,  DeokKyung Yang

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L21/56

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

公开(公告)号：US20200373249A1

公开(公告)日：2020-11-26

申请号：US16991370

申请日：2020-08-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US10784210B2

公开(公告)日：2020-09-22

申请号：US16234156

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L21/56 ,  H01L21/78 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/60

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US20200211977A1

公开(公告)日：2020-07-02

申请号：US16234233

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01R43/20 ,  H01R43/26 ,  H01R12/79 ,  H01R12/52

Abstract: A semiconductor device has a substrate including a terminal and an insulating layer formed over the terminal. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the insulating layer over the terminal is exposed from the encapsulant. A shielding layer is formed over the encapsulant and terminal. A portion of the shielding layer is removed to expose the portion of the insulating layer. The portion of the insulating layer is removed to expose the terminal. The portion of the shielding layer and the portion of the insulating layer can be removed by laser ablation.

公开(公告)号：US20200211976A1

公开(公告)日：2020-07-02

申请号：US16234156

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.