公开(公告)号：US20250044685A1

公开(公告)日：2025-02-06

申请号：US18755491

申请日：2024-06-26

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Changsoo WOO ,  Seol Hee LIM ,  Minyoung LEE ,  Jimin KIM

IPC: G03F7/004 ,  G03F1/80 ,  G03F7/11 ,  G03F7/16 ,  G03F7/20

Abstract: A semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent. A method of forming (or providing) patterns utilizing the same is provided. (R1)n1-M-[(X)—R2]m1  [Chemical Formula 1]

公开(公告)号：US20240241437A1

公开(公告)日：2024-07-18

申请号：US18473132

申请日：2023-09-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seol Hee LIM ,  Changsoo WOO ,  Young Keun KIM ,  Dong Wan RYU ,  Soobin LIM ,  Sukil KANG ,  Eunmi KANG

IPC: G03F7/004 ,  C07F7/22

CPC classification number: G03F7/0042 ,  C07F7/2284

Abstract: A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are disclosed. The semiconductor photoresist composition may include an organotin compound represented by Chemical Formula 1 and a solvent.

公开(公告)号：US20240061336A1

公开(公告)日：2024-02-22

申请号：US18323358

申请日：2023-05-24

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Changsoo WOO ,  Seung HAN ,  Seungyong CHAE ,  Minyoung LEE ,  Jimin KIM ,  Sumin JANG ,  Sangkyun IM ,  Yaeun SEO ,  Eunmi KANG ,  Soobin LIM ,  Kyungsoo MOON

IPC: G03F7/039 ,  G03F7/004

CPC classification number: G03F7/039 ,  G03F7/0045 ,  G03F7/0044

Abstract: A semiconductor photoresist composition and a method of forming patterns utilizing the semiconductor photoresist composition are disclosed. The semiconductor photoresist composition may include a first organometallic compound represented by Chemical Formula 1, a second organometallic compound represented by Chemical Formula 2, and a solvent, where the first organometallic compound is different from the second organometallic compound, at least one selected from among R1 and L1 may include a tertiary carbon, and at least one selected from among R2 and L2 may include at least one selected from among a primary carbon and a secondary carbon.

公开(公告)号：US20230223262A1

公开(公告)日：2023-07-13

申请号：US18000917

申请日：2021-08-20

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyungsoo MOON ,  Eunmi KANG ,  Jaehyun KIM ,  Jimin KIM ,  Taeho KIM ,  Changsoo WOO ,  Hwansung CHEON ,  Seungyong CHAE ,  Seung HAN

IPC: H01L21/027 ,  H01L21/3213 ,  H01L21/311

CPC classification number: H01L21/0274 ,  H01L21/32135 ,  H01L21/32139 ,  H01L21/31116

Abstract: Disclosed are a semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition. The semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent and a method of forming patterns using the same.

公开(公告)号：US20230037563A1

公开(公告)日：2023-02-09

申请号：US17858924

申请日：2022-07-06

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ryunmin HEO ,  Hyungrang MOON ,  Minyoung LEE ,  Minsoo KIM ,  Youngkwon KIM ,  Jaehyun KIM ,  Changsoo WOO ,  Jung Min CHOI ,  Moohyun KOH ,  Jungah KIM ,  Sungan DO ,  Sang Won BAE ,  Hoon HAN ,  SukKoo HONG

IPC: G03F7/32

Abstract: A metal-containing photoresist developer composition, and a method of forming patterns including a step of developing using the same are provided. The metal-containing photoresist developer composition includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxy group (—OH). The heptagonal ring compound has at least two double bonds in the ring.

公开(公告)号：US20220197138A1

公开(公告)日：2022-06-23

申请号：US17454453

申请日：2021-11-10

Applicant: Samsung SDI Co., Ltd.

Inventor： Kyungsoo MOON ,  Eunmi KANG ,  Jaehyun KIM ,  Jimin KIM ,  Changsoo WOO ,  Hwansung CHEON ,  Seungyong CHAE ,  Seung HAN

IPC: G03F7/004 ,  C07F7/22

Abstract: A semiconductor photoresist composition and a method of forming patterns utilizing the same are provided. The semiconductor photoresist composition includes a condensed product produced by a condensation reaction between an organotin compound represented by Chemical Formula 1 and at least one organic acid compound selected from a substituted organic acid, an organic acid including at least two acid functional groups, and a substituted or unsubstituted sulfonic acid; and a solvent. Specific details of Chemical Formula 1 are as defined in the specification.