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公开(公告)号：US20230187844A1
公开(公告)日：2023-06-15
申请号：US18078356
申请日：2022-12-09
发明人： Jongmin LEE , Seungtae KO , Yoongeon KIM , Sanghoon PARK , Jungmin PARK , Bumhee LEE , Seokmin LEE , Seungho CHOI
CPC分类号： H01Q21/065 , H01Q25/001
摘要： The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate after a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna in a wireless communication system may include: a plurality of antenna elements including a first antenna element and a second antenna element, the first antenna element and the second antenna element may include patch antennas, the first antenna element and the second antenna element may be disposed at a narrower interval than a reference interval, and the patch antenna may have an asymmetry structure.
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12.发明申请公开(公告)号：US20210203062A1
公开(公告)日：2021-07-01
申请号：US17108157
申请日：2020-12-01
发明人： Sanghoon PARK , Juneseok LEE , Dohyuk HA , Jungyub LEE , Jinsu HEO , Youngju LEE
摘要： The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
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公开(公告)号：US20210014970A1
公开(公告)日：2021-01-14
申请号：US16883604
申请日：2020-05-26
发明人： Sangwon HA , Seyoung JANG , Sungjin KIM , Sanghoon PARK , Kyungho LEE , Younoh CHI
IPC分类号： H05K1/14 , H01L25/065
摘要： An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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公开(公告)号：US20230299506A1
公开(公告)日：2023-09-21
申请号：US18192910
申请日：2023-03-30
发明人： Sanghoon PARK , Kwanghyun BAEK , Juneseok LEE , Dohyuk HA , Jungho PARK , Youngju LEE , Jungyub LEE , Jinsu HEO
CPC分类号： H01Q21/28 , H01Q1/2283
摘要： The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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15.发明申请公开(公告)号：US20230030388A1
公开(公告)日：2023-02-02
申请号：US17786870
申请日：2020-12-15
发明人： Sanghoon PARK , Juneseok LEE , Dohyuk HA , Jinsu HEO , Youngju LEE
IPC分类号： H01Q1/42
摘要： The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
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公开(公告)号：US20230019144A1
公开(公告)日：2023-01-19
申请号：US17946688
申请日：2022-09-16
发明人： Juneseok LEE , Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Dohyuk HA , Jinsu HEO
摘要： The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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公开(公告)号：US20220352120A1
公开(公告)日：2022-11-03
申请号：US17860531
申请日：2022-07-08
发明人： Eunseok HONG , Sanghoon PARK , Younoh CHI
IPC分类号： H01L25/065 , H01L23/538 , H05K3/46 , H05K1/02 , H05K1/14
摘要： An interposer array is provided, which includes an array substrate, a first interposer configured as a closed curve having a first space therein, a second interposer configured as a closed curve having a second space therein, a plurality of first bridges configured to connect the array substrate and the first interposer, and a plurality of second bridges configured to connect the first interposer and the second interposer.
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公开(公告)号：US20210099560A1
公开(公告)日：2021-04-01
申请号：US16985516
申请日：2020-08-05
发明人： Taewoo KIM , Dui KANG , Bongkyu MIN , Bongchoon PARK , Sanghoon PARK , Jinyong PARK , Hyelim YUN , Hyeongju LEE , Younoh CHI
摘要： An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
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公开(公告)号：US20210022247A1
公开(公告)日：2021-01-21
申请号：US16868941
申请日：2020-05-07
发明人： Sangwon HA , Subyung KANG , Sanghoon PARK , Soohyun SEO , Yongjin WOO , Yeomoon YOON
摘要： An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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