公开(公告)号：US20180299337A1

公开(公告)日：2018-10-18

申请号：US15958461

申请日：2018-04-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Sarah ZERBINI ,  Enri DUQI

IPC: G01L9/00 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116 ,  G01L9/0072

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

公开(公告)号：US20180282152A1

公开(公告)日：2018-10-04

申请号：US15870429

申请日：2018-01-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Roberto CARMINATI

IPC: B81C1/00

CPC classification number: B81C1/00222 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/097 ,  B81C1/00261 ,  B81C1/00349 ,  B81C2201/01

Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.

公开(公告)号：US20200326010A1

公开(公告)日：2020-10-15

申请号：US16842474

申请日：2020-04-07

Applicant: STMicroelectronics S.r.l.

Inventor： Enri DUQI ,  Lorenzo BALDO

IPC: F16K31/00 ,  H01L41/09 ,  B23P15/00

Abstract: A microfluidic valve formed in a body having a first and a second surface; an inlet channel extending in the body from the second surface; a first transverse channel extending in the body in a transverse direction with respect to the inlet channel; and an outlet channel extending in the body from the first surface. The inlet channel, the first transverse channel and the outlet channel form a fluidic path. The microfluidic valve further has an occluding portion, formed by the body and extending over the transverse channel; and a piezoelectric actuator coupled to the occluding portion and configured to move the occluding portion from an opening position of the valve, where the occluding portion does not interfere with the fluidic path, and a closing position of the valve, where the occluding portion interferes with and interrupts the fluidic path.

公开(公告)号：US20200262699A1

公开(公告)日：2020-08-20

申请号：US16869159

申请日：2020-05-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00

Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

公开(公告)号：US20190330056A1

公开(公告)日：2019-10-31

申请号：US16509367

申请日：2019-07-11

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Domenico GIUSTI

IPC: B81C1/00 ,  B81B7/00

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

公开(公告)号：US20180118558A1

公开(公告)日：2018-05-03

申请号：US15636380

申请日：2017-06-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Mikel AZPEITIA URQUIA ,  Lorenzo BALDO

IPC: B81B3/00 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B3/0021 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00158 ,  B81C1/00269 ,  H04R19/005 ,  H04R19/04

Abstract: Method of manufacturing a transducer module, comprising the steps of: forming, on a substrate, a first MEMS transducer, in particular a gyroscope, and a second MEMS transducer, in particular an accelerometer, having a suspended membrane; forming, on the substrate, a conductive layer and defining the conductive layer in order to provide, simultaneously, at least one conductive strip electrically coupled to the first MEMS transducer and the membrane of the second MEMS transducer.

公开(公告)号：US20210229984A1

公开(公告)日：2021-07-29

申请号：US17155429

申请日：2021-01-22

Applicant: STMicroelectronics S.r.l.

Inventor： Enri DUQI ,  Nicolo' BONI ,  Lorenzo BALDO ,  Massimiliano MERLI ,  Roberto CARMINATI

IPC: B81C1/00 ,  H01L41/35

Abstract: To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.

公开(公告)号：US20200326530A1

公开(公告)日：2020-10-15

申请号：US16847514

申请日：2020-04-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Dario PACI ,  Lorenzo BALDO ,  Domenico GIUSTI

IPC: G02B26/08 ,  B81B3/00 ,  H01L27/146

Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.

公开(公告)号：US20200325888A1

公开(公告)日：2020-10-15

申请号：US16847521

申请日：2020-04-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Domenico GIUSTI ,  Lorenzo BALDO ,  Enri DUQI

IPC: F04B43/04 ,  H01L41/09 ,  H01L41/047 ,  H01L27/20 ,  H01L41/31

Abstract: A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

公开(公告)号：US20200236470A1

公开(公告)日：2020-07-23

申请号：US16749579

申请日：2020-01-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabrizio CERINI ,  Enri DUQI ,  Silvia ADORNO ,  Lorenzo BALDO

IPC: H04R19/02 ,  B81B3/00 ,  B81C1/00 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  H04R1/02

Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.