公开(公告)号：US20240355795A1

公开(公告)日：2024-10-24

申请号：US18659033

申请日：2024-05-09

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Dong-Han Shen ,  Chen-Shien Chen ,  Kuo-Chio Liu ,  Hsi-Kuei Cheng ,  Yi-Jen Lai

IPC分类号： H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/18 ,  H01L25/065

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L25/18 ,  H01L25/0652 ,  H01L2224/24265 ,  H01L2224/25171 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/181 ,  H01L2924/3511

摘要： A package on package structure includes a first package, a plurality of conductive bumps, a second package and an underfill. The conductive bumps are disposed on a second surface of the first package and electrically connected to the first package. The second package is disposed on the second surface of the first package through the conductive bumps, and includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. A shortest distance from an upper surface of the encapsulating material to an upper surface of the semiconductor device is greater than or substantially equal to twice a thickness of the semiconductor device. The underfill is filled between the first package and the second package.

公开(公告)号：US12046588B2

公开(公告)日：2024-07-23

申请号：US17672719

申请日：2022-02-16

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Dong-Han Shen ,  Chen-Shien Chen ,  Kuo-Chio Liu ,  Hsi-Kuei Cheng ,  Yi-Jen Lai

IPC分类号： H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L25/18 ,  H01L25/0652 ,  H01L2224/24265 ,  H01L2224/25171 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/181 ,  H01L2924/3511

摘要： A package on package structure includes a first package, a plurality of conductive bumps, a second package and an underfill. The conductive bumps are disposed on a second surface of the first package and electrically connected to the first package. The second package is disposed on the second surface of the first package through the conductive bumps, and includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. A shortest distance from an upper surface of the encapsulating material to an upper surface of the semiconductor device is greater than or substantially equal to twice a thickness of the semiconductor device. The underfill is filled between the first package and the second package.

公开(公告)号：US12034102B2

公开(公告)日：2024-07-09

申请号：US17371055

申请日：2021-07-08

申请人： NICHIA CORPORATION

发明人： Munetsugu Ehara

IPC分类号： H01L33/58 ,  G02B6/42 ,  H01L33/48 ,  H01L33/62 ,  G02F1/13357

CPC分类号： H01L33/58 ,  G02B6/423 ,  G02B6/4239 ,  H01L33/486 ,  H01L33/62 ,  G02F1/1336 ,  H01L2225/1076 ,  H01L2933/0058 ,  H01L2933/0066

摘要： An LED light source includes a board, a holder, an LED, a fastener, a lens, a supporter, and an adhesive. The board has a first surface. The holder is arranged on or above the first surface. The LED is arranged on or above the first surface. The fastener fastens the LED to the first surface. The lens has an exterior shape larger than the LED as viewed in a plan view, and is arranged on or above an LED upper surface to refract LED light so as to direct the light outward. The supporter is arranged on an exterior with respect to the LED as viewed in a plan view on a lens surface facing the first surface. The supporter is held by the holder for positioning of the lens at a predetermined position on the first surface. The adhesive bonds the supporter and the board together.

公开(公告)号：US20180042110A1

公开(公告)日：2018-02-08

申请号：US15668460

申请日：2017-08-03

申请人： X-Celeprint Limited

发明人： Ronald S. Cok

IPC分类号： H05K1/18 ,  H01L23/00 ,  H01G4/38 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L21/683 ,  H01L21/48

CPC分类号： H05K1/18 ,  H01G4/33 ,  H01G4/38 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/02 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/02311 ,  H01L2224/02371 ,  H01L2224/02381 ,  H01L2225/1035 ,  H01L2225/1076 ,  H05K1/141 ,  H05K1/144 ,  H05K1/162 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/045 ,  H05K2201/09672 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/2072 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/302 ,  H05K2203/308

摘要： A printable electronic component includes a component substrate and a circuit disposed in or on the component substrate. One or more electrically conductive connection posts protrude from the component substrate. One or more electrically conductive component contact pads are exposed on or over the component substrate on a side of the component substrate opposite the one or more connection posts. The one or more component contact pads and the one or more electrically conductive connection posts are both electrically connected to the circuit. The components can be printed onto a destination substrate and electrically connected to contact pads on the destination substrate through the connection posts. The components can also be printed onto other components and electrically connected through the connection posts and component contact pads to form a three-dimensional electronic structure.

公开(公告)号：US09837331B1

公开(公告)日：2017-12-05

申请号：US14924994

申请日：2015-10-28

申请人： Amkor Technology, Inc.

发明人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Hee Yeoul Yoo ,  Jeong Wung Jeong

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/17 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/18301

摘要： Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.

公开(公告)号：US20170162549A1

公开(公告)日：2017-06-08

申请号：US14959072

申请日：2015-12-04

申请人： Teledyne Reynolds, Inc.

发明人： Colleen Louise Khalifa ,  Harry George Kellzi

IPC分类号： H01L25/10

CPC分类号： H01L25/105 ,  H01L2224/16225 ,  H01L2225/107 ,  H01L2225/1076

摘要： The electronic assemblies described in this specification are characterized by a non-planar low-temperature co-fired ceramic substrate on which an electronic device is mounted.

公开(公告)号：US09484275B2

公开(公告)日：2016-11-01

申请号：US14811394

申请日：2015-07-28

申请人： GE Energy Power Conversion Technology Ltd

发明人： Fei Xu ,  Pengcheng Zhu ,  Yingqi Zhang

IPC分类号： H01L23/051 ,  H01L23/22 ,  H01L23/42 ,  H01L23/473 ,  H01L25/065 ,  H01L23/492 ,  H01L23/00 ,  H01L23/12 ,  H01L25/10 ,  H01L23/10 ,  H01L25/07 ,  H01L25/11

CPC分类号： H01L23/051 ,  H01L23/10 ,  H01L23/12 ,  H01L23/22 ,  H01L23/42 ,  H01L23/473 ,  H01L23/492 ,  H01L24/33 ,  H01L24/72 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/105 ,  H01L25/11 ,  H01L25/112 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2225/1047 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module comprising a plurality of electrically conductive top plates, an electrically conductive base plate, a plurality of semiconductor chips installed on the base plate, a first power supply connected to the plates, a second power supply connected to the plates and an electrically insulating outer casing component. The semiconductor chips are individually in contact with the top plates. Each semiconductor chip comprises a first electrode electrically coupled with the base plate, and a second electrical pole electrically coupled with the corresponding top plate. The first power supply connecting plate is equipped with protruding parts that are individually in electrical contact with the top plates. The second power supply connecting plate is electrically connected to the base plate. The outer casing component is used to integrate the first power supply connecting plate and the second power supply connecting plate. The outer casing component comprises at least one opening.

摘要翻译： 一种半导体模块，包括多个导电顶板，导电基板，安装在基板上的多个半导体芯片，连接到所述板的第一电源，连接到所述板的第二电源和电绝缘的 外壳组件。 半导体芯片分别与顶板接触。 每个半导体芯片包括与基板电耦合的第一电极和与相应的顶板电耦合的第二电极。 第一电源连接板配备有与顶板电接触的突出部分。 第二电源连接板电连接到基板。 外壳部件用于集成第一电源连接板和第二电源连接板。 外壳部件包括至少一个开口。

公开(公告)号：US20160049349A1

公开(公告)日：2016-02-18

申请号：US14459319

申请日：2014-08-14

申请人： QUALCOMM Incorporated

发明人： Ryan David LANE ,  Charles David PAYNTER

IPC分类号： H01L23/34 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4334 ,  H01L24/19 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package on package semiconductor structure includes a first package positioned above a first surface of a substrate, a second package positioned above the first package, and a first thermal element positioned between the first package and the second package, wherein the first thermal element is separated from the second package by an air gap and the thermal element provides a heat path for heat generated by the first package.

摘要翻译： 封装半导体结构上的封装包括位于衬底的第一表面上方的第一封装，位于第一封装之上的第二封装以及位于第一封装与第二封装之间的第一热元件，其中第一热元件分离 从第二包装通过气隙，并且热元件为由第一包装产生的热量提供热路径。

公开(公告)号：US09263420B2

公开(公告)日：2016-02-16

申请号：US14097424

申请日：2013-12-05

申请人： Michael B. Vincent ,  Scott M. Hayes

发明人： Michael B. Vincent ,  Scott M. Hayes

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/528 ,  H01L23/53204 ,  H01L23/5328 ,  H01L23/5329 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/12042 ,  H01L2924/1815 ,  H01L2924/00

摘要： Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor.

摘要翻译： 用于形成装置的方法的实施例包括对第一和第二器件对边缘导体的暴露端执行氧化抑制处理，以及形成封装表面导体，以电耦合第一和第二器件对边缘导体的暴露端 。 执行氧化抑制处理可以包括将有机可焊性保护剂涂层施加到暴露端，或者用导电电镀材料电镀暴露端。 该方法还可以包括在包装表面导体上施加保形涂层。 使用这种方法形成的器件的实施例包括封装体，第一和第二器件对边缘导体，封装体表面上的封装表面导体，并且在第一和第二器件对边缘导体之间延伸 ，以及封装表面导体上的保形涂层。

公开(公告)号：US20150162309A1

公开(公告)日：2015-06-11

申请号：US14097424

申请日：2013-12-05

申请人： MICHAEL B. VINCENT ,  SCOTT M. HAYES

发明人： MICHAEL B. VINCENT ,  SCOTT M. HAYES

IPC分类号： H01L25/065 ,  H01L23/29 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/528 ,  H01L23/53204 ,  H01L23/5328 ,  H01L23/5329 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/12042 ,  H01L2924/1815 ,  H01L2924/00

摘要： Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor.

摘要翻译： 用于形成装置的方法的实施例包括对第一和第二器件对边缘导体的暴露端执行氧化抑制处理，以及形成封装表面导体，以电耦合第一和第二器件对边缘导体的暴露端 。 执行氧化抑制处理可以包括将有机可焊性保护剂涂层施加到暴露端，或者用导电电镀材料电镀暴露端。 该方法还可以包括在包装表面导体上施加保形涂层。 使用这种方法形成的器件的实施例包括封装体，第一和第二器件对边缘导体，封装体表面上的封装表面导体，并且在第一和第二器件对边缘导体之间延伸 ，以及封装表面导体上的保形涂层。