公开(公告)号：US20200043976A1

公开(公告)日：2020-02-06

申请号：US16275794

申请日：2019-02-14

Applicant: Samsung Display Co., Ltd.

Inventor： Dong Uk KIM ,  Hyun Min CHO ,  Keun Kyu SONG ,  Dae Hyun KIM ,  Jung Hong MIN ,  Seung A. LEE ,  Hyung Rae CHA

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/60

Abstract: A display device includes a first pixel and a second pixel; a light emitting layer; a color conversion layer on the light emitting layer; and a color filter layer on the color conversion layer, the light emitting layer including one or more light emitting elements in the first pixel and the second pixel, the color conversion layer including a first color conversion layer in the first pixel and a second color conversion layer in the second pixel. The color filter layer includes a first color filter layer in the first pixel and a second color filter layer in the second pixel, the light emitting elements capable of emitting a first light having a first wavelength, each of the first color conversion layer and the second color conversion layer including first color conversion particles and second color conversion particles.

公开(公告)号：US20240038738A1

公开(公告)日：2024-02-01

申请号：US18483444

申请日：2023-10-09

Applicant: Samsung Display Co., LTD.

Inventor： Hyun Min CHO ,  Dae Hyun KIM ,  Dong Uk KIM ,  Jung Hong MIN ,  Seung A LEE ,  Hyung Rae CHA

IPC: H01L25/075 ,  H01L33/00 ,  H01L27/12 ,  H01L33/22 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/0093 ,  H01L27/1214 ,  H01L33/22 ,  H01L33/62 ,  H01L2933/0066

Abstract: Provided are a light emitting device, a method for manufacturing same, and a display device including the light emitting device. The method for manufacturing the light emitting device comprises the steps of: preparing a lower substrate including a substrate and a buffer semiconductor layer formed on the substrate, forming an element rod by forming a separating layer disposed on the lower substrate, forming a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer on the separating layer, and etching the first conductivity type semiconductor layer, the active material layer, the second conductivity type semiconductor layer, and the separating layer in a direction perpendicular to the lower substrate, forming a first insulating layer surrounding an outer circumferential surface of the element rod, forming a second insulating layer surrounding an outer circumferential surface of the first insulating layer and separating the element rod from the lower substrate to form a light emitting element.

公开(公告)号：US20210343894A1

公开(公告)日：2021-11-04

申请号：US17377266

申请日：2021-07-15

Applicant: Samsung Display Co. Ltd.

Inventor： Jung Hong MIN ,  Dae Hyun KIM ,  Hyun Min CHO ,  Jong Hyuk KANG ,  Dong Uk KIM ,  Seung A LEE ,  Hyun Deok IM ,  Hyung Rae CHA

IPC: H01L33/00 ,  H01L33/30

Abstract: Provided is a method of manufacturing a light-emitting element, the method including positioning a substrate, forming a first separation layer, which includes a first sacrificial layer, an etching control layer on the first sacrificial layer, and a second sacrificial layer on the etching control layer, on the substrate, forming at least one first light-emitting element on the first separation layer, and separating the first light-emitting element from the substrate.

公开(公告)号：US20210320231A1

公开(公告)日：2021-10-14

申请号：US17263871

申请日：2019-01-30

Applicant: Samsung Display Co., Ltd.

Inventor： Dong Uk KIM ,  Je Won YOO ,  Hyun Min CHO ,  Jung Hong MIN

IPC: H01L33/50 ,  H01L25/16

Abstract: A light emitting device may include: a substrate; a light emitting element located on the substrate and configured to emit light; a first electrode and a second electrode spaced from each other with the light emitting element interposed therebetween; a color conversion layer located on the substrate and configured to convert light emitted from the light emitting element into light having a specific color; a first contact electrode configured to electrically couple the first electrode with a first end of the light emitting element; and a second contact electrode configured to electrically couple the second electrode with a second end of the light emitting element. In a plan view, the color conversion layer may be spaced from the light emitting element and overlaps with at least one of the first and the second contact electrodes.

公开(公告)号：US20210091255A1

公开(公告)日：2021-03-25

申请号：US17110574

申请日：2020-12-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jung Hong MIN ,  Dae Hyun KIM ,  Seung A LEE ,  Hyun Min CHO ,  Jong Hyuk KANG ,  Dong Uk KIM ,  Hyun Deok IM ,  Hyung Rae CHA

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/32 ,  H01L21/302

Abstract: A light emitting element, a method of manufacturing a light emitting element, and a display device including a light emitting element are provided. A method of manufacturing a light emitting element includes: preparing a lower panel including a substrate and a first sub conductive semiconductor layer on the substrate; forming a first mask layer including at least one mask pattern on at least a part of the lower panel to be spaced apart from each other and an opening region in which the mask patterns are spaced apart from each other; laminating a first conductive semiconductor layer, an active material layer, and a second conductive semiconductor layer on the first mask layer to form an element laminate; etching the element laminate in a vertical direction to form an element rod; and removing the mask pattern to separate the element rod from the lower panel.

公开(公告)号：US20190378953A1

公开(公告)日：2019-12-12

申请号：US16274109

申请日：2019-02-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jung Hong MIN ,  Dae Hyun KIM ,  Seung A LEE ,  Hyun Min CHO ,  Jong Hyuk KANG ,  Dong Uk KIM ,  Hyun Deok IM ,  Hyung Rae CHA

IPC: H01L33/00 ,  H01L33/32 ,  H01L27/15

Abstract: A light emitting element, a method of manufacturing a light emitting element, and a display device including a light emitting element are provided. A method of manufacturing a light emitting element includes: preparing a lower panel including a substrate and a first sub conductive semiconductor layer on the substrate; forming a first mask layer including at least one mask pattern on at least a part of the lower panel to be spaced apart from each other and an opening region in which the mask patterns are spaced apart from each other; laminating a first conductive semiconductor layer, an active material layer, and a second conductive semiconductor layer on the first mask layer to form an element laminate; etching the element laminate in a vertical direction to form an element rod; and removing the mask pattern to separate the element rod from the lower panel.