公开(公告)号：US20210153300A1

公开(公告)日：2021-05-20

申请号：US17137969

申请日：2020-12-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhong KIM ,  Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Changsoo LEE

IPC: H05B1/02 ,  H05B3/26

Abstract: Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.

公开(公告)号：US20190037644A1

公开(公告)日：2019-01-31

申请号：US16045834

申请日：2018-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhong KIM ,  Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Changsoo LEE

IPC: H05B1/02

Abstract: Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.

公开(公告)号：US20250102906A1

公开(公告)日：2025-03-27

申请号：US18420038

申请日：2024-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwon JEON ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Mijeong KIM ,  Sunyoung LEE ,  Changheon LEE ,  Kyuhyun IM ,  Jungha CHAE ,  Minyoung HA

IPC: G03F7/004 ,  C07F7/22

Abstract: Provided are an organometallic compound represented by one of Formulae 1-1 to 1-4, a resist composition including the same, and a pattern formation method using the resist composition: M11, Q11 to Q14, b11 to b14, R11 to R14, Y11 to Y13, and X11 to X14 in Formulae 1-1 to 1-4 are as described in the specification.

公开(公告)号：US20240319592A1

公开(公告)日：2024-09-26

申请号：US18491310

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changheon LEE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Mijeong KIM ,  Sunyoung LEE ,  Kyuhyun IM ,  Jinwon JEON ,  Jungha CHAE ,  Sunghyun HAN

IPC: G03F7/004 ,  G03F7/038

CPC classification number: G03F7/0042 ,  G03F7/0048 ,  G03F7/0382

Abstract: Provided are a resist composition and a method of forming a pattern using the same, wherein the resist composition may include an organometallic compound represented by Formula 1 below, and a polymer including a repeating unit represented by Formula 2 below.




For a description of M11, R11, R12, n, A21, L21 to L23, A21 to a23, R21 to R22, b22, and p in Formula 1 and Formula 2, the specification is referred to.

公开(公告)号：US20200337119A1

公开(公告)日：2020-10-22

申请号：US16919792

申请日：2020-07-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hiesang SOHN ,  Seyun KIM ,  Haengdeog KOH ,  Doyoon KIM ,  Soichiro MIZUSAKI ,  Jinhong KIM ,  Hajin KIM ,  Minjong BAE ,  Changsoo LEE

IPC: H05B1/02 ,  H05B3/14 ,  B29C70/88 ,  C03C14/00 ,  B29C70/02 ,  C03C4/14 ,  C03C17/00 ,  C03C8/16 ,  C03C8/14 ,  H05B3/26

Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.

公开(公告)号：US20190110337A1

公开(公告)日：2019-04-11

申请号：US16145753

申请日：2018-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haengdeog KOH ,  Hajin KIM ,  Minjong BAE ,  Doyoon KIM ,  Seyun KIM ,  Jinhong KIM ,  Soichiro MIZUSAKI ,  Changsoo Lee

IPC: H05B3/14 ,  C08K9/04 ,  C08K7/00 ,  C08K3/40 ,  C08K9/06 ,  H01B1/14

Abstract: A composition for forming a heating element; a dried and sintered product thereof; and a method of preparing the composition for forming a heating element, the composition including a matrix particle, a composite filler, and a solvent, wherein the composite filler includes a core and a coating layer disposed on the core, the core includes a nanosheet filler, and the composition has a pH in a range of about 5 to about 9.

公开(公告)号：US20180103509A1

公开(公告)日：2018-04-12

申请号：US15452171

申请日：2017-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoon KIM ,  Changsoo LEE ,  Haengdeog KOH ,  Seyun KIM ,  Jinhong KIM ,  Hajin KIM ,  Soichiro MIZUSAKI ,  Minjong BAE ,  Hiesang SOHN

IPC: H05B3/20 ,  F24C7/06 ,  H05B3/14

CPC classification number: H05B3/20 ,  F24C7/06 ,  H05B3/141 ,  H05B3/146 ,  H05B2203/007 ,  H05B2203/011

Abstract: The electric oven includes a case having a tubular shape with an open front face and accommodates food therein, an inner frame in the case, which has a plurality of external surfaces and defining a cavity which is a heating region of the food, a plurality of sheet heaters arranged on the external surfaces of the inner frame, and first and second electrodes connected to opposite edges of each of the sheet heaters, respectively. A plurality of thermal diffusion layers is disposed on corners of the external surfaces of the inner frame.

公开(公告)号：US20170171916A1

公开(公告)日：2017-06-15

申请号：US15374273

申请日：2016-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seyun KIM ,  Soichiro MIZUSAKI ,  Haengdeog KOH ,  Doyoon KIM ,  Hajin KIM ,  Changsoo LEE ,  Intaek HAN

IPC: H05B3/12 ,  C23D7/00 ,  C23D5/02 ,  F24C7/04 ,  H05B3/20

CPC classification number: H05B3/12 ,  C23D5/02 ,  C23D7/00 ,  F24C7/04 ,  H05B3/141 ,  H05B3/20 ,  H05B3/262 ,  H05B2203/013 ,  H05B2203/032 ,  H05B2214/04

Abstract: A heating element includes a matrix material and a nanomaterial filler, wherein the nanomaterial filler includes at least one of a nano-sheet and a nanorod.

公开(公告)号：US20250147419A1

公开(公告)日：2025-05-08

申请号：US18620240

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungha CHAE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Mijeong KIM ,  Sunyoung LEE ,  Jiyoun LEE ,  Changheon LEE ,  Jinwon JEON

IPC: G03F7/027

Abstract: Provided are a resist composition and a pattern formation method using the same, the resist composition including a first organometallic compound represented by one of Formulae 1-1 to 1-4 and a second organometallic compound represented by Formula 2: wherein M11, M21, L11 to L14, L21 to L24, a11 to a14, a21 to a24, R11 to R14, R21 to R24, b11 to b14, b21 to b24, Y11 to Y13, and X11 to X13 in Formulae 1-1 to 1-4 and 2 are as described in the specification.

公开(公告)号：US20250147415A1

公开(公告)日：2025-05-08

申请号：US18635761

申请日：2024-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunyoung LEE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Jiyoun LEE ,  Kyuhyun IM ,  Jinwon JEON ,  Jungha CHAE ,  Minyoung HA

IPC: G03F7/004

Abstract: Provided are a resist composition and a pattern formation method using the same. The resist composition may include an organometallic compound represented by one of Formulae 1-1 to 1-4, and an additive represented by Formula 2: wherein M11, L11 to L14, a11 to a14, R11 to R14, b11 to b14, Y11 to Y13, X11 to X13, Y21, Y22, L21, and a21 in Formulae 1-1 to 1-4 and 2 are described in the specification.