公开(公告)号：US20200244408A1

公开(公告)日：2020-07-30

申请号：US16637029

申请日：2018-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joo Seung KIM ,  Young Ju KIM ,  Jung Joon KIM ,  Sung Chul PARK

IPC: H04L5/00 ,  H04L5/14 ,  H04B1/04

Abstract: According to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first RF block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an RF reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and the transceiver performs CA on the signal of the first frequency band and/or the second frequency band and performs diversity on the signals received from the first RF block and the RF reception circuit.

公开(公告)号：US20200243684A1

公开(公告)日：2020-07-30

申请号：US16848145

申请日：2020-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Gun YOU ,  Dong Hyun KIM ,  Byoung-Gi KIM ,  Yun Suk NAM ,  Yeong Min JEON ,  Sung Chul PARK ,  Dae Won HA

IPC: H01L29/78 ,  H01L27/088 ,  H01L21/8238 ,  H01L21/8234 ,  H01L21/762 ,  H01L29/66 ,  H01L23/532 ,  H01L29/06 ,  H01L29/165

Abstract: A semiconductor device includes first and second fin patterns on a substrate and extending apart from each other, a field insulating film on the substrate and surrounding parts of the first and second fin patterns, a first gate structure on the first fin pattern and intersecting the first fin pattern, a second gate structure on the second fin pattern and intersecting the second fin pattern, and a separating structure protruding from a top surface of the field insulating film and separating the first and second gate structures, the field insulating film and the separating structure including a same insulating material.

公开(公告)号：US20190355719A1

公开(公告)日：2019-11-21

申请号：US16372166

申请日：2019-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shigenobu MAEDA ,  Sung Chul PARK ,  Chul Hong PARK ,  Yoshinao HARADA ,  Sung Min KANG ,  Ji Wook KWON ,  Ha-Young KIM ,  Yuichi HIRANO

IPC: H01L27/088 ,  H01L29/06 ,  H01L29/40

Abstract: A semiconductor device includes first to fourth cells sequentially disposed on a substrate, first to third diffusion break structures, a first fin structure configured to protrude from the substrate, the first fin structure comprising first to fourth fins separated from each other by the first to third diffusion break structures, a second fin structure configured to protrude from the substrate, to be spaced apart from the first fin structure, the second fin structure comprising fifth to eighth fins separated from each other by the first to third diffusion break structures, the first to fourth gate electrodes being disposed in the first to fourth cells, respectively, and the number of fins in one cell of the first to fourth cells is different from the number of fins in an other cell of the first to fourth cells.

公开(公告)号：US20170365914A1

公开(公告)日：2017-12-21

申请号：US15625425

申请日：2017-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho HONG ,  Mu Chang SON ,  Sung Chul PARK

IPC: H01Q1/24 ,  H04B7/08 ,  H01Q5/50 ,  H01Q1/38 ,  H04L5/14 ,  H04B7/12

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q3/24 ,  H01Q5/50 ,  H01Q9/42 ,  H01Q21/28 ,  H04B7/0602 ,  H04B7/0802 ,  H04B7/0805 ,  H04B7/12 ,  H04L5/14

Abstract: Disclosed is an electronic device including a first antenna element configured selectively to receive signals of a first frequency band and a second frequency band or of the first frequency band and a third frequency band, a second antenna element configured to receive a signal of the third frequency band, a transceiver configured to be electrically connected with the first antenna element and the second antenna element, and a processor configured to be electrically connected with the transceiver. The electronic device performs carrier aggregation using the second frequency band and the third frequency band.

公开(公告)号：US20250062868A1

公开(公告)日：2025-02-20

申请号：US18938086

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joo Seung KIM ,  Young Ju KIM ,  Jung Joon KIM ,  Sung Chul PARK

IPC: H04L5/00 ,  H04B1/04 ,  H04L5/14

Abstract: According to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first RF block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an RF reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and the transceiver performs CA on the signal of the first frequency band and/or the second frequency band and performs diversity on the signals received from the first RF block and the RF reception circuit.

公开(公告)号：US20210376449A1

公开(公告)日：2021-12-02

申请号：US17401356

申请日：2021-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Chul PARK

IPC: H01Q1/22 ,  H01Q5/307 ,  H01Q13/10 ,  H01Q1/24 ,  H01Q3/40 ,  H01Q21/08 ,  H01Q9/42 ,  H01Q21/28 ,  H01Q1/02

Abstract: An electronic device includes a housing including a first plate, a second plate opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, and including at least part of a conductive material, a flexible printed circuit board (FPCB) attached on an inner surface of the housing, a first antenna element which is included in the FPCB and in which a slot is formed, and a first radio frequency integrated circuit (RFIC) for the first antenna element. An opening is formed in the side member or the second plate of the housing. The FPCB is attached the inner surface of the housing such that at least part in which the slot of the first antenna element is formed is exposed through the opening. At least part of the opening is filled with an insulating material.

公开(公告)号：US20210249757A1

公开(公告)日：2021-08-12

申请号：US17239814

申请日：2021-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong Beom HONG ,  Hyung Wook KIM ,  Sung Chul PARK

IPC: H01Q1/22 ,  H01Q11/14 ,  H01Q5/42 ,  H01Q21/06 ,  H01Q3/26 ,  H01Q21/24 ,  H01Q5/48 ,  H01Q1/24 ,  H01Q21/28 ,  H01Q3/40 ,  H01Q1/52

Abstract: An electronic device is provided. The electronic device may comprise a housing comprising: a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side surface which surrounds the front plate and the back plate, wherein the front plate includes a screen area and a bezel area; a display exposed through the screen area of the front plate; a first circuit board disposed between the display and the back plate and including a first surface facing the display and a second surface facing the back plate; a first antenna array overlaid on the bezel area in the first surface; a second antenna array disposed on the second surface; and a wireless communication circuit disposed on the first circuit board and electrically connected with the first antenna array and the second antenna array, wherein the wireless communication circuit is configured to: form a beam which has directionality in the first direction using the first antenna array and form a beam which has directionality in the second direction using the second antenna array.

公开(公告)号：US20210159596A1

公开(公告)日：2021-05-27

申请号：US16641847

申请日：2018-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Chul PARK ,  Hyo Seok NA

IPC: H01Q3/32 ,  H01Q1/24 ,  H01Q3/24 ,  H04B7/0404 ,  H04B7/06

Abstract: An electronic device includes a housing that includes a cover glass, a rear plate, and a side member, a first antenna array that is positioned adjacent to a first corner of the side member and transmits/receives a first radio frequency (RF) signal corresponding to first data, a second antenna array that is positioned adjacent to a second corner of the side member and transmits/receives a second RF signal corresponding to the first data, a third antenna array that is positioned adjacent to a third corner of the side member and transmits/receives a third RF signal corresponding to second data, a fourth antenna array that is positioned adjacent to a fourth corner of the side member and transmits/receives a fourth RF signal corresponding to the second data, and a communication module. The communication module controls at least one of the arrays such that a beam for transmitting/receiving at least one RF signal of the first, second, third, fourth RF signal is formed.

公开(公告)号：US20200295450A1

公开(公告)日：2020-09-17

申请号：US15733054

申请日：2018-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Chul PARK ,  Hyung Wook KIM

IPC: H01Q1/42 ,  H01Q1/50 ,  H01Q1/38 ,  H04B1/401

Abstract: An electronic device according to an embodiment disclosed in the present document comprises: a housing; a first antenna element placed on the housing, or at a first position inside the housing; a second antenna element placed on the housing, or at a second position inside the housing; a communication processor; and at least one communication circuit electrically connected to the first antenna element and the second antenna element, wherein the at least one communication circuit can comprise: a first RF circuit, which generates an IF signal having a first frequency, a local oscillation (LO) signal of a second frequency lower than the first frequency, and a control signal of a third frequency lower than the second frequency; a second RF circuit, which provides, to the second antenna element, an RF signal of a fourth frequency higher than the third frequency and lower than the second frequency; and a third RF circuit, which receives the IF signal from the first RF circuit, up-converts the IF signal, and provides the up-converted signal to the first antenna element. In addition, various embodiments identified through the specification are possible.

公开(公告)号：US20190131691A1

公开(公告)日：2019-05-02

申请号：US16177535

申请日：2018-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong Beom HONG ,  Hyung Wook KIM ,  Sung Chul PARK

IPC: H01Q1/22 ,  H01Q11/14 ,  H01Q5/42 ,  H01Q1/24 ,  H01Q3/26 ,  H01Q21/24 ,  H01Q5/48 ,  H01Q21/06

Abstract: An electronic device is provided. The electronic device may comprise a housing comprising: a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side surface which surrounds the front plate and the back plate, wherein the front plate includes a screen area and a bezel area; a display exposed through the screen area of the front plate; a first circuit board disposed between the display and the back plate and including a first surface facing the display and a second surface facing the back plate; a first antenna array overlaid on the bezel area in the first surface; a second antenna array disposed on the second surface; and a wireless communication circuit disposed on the first circuit board and electrically connected with the first antenna array and the second antenna array, wherein the wireless communication circuit is configured to: form a beam which has directionality in the first direction using the first antenna array and form a beam which has directionality in the second direction using the second antenna array.