Abstract:
A MEMS device includes a fixed structure and a mobile structure with a reflecting element coupled to the fixed structure through at least a first deformable structure and a second deformable structure. Each of the first and second deformable structures includes a respective number of main piezoelectric elements, with the main piezoelectric elements of the first and second deformable structures configured to be electrically controlled for causing oscillations of the mobile structure about a first axis and a second axis, respectively. The first deformable structure further includes a respective number of secondary piezoelectric elements configured to be controlled so as to vary a first resonance frequency of the mobile structure about the first axis.
Abstract:
A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.
Abstract:
A mirror micromechanical structure has a mobile mass carrying a mirror element. The mass is drivable in rotation for reflecting an incident light beam with a desired angular range. The mobile mass is suspended above a cavity obtained in a supporting body. The cavity is shaped so that the supporting body does not hinder the reflected light beam within the desired angular range. In particular, the cavity extends as far as a first side edge wall of the supporting body of the mirror micromechanical structure. The cavity is open towards, and in communication with, the outside of the mirror micromechanical structure at the first side edge wall.
Abstract:
Disclosed herein is an optical module including a substrate, with an optical detector, laser emitter, and support structure being carried by the substrate. An optical layer includes a fixed portion carried by the support structure, a movable portion affixed between opposite sides of the fixed portion by a spring structure, and a lens system carried by the movable portion. The movable portion has at least one opening defined therein across which the lens system extends, with at least one supporting portion extending across the at least one opening to support the lens system. The optical layer further includes a MEMS actuator for in-plane movement of the movable portion with respect to the fixed portion.
Abstract:
A microelectromechanical (MEMS) structure includes a fixed frame internally defining a cavity, and a mobile mass suspended in the cavity and movable with a first resonant rotational mode about a first rotation axis and with a second resonant rotational mode about a second rotation axis orthogonal to the first. A pair of supporting elements extends in the cavity, is rigidly coupled to the fixed frame, and is elastically deformable to cause rotation of the mobile mass about the first rotation axis. A pair of elastic-coupling elements is elastically coupled between the mobile mass and the first pair of supporting elements. Each of the elastic-coupling elements includes a first and second elastic portions, the first elastic portion being compliant to torsion about the second rotation axis. The second elastic portion is compliant to bending outside of a horizontal plane of main extension of the MEMS structure.
Abstract:
A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.
Abstract:
A micro-electro-mechanical device is formed by a fixed structure having a cavity. A tiltable structure is elastically suspended over the cavity and has a main extension in a tiltable plane and is rotatable about a rotation axis parallel to the tiltable plane. A piezoelectric actuation structure includes first and second driving arms carrying respective piezoelectric material regions and extending on opposite sides of the rotation axis. The first and the second driving arms are rigidly coupled to the fixed structure and are elastically coupled to the tiltable structure. During operation, a stop structure limits movements of the tiltable structure with respect to the actuation structure along a planar direction perpendicular to the rotation axis. The stop structure has a first planar stop element formed between the first driving arm and the tiltable structure and a second planar stop element formed between the second driving arm and the tiltable structure.
Abstract:
MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
Abstract:
A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
Abstract:
An oscillating structure with piezoelectric actuation includes first and second torsional elastic elements constrained to respective portions of a fixed supporting body and defining an axis of rotation. A mobile element is positioned between, and connected to, the first and second torsional elastic elements by first and second rigid regions. A first control region is coupled to the first rigid region and includes a first piezoelectric actuator. A second control region is coupled to the second rigid region and includes a second piezoelectric actuator. The first and second piezoelectric actuators are configured to cause local deformation of the first and second control regions to induce a torsion of the first and second torsional elastic elements.