公开(公告)号：US10141255B2

公开(公告)日：2018-11-27

申请号：US15994004

申请日：2018-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： MuSeob Shin ,  Won-young Kim ,  Sanghyun Park ,  Jinchan Ahn

IPC: H01L23/498 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

Abstract: A circuit board and a semiconductor packages therewith are disclosed. The circuit board may include a top surface, on which at least one semiconductor chip is mounted, and a bottom surface, to which at least one outer terminal is coupled. The top surface may include an upper window region, on which an upper conductive pattern electrically connected to the semiconductor chip is provided, and the bottom surface may include a lower window region, on which a lower conductive pattern electrically connected to the upper conductive pattern is provided. Here, a ratio of an area of the lower conductive pattern to an area of the upper conductive pattern may be less than or equal to 1.5.

公开(公告)号：US12112444B2

公开(公告)日：2024-10-08

申请号：US17426538

申请日：2020-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yejin Kim ,  Yoonjeong Kang ,  Iseul Yu ,  Heeyul Kim ,  Sanghyun Park ,  Jongil Jeong

IPC: G06T19/20 ,  G06T7/70 ,  G06T13/40 ,  G06T15/20 ,  G06T19/00 ,  G06V20/30 ,  G06V20/64 ,  G06V40/10 ,  G06V40/16

CPC classification number: G06T19/20 ,  G06T7/70 ,  G06T13/40 ,  G06T15/205 ,  G06T19/006 ,  G06V20/30 ,  G06V40/161 ,  G06V40/169 ,  G06T2207/30201 ,  G06V20/647 ,  G06V40/103 ,  G06V40/16 ,  G06V40/172

Abstract: An electronic device includes a camera, a display, and a processor, wherein the processor is configured to acquire an image using the camera, determine a 3D graphic object corresponding to an object included in the acquired image, and apply the determined 3D graphic object to a 3D avatar and display the same.

公开(公告)号：US11605113B2

公开(公告)日：2023-03-14

申请号：US16727074

申请日：2019-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namjin Kim ,  Junghwan Song ,  Sanghyun Park ,  Yoechan Song

IPC: G06Q30/00 ,  G06Q30/0601 ,  H04L12/28

Abstract: An electronic device and method are disclosed. The device includes a communication module, at least one processor operatively coupled to the communication module, and at least one memory. The processor implements the method, including: retrieving a plurality of service categories, each service category listing services providable to a user using one or more smart devices, and each service category associated with a service capability list of one or more elements indicating whether each service category is to be recommended to the user, receiving user-related information from the external device through the communication module and updating a service capability list of a user using the user-related information, and selecting a service category from among the retrieved plurality of service categories to be recommended to the user by comparing the updated service capability list of the user with the service capability lists associated with each of the plurality of service categories.

公开(公告)号：US20160141182A1

公开(公告)日：2016-05-19

申请号：US14886161

申请日：2015-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangkyun Kim ,  Yun-Jeong Kim ,  Sanghyun Park ,  Se Jung Park ,  Bo Hyeok Choi

IPC: H01L21/308 ,  H01L21/304 ,  C09G1/02

CPC classification number: C09G1/02 ,  H01L21/30625 ,  H01L21/823821 ,  H01L29/1054

Abstract: Provided are slurry compositions for polishing a germanium-containing layer and methods of fabricating a semiconductor device using the same. The slurry composition may include a polishing particle, an oxidizing agent, a polishing accelerator, and a selectivity control agent. The oxidizing agent may include at least one selected from the group consisting of superoxide, dioxygenyl, ozone, ozonide, chlorite, chlorate, perchlorate, halogen compounds, nitric acid, nitrate, hypochlorite, hypohalite, and peroxide.

Abstract translation: 提供了用于研磨含锗层的浆料组合物和使用其的半导体器件的制造方法。 浆料组合物可以包括抛光颗粒，氧化剂，抛光促进剂和选择性控制剂。 氧化剂可以包括选自超氧化物，二氧基，臭氧，臭氧化物，亚氯酸盐，氯酸盐，高氯酸盐，卤素化合物，硝酸，硝酸盐，次氯酸盐，次卤酸盐和过氧化物中的至少一种。

公开(公告)号：US20250087579A1

公开(公告)日：2025-03-13

申请号：US18660712

申请日：2024-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyun Park

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/532

Abstract: A semiconductor device includes an insulating structure, a first interconnection pattern having a first through-hole and disposed on an upper surface of the insulating structure, and a conductive via passing through the first through-hole of the first interconnection pattern and contacting the first interconnection pattern on an internal sidewall of the first through-hole, in which the first interconnection pattern includes a material having first resistivity in a first direction, parallel to the upper surface of the insulating structure, and second resistivity in a second direction, different from the first direction and not parallel to the upper surface of the insulating structure, and the first resistivity is lower than the second resistivity.