公开(公告)号：US11355365B2

公开(公告)日：2022-06-07

申请号：US16761905

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon Lee ,  Byunghoon Lee ,  Min Park ,  Kyungwoon Jang ,  Jeonggen Yoon ,  Hyuntae Jang

IPC: H01L21/67 ,  B65G47/90 ,  H01L25/075

Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

公开(公告)号：US20250068050A1

公开(公告)日：2025-02-27

申请号：US18678622

申请日：2024-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Munja Kim ,  Jongju Park ,  Byunghoon Lee ,  Yunhan Lee

IPC: G03F1/24

Abstract: A photomask assembly includes a mask pattern providing an upper surface and including a plurality of pins extending in a vertical direction with respect to the upper surface, a pellicle membrane disposed to be spaced apart from the mask pattern in the vertical direction, and a frame assembly configured to support the pellicle membrane, wherein the frame assembly includes a frame body having a plurality of pin holes configured to respectively fasten the plurality of pins, a first magnetic member configured to surround the plurality of pin holes inside the frame body and generate an attractive force on the plurality of pins, and a second magnetic member disposed in a lower portion of the frame body and configured to generate an attractive force on the upper surface of the mask pattern.

公开(公告)号：US11893196B2

公开(公告)日：2024-02-06

申请号：US17833107

申请日：2022-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonggyu Jo ,  Jungchul An ,  Byunghoon Lee

IPC: G06F3/046 ,  B32B7/12 ,  B32B3/30

CPC classification number: G06F3/046 ,  B32B3/30 ,  B32B7/12 ,  B32B2307/732 ,  B32B2457/208 ,  G06F2203/04102

Abstract: An electronic device including a bonding layer in contact with an active area of a digitizer may include: the digitizer, a main magnet attached to a surface of the digitizer, a flexible printed circuit board electrically connected to the digitizer, and a bonding layer connecting the digitizer and the flexible printed circuit board, wherein the flexible printed circuit board includes a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and extension parts extending toward the main magnet from the base part.

公开(公告)号：US11662665B2

公开(公告)日：2023-05-30

申请号：US17672937

申请日：2022-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon Lee ,  Maenghyo Cho ,  Changyoung Jeong ,  Muyoung Kim ,  Junghwan Moon ,  Sungwoo Park ,  Hyungwoo Lee

IPC: G03F7/20 ,  H01L21/027 ,  G03F7/40 ,  G05B19/4099 ,  G06F30/25

CPC classification number: G03F7/705 ,  G03F7/40 ,  G03F7/70033 ,  G03F7/70608 ,  G05B19/4099 ,  G06F30/25 ,  H01L21/0274 ,  G05B2219/45031

Abstract: A lithography method using a multiscale simulation includes estimating a shape of a virtual resist pattern for a selected resist based on a multiscale simulation; forming a test resist pattern by performing an exposure process on a layer formed of the selected resist; determining whether an error range between the test resist pattern and the virtual resist pattern is in an allowable range; and forming a resist pattern on a patterning object using the selected resist when the error range is in the allowable range. The multiscale simulation may use molecular scale simulation, quantum scale simulation, and a continuum scale simulation, and may model a unit lattice cell of the resist by mixing polymer chains, a photo-acid generator (PAG), and a quencher.

公开(公告)号：US11309645B2

公开(公告)日：2022-04-19

申请号：US17061461

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki Kim ,  Byunghoon Lee ,  Min Park ,  Sungtae Park ,  Jungmin Park ,  Yongjae Song ,  Hongshin Shin ,  Woosung Jang ,  Chulwoo Park ,  Chihyun Cho

IPC: H05K5/00 ,  H01R12/62 ,  H05K1/14

Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.

公开(公告)号：US20210005796A1

公开(公告)日：2021-01-07

申请号：US16914863

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyong Min ,  Byunghoon Lee ,  Changjoon Lee ,  Kyungwoon Jang ,  Changkyu Chung

IPC: H01L33/56 ,  H01L33/00 ,  H01L27/15 ,  H01L33/62

Abstract: A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.