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11.
公开(公告)号:US11664061B2
公开(公告)日:2023-05-30
申请号:US17722494
申请日:2022-04-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngcheon Kwon , Sanghyuk Kwon , Kyomin Sohn , Jaeyoun Youn , Haesuk Lee
IPC: G11C11/406 , G11C11/408
CPC classification number: G11C11/406 , G11C11/4085
Abstract: A memory device according to some aspects of the inventive concepts includes a memory cell array including a plurality of banks, at least one Processing Element (PE) connected to at least one bank selected from the plurality of banks, and a control logic configured to control an active operation in which wordlines included in each of the plurality of banks is activated, and configured to control a refresh operation in which at least one bank is refreshed, based on a PE enable signal configured to selectively enable the at least one PE.
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公开(公告)号:US20220130841A1
公开(公告)日:2022-04-28
申请号:US17496498
申请日:2021-10-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaesan Kim , Seunghan Woo , Haesuk Lee , Youngcheon Kwon , Reum Oh
IPC: H01L27/108 , H01L23/48 , H01L23/528 , H01L29/8605 , H01L29/94
Abstract: A semiconductor device includes a semiconductor structure including a semiconductor substrate having an active zone with a channel; a through silicon via (TSV) structure including a power TSV configured to transmit power and a signal TSV configured to transmit a signal; and a keep-out zone located a predetermined distance away from the TSV structure and bounded by the active zone. The TSV structure penetrates the semiconductor substrate. The keep-out zone includes a first element area a first distance away from the power TSV, and a second element area a second distance away from the signal TSV.
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公开(公告)号:US20220075541A1
公开(公告)日:2022-03-10
申请号:US17335307
申请日:2021-06-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngcheon Kwon , Jaesan Kim , Jemin Ryu , Jaeyoun Youn , Haesuk Lee
Abstract: A memory device according to an aspect may include a memory cell array including a first bank region and a second bank region each including a plurality of banks; an operation logic including one or more first processing elements (PEs) corresponding to the first bank region and one or more second PEs corresponding to the second bank region; a control logic configured to control modes of the first bank region and the second bank region based on externally sourced setting information; first and second mode signal generators configured to control enabling the first PEs, wherein the first mode signal generator is configured to output the first mode signal to enable the first PEs and the second mode signal generator is configured to output the second mode signal to disable the second PEs responsive to the first bank region being set to an operation mode and the second bank region being set to a normal mode.
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14.
公开(公告)号:US20210134345A1
公开(公告)日:2021-05-06
申请号:US16903055
申请日:2020-06-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngcheon Kwon , Sanghyuk Kwon , Kyomin Sohn , Jaeyoun Youn , Haesuk Lee
IPC: G11C11/406 , G11C11/408
Abstract: A memory device according to some aspects of the inventive concepts includes a memory cell array including a plurality of banks, at least one Processing Element (PE) connected to at least one bank selected from the plurality of banks, and a control logic configured to control an active operation in which wordlines included in each of the plurality of banks is activated, and configured to control a refresh operation in which at least one bank is refreshed, based on a PE enable signal configured to selectively enable the at least one PE.
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公开(公告)号:US20230138048A1
公开(公告)日:2023-05-04
申请号:US18145186
申请日:2022-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngcheon Kwon , Jaesan Kim , Jemin Ryu , Jaeyoun Youn , Haesuk Lee
Abstract: A memory device according to an aspect may include a memory cell array including a first bank region and a second bank region each including a plurality of banks; an operation logic including one or more first processing elements (PEs) corresponding to the first bank region and one or more second PEs corresponding to the second bank region; a control logic configured to control modes of the first bank region and the second bank region based on externally sourced setting information; first and second mode signal generators configured to control enabling the first PEs, wherein the first mode signal generator is configured to output the first mode signal to enable the first PEs and the second mode signal generator is configured to output the second mode signal to disable the second PEs responsive to the first bank region being set to an operation mode and the second bank region being set to a normal mode.
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公开(公告)号:US11636885B2
公开(公告)日:2023-04-25
申请号:US17574174
申请日:2022-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngcheon Kwon , Jemin Ryu , Jaeyoun Youn , Haesuk Lee , Jihyun Choi
Abstract: A method of operating a memory device including row pins and column pins includes receiving a first active command through the row pins during 1.5 cycles of a clock signal, receiving a first read command or a first write command through the column pins during 1 cycle of the clock signal, receiving a first precharge command through the row pins during a 0.5 cycle of the clock signal corresponding to a rising edge of the clock signal, receiving a second active command through the row pins during the 1.5 cycles of the clock signal, receiving a second read command or a second write command through the column pins during the 1 cycle of the clock signal, and receiving a second precharge command through the row pins during the 0.5 cycle of the clock signal corresponding to a falling edge of the clock signal.
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公开(公告)号:US11462255B2
公开(公告)日:2022-10-04
申请号:US17239854
申请日:2021-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngcheon Kwon , Jaeyoun Youn , Namsung Kim , Kyomin Sohn , Seongil O , Sukhan Lee
IPC: G11C11/406 , G11C11/4076 , G11C11/408 , G11C7/10
Abstract: A memory device including: a plurality of pins for receiving control signals from an external device; a first bank having first memory cells, wherein the first bank is activated in a first operation mode and a second operation mode; a second bank having second memory cells, wherein the second bank is deactivated in the first operation mode and activated in the second operation mode; a processing unit configured to perform an operation on first data, output from the first memory cells, and second data, output from the second memory cells, in the second operation mode; and a processing-in-memory (PIM) mode controller configured to select mode information, indicating one of the first operation mode and the second operation mode, in response to the control signals and to control at least one memory parameter, at least one mode register set (MRS) value, or a refresh mode according to the mode information.
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公开(公告)号:US11416178B2
公开(公告)日:2022-08-16
申请号:US17014667
申请日:2020-09-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunsung Shin , Sanghyuk Kwon , Youngcheon Kwon , Sukhan Lee , Haesuk Lee
Abstract: A memory device includes a memory bank including a plurality of banks, each including a memory cell array; a calculation logic including a plurality of processor-in-memory (PIM) circuits arranged in correspondence to the banks, each of the plurality of PIM circuits performing calculation processing using at least one selected from data provided from a host and information read from a corresponding bank among the banks; and a control logic configured to control a memory operation on the memory bank in response to a command and/or an address, each received from the host, or to control the calculation logic to perform the calculation processing, wherein reading operations are respectively performed in parallel on the banks for the calculation processing, offsets having different values are respectively configured for the banks, and information is read from different positions in respective memory cell arrays of the banks and provided to the PIM circuits.
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公开(公告)号:US11170868B2
公开(公告)日:2021-11-09
申请号:US16864787
申请日:2020-05-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yesin Ryu , Sanguhn Cha , Sunghye Cho , Kijun Lee , Myungkyu Lee , Youngcheon Kwon , Jaeyoun Youn
Abstract: A semiconductor memory device includes a memory cell array and an interface circuit including an error correction code (ECC) engine. The memory cell array includes a plurality of volatile memory cells, a normal cell region and a parity cell region. The interface circuit, in a write operation, receives main data and first parity data from an external device, the first parity data being generated based on a first ECC and stores the main data in the normal cell region and the first parity data in the parity cell region. The interface circuit, in a read operation, performs an ECC decoding on the main data using a second ECC, based on the first parity data to correct a first type of error in the main data. The second ECC has a parity check matrix which is the same as a parity check matrix of the first ECC.
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