公开(公告)号：US20240302742A1

公开(公告)日：2024-09-12

申请号：US18527056

申请日：2023-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Hwan Park ,  Sungwon Choi ,  Yoonhyun Kwak ,  Jeong Ho Mun ,  Juhyeon Park ,  Songse Yi ,  Hogeun Lee

IPC: G03F7/038 ,  C08F212/14 ,  C08F220/18 ,  C08F230/08 ,  H01L21/027

CPC classification number: G03F7/038 ,  C08F212/30 ,  C08F220/1807 ,  C08F230/08 ,  H01L21/0275

Abstract: A photoresist composition includes a nonionic non-chemically amplified photoresist composition including a photosensitive polymer that includes a first repeating unit having a polarity inversion group and a second repeating unit having a sensitizing group. A method of manufacturing an integrated circuit device includes forming a photoresist film on a feature layer by using the photoresist composition, exposing a first area, which is a portion of the photoresist film, to generate secondary electron from the second repeating unit in the first area and changing a polarity of the first repeating unit by using the secondary electrons in the first area to invert a polarity of the first area, removing a non-exposed area of the photoresist film by using a developer to form a photoresist pattern including the first area, and processing the feature layer by using the photoresist pattern.

公开(公告)号：US11926127B2

公开(公告)日：2024-03-12

申请号：US16929382

申请日：2020-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Chanjae Ahn ,  Sun Jin Song ,  Won Suk Chang ,  Boreum Jeong ,  A Ra Jo ,  Kyeong-Sik Ju ,  Sungwon Choi

IPC: B32B27/34 ,  B32B27/08 ,  B32B27/28 ,  C08G69/26 ,  C08G69/42 ,  C08J7/04 ,  C08J7/046 ,  G02B1/14

CPC classification number: B32B27/34 ,  B32B27/08 ,  B32B27/283 ,  C08G69/265 ,  C08G69/42 ,  C08J7/0427 ,  C08J7/046 ,  G02B1/14 ,  B32B2307/412 ,  B32B2307/536 ,  B32B2457/20 ,  C08J2377/06 ,  C08J2483/04

Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate:






in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.

公开(公告)号：US11898012B2

公开(公告)日：2024-02-13

申请号：US17246926

申请日：2021-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： A Ra Jo ,  Chanjae Ahn ,  Sungwon Choi ,  Won Suk Chang ,  Boreum Jeong

IPC: C08G73/14 ,  C08J5/18 ,  B29C41/00 ,  B29C41/46 ,  C08G73/10 ,  B29L7/00 ,  B29K79/00

CPC classification number: C08G73/14 ,  B29C41/003 ,  B29C41/46 ,  C08G73/1039 ,  C08G73/1042 ,  C08J5/18 ,  B29K2079/08 ,  B29L2007/008 ,  C08J2379/08

Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3:

NH2-A-NH2   Chemical Formula 1











wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US11535711B2

公开(公告)日：2022-12-27

申请号：US16891328

申请日：2020-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Byunghee Sohn ,  Sungwon Choi ,  Sun Jin Song ,  Chanjae Ahn

IPC: C08G73/14 ,  C08L79/08 ,  C09D179/08

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a tetracarboxylic acid dianhydride including a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 4, R1 to R4, A, and X are the same as defined in the specification.

公开(公告)号：US11028227B2

公开(公告)日：2021-06-08

申请号：US16126250

申请日：2018-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： A Ra Jo ,  Chanjae Ahn ,  Sungwon Choi ,  Won Suk Chang ,  Boreum Jeong

IPC: C08G73/14 ,  C08J5/18 ,  B29C41/00 ,  B29C41/46 ,  C08G73/10 ,  B29L7/00 ,  B29K79/00

Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US10689513B2

公开(公告)日：2020-06-23

申请号：US15419019

申请日：2017-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Chanjae Ahn ,  Sungwon Choi ,  Byunghee Sohn ,  A Ra Jo ,  Kyeong-sik Ju ,  Sang Soo Jee ,  Hongkyoon Choi

IPC: C08L79/08 ,  C08G73/10 ,  C08K3/105 ,  C08G69/32 ,  C09D179/08 ,  C08G73/06 ,  C08K5/00 ,  C08K3/16 ,  C08K3/28 ,  C08G73/14

Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) a solution including at least one of (i) a polymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a metallic salt soluble in the solution of the polymer and/or the copolymer, wherein the metallic salt is a salt of a metal selected from a Group 1 element, a Group 11 element, a Group 13 element, and a Group 14 element: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.

公开(公告)号：US10100153B2

公开(公告)日：2018-10-16

申请号：US15291603

申请日：2016-10-12

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sang Soo Jee ,  Hyunjeong Jeon ,  Sungwon Choi ,  Byunghee Sohn ,  Kyeong-sik Ju

IPC: C08G73/00 ,  C08G73/14 ,  C08G73/10 ,  C08J5/18

Abstract: A poly(imide-amide) copolymer includes: an imide structural unit which is a reaction product of a first diamine and a dianhydride, and an amide structural unit which is a reaction product of a second diamine and a diacyl halide, wherein each of the first diamine and the second diamine includes 2,2′-bis-trifluoromethyl-4,4′-biphenyldiamine, and at least one of the first diamine and the second diamine further includes a compound represented by Chemical Formula 1, wherein the dianhydride includes 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-hexafluoroisopropylidene diphthalic anhydride, wherein the diacyl halide includes terephthaloyl chloride (TPCl), and wherein an amount of the compound represented by Chemical Formula 1 is less than or equal to about 10 mole percent based on the total amount of the first diamine and the second diamine: NH2-A-NH2  Chemical Formula 1 wherein in Chemical Formula 1, A is the same as described in the detailed description.