METHOD FOR CONTROLLING ANTENNA AND ELECTRONIC DEVICE USING SAME

    公开(公告)号:US20190044577A1

    公开(公告)日:2019-02-07

    申请号:US16158228

    申请日:2018-10-11

    摘要: Various exemplary embodiments of the present disclosure relate to a device and a method for controlling a plurality of antennas in an electronic device. The electronic device may include: a plurality of antennas; a communication circuit configured to be connected to the plurality of antennas; and at least one processor, wherein the processor may be configured to: set a multi-antenna service using a second number of antennas; activate the second number of antennas among the plurality of antennas when a time to transmit channel state information comes; transmit channel state information on the second number of antennas to a network device; and switch to activate a first number of antennas among the plurality of antennas and the second number of antennas may include a greater number of antennas than the first number of antennas. Other exemplary embodiments are possible.

    MEASUREMENT REPORT METHOD FOR FREQUENCY SELECTION OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

    公开(公告)号:US20230388842A1

    公开(公告)日:2023-11-30

    申请号:US18365605

    申请日:2023-08-04

    IPC分类号: H04W24/10 H04W24/08

    CPC分类号: H04W24/10 H04W24/08

    摘要: An electronic device according to various embodiments comprises: a memory and at least one communication processor, the at least one communication processor configured to: confirm a plurality of specified measurement objects (MOs) for measuring the downlink performance of a second communication network, while connected to a first base station of a first communication network; confirm measurement priorities of the plurality of specified MOs based at least on information relating to the transmission/reception performance of signals having a frequency corresponding to the respective plurality of MOs and stored in the memory; measure the reception signal strength with respect to at least one MO from a signal transmitted from a second base station of the second communication network, based on the measurement priorities of the plurality of MOs; and control the electronic device to transmit at least one measurement report (MR) to the first base station of the first communication network, on the basis of the measurement result of the reception signal strength with respect to the at least one MO.

    LOCATION DETERMINATION METHOD AND ELECTRONIC DEVICE FOR SUPPORTING SAME

    公开(公告)号:US20230003529A1

    公开(公告)日:2023-01-05

    申请号:US17903650

    申请日:2022-09-06

    IPC分类号: G01C21/16 G01C21/20

    摘要: An electronic device may include a magnetic sensor and at least one processor operatively connected with the magnetic sensor, wherein the at least one processor may be configured to: collect a plurality of pieces of path data based on first magnetic data related to a plurality of movements of the electronic device, by using the magnetic sensor; identify a plurality of pieces of second magnetic data, which have at least a predetermined level of mutual similarity, from among the plurality of pieces of path data; determine, to be an intersection area related to the plurality of movements of the electronic device, an area range in which the plurality of pieces of second magnetic data are collected; determine, on the basis of the intersection area, a first space and a second space related to the plurality of movements of the electronic device; and determine, on the basis of the third magnetic data acquired by using the magnetic sensor, the space in which the electronic device is located from among the first space and the second space.

    METHOD FOR SETTING RECEPTION BEAM IN ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

    公开(公告)号:US20220149903A1

    公开(公告)日:2022-05-12

    申请号:US17525085

    申请日:2021-11-12

    IPC分类号: H04B7/0417 H04B7/0456

    摘要: An electronic device is provided. The electronic device includes an antenna module, a memory, and a processor controlling to identify a first beam set among a plurality of beam sets stored in the memory, perform beamforming based on the identified first beam set through the antenna module, determine whether a beam pattern is changed, based on, at least, a prediction value of a reception signal strength set corresponding to the first beam set and a measurement value of a signal received through the antenna module, and change a setting related to a reception beam if the beam pattern is determined to be changed.

    METHOD FOR CONTROLLING ANTENNA AND ELECTRONIC DEVICE THEREOF

    公开(公告)号:US20210218158A1

    公开(公告)日:2021-07-15

    申请号:US16092329

    申请日:2017-02-09

    摘要: Various examples of the present invention relate to an apparatus and a method for controlling a connection and an operation of an antenna in an electronic device. Here, the electronic device comprises: a plurality of antenna units arranged in a first region thereof; at least one antenna unit arranged in a second region thereof; a communication circuit, which is connected to the plurality of antenna units arranged in the first region and to at least one antenna unit arranged in the second region; a first switch arranged in an electric path, which connects the plurality of antenna units with the communication circuit; and a second switch arranged in an electric path, which connects the at least one antenna unit with the communication circuit, wherein the first switch and the second switch can be configured to connect the plurality of antenna units with the communication circuit and the at least one antenna unit with the communication circuit, by using a first electric path and a second electric path for connecting the first switch and the second switch. Other examples are possible.

    METHOD FOR RECEIVING REFERENCE SIGNAL AND ELECTRONIC DEVICE THEREFOR

    公开(公告)号:US20200162939A1

    公开(公告)日:2020-05-21

    申请号:US16684892

    申请日:2019-11-15

    IPC分类号: H04W16/28 H04W68/00 H04W56/00

    摘要: An electronic device may receive discontinuous reception (DRX) cycle information from a first cell, may receive synchronization signal block measurement timing information including synchronization signal block measurement window information and synchronization signal block measurement period information, and may receive at least part of a first synchronization signal block from the first cell and at least part of a second synchronization signal block from a second cell neighboring the first cell, at a period indicated by the DRX cycle information based on the synchronization signal block measurement timing information. When reception timing of the first synchronization signal block and reception timing of the second synchronization signal block is less than a specified time duration, the device may receive the at least part of the first synchronization signal block in a first measurement window, and may receive the at least part of the second synchronization signal block within a second measurement window.

    SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
    20.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
    半导体封装及其制造方法

    公开(公告)号:US20170005075A1

    公开(公告)日:2017-01-05

    申请号:US15168236

    申请日:2016-05-30

    IPC分类号: H01L25/065 H01L23/498

    摘要: A semiconductor package includes a first semiconductor chip stacked on a package substrate in which a first surface of the first semiconductor chip faces the package substrate and a second surface that is opposite to the first surface, a second semiconductor chip stacked on the first semiconductor chip that includes a third surface facing the first semiconductor chip and a fourth surface that is opposite to the third surface, and an integral adhesive structure that substantially continuously fills a first space between the package substrate and the first semiconductor chip and a second space between the first and second semiconductor chips. The integral adhesive structure includes an extension protruding from outer sidewalls of the first and second semiconductor chips. The extension has one continuously convex sidewall between a level of the first surface and a level of the fourth surface.

    摘要翻译: 半导体封装包括堆叠在封装基板上的第一半导体芯片,其中第一半导体芯片的第一表面面向封装基板和与第一表面相对的第二表面,堆叠在第一半导体芯片上的第二半导体芯片, 包括面向所述第一半导体芯片的第三表面和与所述第三表面相对的第四表面,以及整体粘合剂结构,其基本上连续地填充所述封装衬底和所述第一半导体芯片之间的第一空间,以及第一空间, 第二个半导体芯片。 整体粘合结构包括从第一和第二半导体芯片的外侧壁突出的延伸部。 该延伸部在第一表面的高度和第四表面的高度之间具有一个连续的凸起的侧壁。