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公开(公告)号：US20250061844A1
公开(公告)日：2025-02-20
申请号：US18935158
申请日：2024-11-01
Inventor： Junsik HWANG , Geonwood YOO , Hojin LEE , Yongchan KIM , Kyungwook HWANG
IPC: G09G3/32
Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.
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公开(公告)号：US20250054813A1
公开(公告)日：2025-02-13
申请号：US18795805
申请日：2024-08-06
Applicant: SAMSUNG ELECTRONICS CO., LTD. , CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
Inventor： Kyungwook HWANG , Jaewook JEONG , Jonghyun JEONG , Minchul YU , Sanghoon SONG , Dongho KIM , Joonyong PARK , Youngtek OH , Junsik HWANG
IPC: H01L21/78 , H01L21/306 , H01L21/67 , H01L33/00 , H01L33/22
Abstract: Provided are a semiconductor chip, a method of preparing a semiconductor chip, and an apparatus for manufacturing a semiconductor chip. The method includes separating a semiconductor chip from a laminate, the laminate including a substrate, a lift-off layer on the substrate, and a semiconductor layer on the lift-off layer. The method further includes removing the lift-off layer with an etchant by applying a magnetic field while contacting the laminate and the etchant, to thereby prepare a semiconductor chip.
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13.发明申请公开(公告)号：US20250022863A1
公开(公告)日：2025-01-16
申请号：US18597506
申请日：2024-03-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Junsik Hwang , Sanghoon Song , Joonyong Park
IPC: H01L25/16 , H01L23/544 , H01L33/38 , H01L33/62
Abstract: A display device and a method of manufacturing the display device are provided. The display device includes a display substrate including a driving circuit; an array layer provided on the display substrate and including a plurality of grooves; a micro-semiconductor chip provided in a groove of the plurality of grooves, the micro-semiconductor chip including: an n-type semiconductor layer; an active layer provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a first electrode provided on the p-type semiconductor layer; and a second electrode connected to the n-type semiconductor layer from a lower surface of the display substrate; a first wiring connected to the first electrode; and a second wiring connected to the second electrode.
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公开(公告)号：US20240178342A1
公开(公告)日：2024-05-30
申请号：US18198089
申请日：2023-05-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngtek OH , Kyungwook HWANG , Dongkyun KIM , Dongho KIM , Joonyong PARK , Sanghoon SONG , Minchul YU , Junsik HWANG
IPC: H01L33/00
CPC classification number: H01L33/005
Abstract: A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.
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公开(公告)号：US20240021661A1
公开(公告)日：2024-01-18
申请号：US18218664
申请日：2023-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jihye YEON , Hankyu SEONG , Suhyun JO , Sammook KANG , Mihyun KIM , Kyungwook HWANG , Junsik HWANG
CPC classification number: H01L27/156 , H01L33/382 , H01L33/502
Abstract: A display apparatus, including a circuit substrate including driver circuits and first bonding electrodes, and a pixel array on the circuit substrate and including a plurality of pixels each including first to third sub-pixels, and second bonding electrodes bonded to the first bonding electrodes, the pixel array further including, a plurality of first LED cells corresponding to the first and third sub-pixels, respectively, and each including a first conductivity-type semiconductor layer, a first active layer, and a second conductivity-type semiconductor layer, a plurality of second LED cells corresponding to the second sub-pixels, respectively, and each including the first conductivity-type semiconductor layer, a second active layer, and the second conductivity-type semiconductor layer, a first electrode extending to cover upper surfaces of the plurality of first and second LED cells and connected to the first conductivity-type semiconductor layers in common.
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Patent Agency Ranking
16.发明公开公开(公告)号：US20240006554A1
公开(公告)日：2024-01-04
申请号：US18215377
申请日：2023-06-28
Inventor： Dongho KIM , Ho Won JANG , Kyungwook HWANG , Junsik HWANG , Sohyeon PARK , Jehong OH , Jungel RYU
CPC classification number: H01L33/24 , H01L33/385 , H01L33/382 , H01L33/405 , H01L33/42 , H01L33/08
Abstract: A light-emitting device may include a plurality of light-emitting rods. Each of the plurality of light-emitting rods may include a first semiconductor layer having a rod shape, an active layer having a shell shape disposed about a plurality of surfaces of the first semiconductor layer, and a second semiconductor layer having a shell shape disposed about a plurality of surfaces of the active layer. The light emitting device may further include an insulating layer disposed in spaces between the plurality of light-emitting rods; a transparent electrode electrically connected to the first semiconductor layer of each of the plurality of light-emitting rods; and a reflective electrode electrically connected to the second semiconductor layer of each of the plurality of light-emitting rods.
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公开(公告)号：US20230274970A1
公开(公告)日：2023-08-31
申请号：US18312655
申请日：2023-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Junsik HWANG
IPC: H01L21/683 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/62
CPC classification number: H01L21/6835 , H01L25/0753 , H01L33/50 , H01L33/52 , H01L33/62 , H01L2221/68309 , H01L2221/68313 , H01L2221/68354 , H01L2221/68368 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.
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公开(公告)号：US20230131855A1
公开(公告)日：2023-04-27
申请号：US17713807
申请日：2022-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjoon KIM , Seogwoo HONG , Kyungwook HWANG , Dongkyun KIM , Joonyong PARK , Junsik HWANG
IPC: H01L33/38 , H01L33/62 , H01L33/24 , H01L25/075 , H01L33/00
Abstract: A light-emitting device and a display apparatus including the light-emitting device are provided. The light-emitting device includes a light-emitting cell including first and second electrodes arranged on an upper surface to be apart from each other, an extended layer in which the light-emitting cell is embedded and which has a width greater than a width of the light-emitting cell, and first and second electrode pads arranged on an upper surface of the extended layer to be apart from each other and respectively electrically connected to the first and second electrode.
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19.发明申请公开(公告)号：US20220416123A1
公开(公告)日：2022-12-29
申请号：US17897821
申请日：2022-08-29
Inventor： Kyungwook HWANG , Sungjin KANG , Euijoon YOON , Junsik HWANG , Jongmyeong KIM , Jehong OH , Jungel RYU , Seungmin LEE
Abstract: Provided are a light-emitting diode (LED) device, a method of manufacturing the LED device, and a display apparatus including the LED device. The LED device includes a light-emitting layer having a core-shell structure, a passivation layer provided to cover a portion of a top surface of the first semiconductor layer, a first electrode provided on the light-emitting layer, and a second electrode provided under the light-emitting layer. The light-emitting layer includes a first semiconductor layer, an active layer, and a second semiconductor layer. The first electrode is provided to contact the first semiconductor layer, and the second electrode is provided to contact the second semiconductor layer.
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公开(公告)号：US20220262784A1
公开(公告)日：2022-08-18
申请号：US17667241
申请日：2022-02-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook HWANG , Junsik HWANG , Dongho KIM , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG
Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.
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