公开(公告)号：US10547187B2

公开(公告)日：2020-01-28

申请号：US15446694

申请日：2017-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Geun Yoon ,  Chul Woo Park ,  Min Jeong Lee ,  Ku Chul Jung

IPC: H02J7/00 ,  H01R24/60 ,  H01R107/00

Abstract: An electronic device is provided which includes a connector connected with an external electronic device, a plug connected with an external power source, a power supply circuit that supplies power to the external electronic device through the connector, a first charging module configured to receive first protocol-related charging request information and change a charging voltage and a charging current of the power supply circuit based on the charging request information, a second charging module configured to receive second protocol-related charging request information from the external electronic device, and a processor configured to convert the second protocol-related charging request information to the first protocol-related charging request information and transmit the converted first protocol-related charging request information to the first charging module.

公开(公告)号：US20170358544A1

公开(公告)日：2017-12-14

申请号：US15617973

申请日：2017-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Cheol BAE ,  Chul Woo Park ,  Kwang Sub Lee ,  Sang Gyun Lee ,  Se Young Jang ,  Chi Hyun Cho

IPC: H01L23/64 ,  H01L49/02 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L23/645 ,  H01L23/3128 ,  H01L23/642 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30101 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.

公开(公告)号：US20150248135A1

公开(公告)日：2015-09-03

申请号：US14634545

申请日：2015-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun Hui Han ,  Chul Woo Park ,  Ki Sun Lee

IPC: G05F1/46

CPC classification number: G05F1/462 ,  G05F1/463 ,  G05F1/567 ,  G05F1/569 ,  H02M1/32 ,  H02M2001/327 ,  Y10T307/406

Abstract: A method of controlling current includes receiving a current value detected by at least one regulator supplying a unit-specific voltage to each unit of an electronic device. The method also includes controlling a current flowing through the each unit on the basis of the current value.

Abstract translation: 控制电流的方法包括接收由至少一个调节器检测到的电流值，该调节器向电子设备的每个单元提供单位特定电压。 该方法还包括基于当前值控制流过每个单元的电流。