公开(公告)号：US20170221948A1

公开(公告)日：2017-08-03

申请号：US15489265

申请日：2017-04-17

Applicant: STMicroelectronics S.A. ,  STMicroelectronics (Crolles 2) SAS

Inventor： Axel Crocherie ,  Michel Marty ,  Jean-Luc Huguenin ,  Sébastien Jouan

IPC: H01L27/146 ,  H01L29/66

CPC classification number: H01L29/66977 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14645 ,  H01L27/14685 ,  H01L2027/11892 ,  H04N2209/045

Abstract: An integrated image sensor may include adjacent pixels, with each pixel including an active semiconductor region including a photodiode, an antireflection layer disposed above the photodiode, a dielectric region disposed above the antireflection layer, an optical filter disposed above the dielectric region, and a diffraction grating disposed in the antireflection layer. The diffraction grating includes an array of pads.

公开(公告)号：US11791355B2

公开(公告)日：2023-10-17

申请号：US17077966

申请日：2020-10-22

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Axel Crocherie

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/1463 ,  H01L27/14607 ,  H01L27/14685 ,  H01L27/1462

Abstract: An image sensor is includes a plurality of pixels. Each of the pixels includes a silicon photoconversion region and a material that at least partially surrounds the photoconversion region. The material has a refraction index smaller than the refraction index of silicon, and the interface between the photoconversion region of the pixel and the material is configured so that at least one ray reaching the photoconversion region of the pixel undergoes a total reflection or a plurality of successive total reflections at the interface.

公开(公告)号：US11049892B2

公开(公告)日：2021-06-29

申请号：US16451856

申请日：2019-06-25

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Axel Crocherie ,  Denis Rideau

IPC: H01L27/146 ,  H04N5/341

Abstract: A multispectral image sensor includes a semiconductor layer and a number of pixels formed inside and on top of the semiconductor layer. The pixels include a first pixel of a first type formed inside and on top of a first portion of the semiconductor layer and a second pixel of a second type formed inside and on top of a second portion of the semiconductor layer. The first pixel has a first thickness that defines a vertical cavity resonating at a first wavelength and the second pixel has a second thickness different from the first thickness. The second thickness defines a vertical cavity resonating at a second wavelength different than the first wavelength.

公开(公告)号：US10199413B2

公开(公告)日：2019-02-05

申请号：US15839292

申请日：2017-12-12

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA

Inventor： Axel Crocherie ,  Jean-Pierre Oddou ,  Stéphane Allegret-Maret ,  Hugues Leininger

IPC: H01L31/0232 ,  H01L27/146

Abstract: A color image sensor including an array of pixels is formed in a semiconductor layer having a back side that receives an illumination. Insulated conductive walls penetrate into the semiconductor layer from the back side and separate the pixels from one another. For each pixel, a color pixel penetrates into from 5 to 30% of a thickness of the semiconductor layer from the back side and occupies at least 90% of the surface area delimited by the walls. An electrically-conductive layer extends from the lateral wall of the filter all the way to the walls.

公开(公告)号：US09859319B2

公开(公告)日：2018-01-02

申请号：US14923799

申请日：2015-10-27

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Axel Crocherie ,  Jean-Pierre Oddou ,  Stéphane Allegret-Maret ,  Hugues Leininger

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14621 ,  H01L27/14607 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685

Abstract: A color image sensor including an array of pixels is formed in a semiconductor layer having a back side that receives an illumination. Insulated conductive walls penetrate into the semiconductor layer from the back side and separate the pixels from one another. For each pixel, a color pixel penetrates into from 5 to 30% of a thickness of the semiconductor layer from the back side and occupies at least 90% of the surface area delimited by the walls. An electrically-conductive layer extends from the lateral wall of the filter all the way to the walls.