公开(公告)号：US20250089211A1

公开(公告)日：2025-03-13

申请号：US18956878

申请日：2024-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongkil PARK ,  Joseph Ahn ,  Hongki Moon ,  Hajoong Yun

IPC: H05K7/20

Abstract: An electronic device including a frame structure and a housing are provided. The frame structure may include a plate, a plurality of first channels, and a plurality of second channels. The plurality of first channels and the plurality of second channels may form a closed loop in the plate. The plurality of first channels may include a first liquid region and a first gas region.

公开(公告)号：US11895767B2

公开(公告)日：2024-02-06

申请号：US17286007

申请日：2019-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha Koo ,  Hongki Moon ,  Chihwan Jeong ,  Kuntak Kim ,  Yunjeong Park ,  Seungjoo Lee ,  Haejin Lee ,  Seyoung Jang

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K1/18 ,  H05K2201/047

Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

公开(公告)号：US11503745B2

公开(公告)日：2022-11-15

申请号：US16324527

申请日：2017-07-24

Applicant: Samsung Electronics Co., Ltd

Inventor： Hongki Moon ,  Kihyun Kim ,  Jae-Il Seo ,  Jihong Kim ,  Yoon-Sun Park ,  Wooram Lee ,  Se-Young Jang ,  Jongchul Hong ,  Kyungha Koo

IPC: H05K7/20 ,  H02J50/70 ,  H02J7/00 ,  H02J50/10 ,  H02J7/02 ,  H05K5/00

Abstract: According to various embodiments, a wireless charging device can comprise: a first housing, which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and includes at least one hole; a second housing arranged on the second surface of the first housing in the second direction; a coil unit arranged between the first housing and the second housing and configured to transmit power to an external device; a shielding member arranged adjacent to the coil unit and including at least one hole; and a fan arranged adjacent to the coil unit and configured to rotate.

公开(公告)号：US20200241610A1

公开(公告)日：2020-07-30

申请号：US16774618

申请日：2020-01-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck Kwon ,  Jaeyoung Huh ,  Daesuk Kang ,  Seunghoon Kang ,  Boram Kim ,  Hongki Moon ,  Yoonsun Park ,  Kyungwoo Lee ,  Seungjoo Lee ,  Jonghoon Lim

IPC: G06F1/20 ,  H01L23/427

Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

公开(公告)号：US11910516B2

公开(公告)日：2024-02-20

申请号：US17293280

申请日：2019-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongki Moon ,  Yoonsun Park ,  Seunghoon Kang ,  Kyungha Koo ,  Seyoung Jang ,  Woojune Jung

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/14 ,  H05K7/20336 ,  H05K2201/064 ,  H05K2201/10098

Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

公开(公告)号：US11871541B2

公开(公告)日：2024-01-09

申请号：US17673099

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongki Moon ,  Kyungha Koo ,  Yoonsun Park ,  Youngjae You ,  Hyunjoo Lee ,  Joseph Ahn

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/2099 ,  H05K7/20336 ,  H05K7/20963

Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

公开(公告)号：US11714468B2

公开(公告)日：2023-08-01

申请号：US17532518

申请日：2021-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck Kwon ,  Jaeyoung Huh ,  Daesuk Kang ,  Seunghoon Kang ,  Boram Kim ,  Hongki Moon ,  Yoonsun Park ,  Kyungwoo Lee ,  Seungjoo Lee ,  Jonghoon Lim

IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1637 ,  G06F1/206 ,  H01L23/427

Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

公开(公告)号：US11497141B2

公开(公告)日：2022-11-08

申请号：US16577835

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha Koo ,  Kuntak Kim ,  Jihong Kim ,  Hongki Moon ,  Hajoong Yun ,  Haejin Lee ,  Seyoung Jang

IPC: H05K7/20 ,  F28F21/06 ,  F28D15/04

Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

公开(公告)号：US20190258065A1

公开(公告)日：2019-08-22

申请号：US16279056

申请日：2019-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukjin Yun ,  Seunghoon Kang ,  Kyeongsoo Kim ,  Jaecheon Kim ,  Hongki Moon ,  Yoonsun Park ,  Hyunjin Bai ,  Jaewook Jeong ,  Seungbo Hong ,  Jiseong Hwang

IPC: G02B27/01

Abstract: According to various embodiments, an electronic device includes: a housing including: a first plate; a second plate facing a direction opposite a direction of the first plate; and a sidewall surrounding a first space between the first plate and the second plate, the first space being a sealed space; and at least one electronic component arranged in the first space of the housing, wherein at least a part of the sidewall of the housing includes a moisture induction portion configured to induce moisture in the first space to be generated in a moisture induction region of the moisture induction portion that may be due, for example, to a difference in temperature between the first space and an external environment.