Abstract:
A thin film transistor array panel according to an exemplary embodiment of the present invention includes: an insulation substrate; a thin film transistor disposed on the insulation substrate, wherein the thin film transistor includes a first electrode; a first contact hole pattern having a first width, wherein the first contact hole pattern exposes a portion of the first electrode, and a first contact hole to expose the portion of the first electrode, wherein an inner sidewall of the first contact hole pattern constitutes a first portion of the first contact hole.
Abstract:
A manufacturing method of a thin film transistor array panel includes: simultaneously forming a gate conductor and a first electrode on a substrate, using a non-peroxide-based etchant; forming a gate insulating layer on the gate conductor and the first electrode; forming a semiconductor, a source electrode, and a drain electrode on the gate insulating layer; forming a passivation layer on the semiconductor, the source electrode, and the drain electrode; and forming a second electrode layer on the passivation layer.
Abstract:
A display device is provided. In the display device, a transparent adhesive layer is disposed between a polarizing layer and a window. The transparent adhesive layer has a planar size smaller than that of the polarizing layer. In addition, a reinforcing member is disposed on a back surface of the window, which corresponds to a non-display area of a first substrate of the display device.
Abstract:
An organic light emitting diode (OLED) display includes a first substrate, a second substrate facing the first substrate, a sealing member interposed between the first substrate and the second substrate, the sealing member including a siloxane material, a semiconductor layer on the first substrate, a planarization layer on the semiconductor layer, and a barrier rib on the planarization layer. The planarization layer or the barrier rib may also include the siloxane material.
Abstract:
A thin film transistor array panel includes a substrate, a gate line and a gate pad disposed on the substrate, a gate insulating layer disposed on the gate line and the gate pad, a data line and a data pad disposed on the gate insulating layer, an organic layer disposed on the data line and the data pad, and a connecting member disposed on one of the gate pad and the data pad, in which the organic layer includes a first portion overlapping the connecting member and a second portion not overlapping the connecting member, and a height of the first portion of the organic layer is greater than a height of the second portion of the organic layer.
Abstract:
The present disclosure provides a thin film transistor array. In an exemplary embodiment, the thin film transistor array includes: a substrate; a gate line including a gate pad and disposed on the substrate; a gate insulating layer disposed on the gate line and the gate pad; a data line including a data pad and disposed on the gate insulating layer; a first passivation layer disposed on the data line; a first electrode disposed on the first passivation layer; a second passivation layer disposed on the first electrode; and a second electrode disposed on the second passivation layer. The gate pad is exposed through a first contact hole, and the gate insulating layer, the first passivation layer, and the second passivation layer include at least a portion of the first contact hole.
Abstract:
A thin film transistor array panel according to an exemplary embodiment of the present invention includes: an insulation substrate; a thin film transistor disposed on the insulation substrate, wherein the thin film transistor includes a first electrode; a first contact hole pattern having a first width, wherein the first contact hole pattern exposes a portion of the first electrode, and a first contact hole to expose the portion of the first electrode, wherein an inner sidewall of the first contact hole pattern constitutes a first portion of the first contact hole.