Image sensor
    5.
    发明授权

    公开(公告)号:US10903259B2

    公开(公告)日:2021-01-26

    申请号:US16451918

    申请日:2019-06-25

    Abstract: A multispectral image sensor includes a semiconductor layer and a number of pixels formed inside and on top of the semiconductor layer. Each pixel includes an active photosensitive area formed in a portion of the semiconductor layer laterally delimited by peripheral insulating walls. The pixels include a first pixel of a first type and a second pixel of a second type. The portion of semiconductor layer of the first pixel has a first lateral dimension selected to define a lateral cavity resonating at a first wavelength and the portion of semiconductor layer of the second pixel has a second lateral dimension different from the first lateral dimension. The second lateral dimension is selected to define a lateral cavity resonating at a second wavelength different from the first wavelength.

    IMAGE SENSOR
    8.
    发明申请
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20200013820A1

    公开(公告)日:2020-01-09

    申请号:US16451918

    申请日:2019-06-25

    Abstract: A multispectral image sensor includes a semiconductor layer and a number of pixels formed inside and on top of the semiconductor layer. Each pixel includes an active photosensitive area formed in a portion of the semiconductor layer laterally delimited by peripheral insulating walls. The pixels include a first pixel of a first type and a second pixel of a second type. The portion of semiconductor layer of the first pixel has a first lateral dimension selected to define a lateral cavity resonating at a first wavelength and the portion of semiconductor layer of the second pixel has a second lateral dimension different from the first lateral dimension. The second lateral dimension is selected to define a lateral cavity resonating at a second wavelength different from the first wavelength.

    Image sensor with improved quantum efficiency for infrared radiation

    公开(公告)号:US10475836B2

    公开(公告)日:2019-11-12

    申请号:US16414409

    申请日:2019-05-16

    Abstract: An integrated image sensor with backside illumination includes a pixel. The pixel is formed by a photodiode within an active semiconductor region having a first face and a second face. A converging lens, lying in front of the first face of the active region, directs received light rays towards a central zone of the active region. At least one diffracting element, having a refractive index different from a refractive index of the active region, is provided at least partly aligned with the central zone at one of the first and second faces.

    Image sensor with improved quantum efficiency for infrared radiation

    公开(公告)号:US10347677B2

    公开(公告)日:2019-07-09

    申请号:US15460992

    申请日:2017-03-16

    Abstract: An integrated image sensor with backside illumination includes a pixel. The pixel is formed by a photodiode within an active semiconductor region having a first face and a second face. A converging lens, lying in front of the first face of the active region, directs received light rays towards a central zone of the active region. At least one diffracting element, having a refractive index different from a refractive index of the active region, is provided at least partly aligned with the central zone at one of the first and second faces.

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