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公开(公告)号:US20210333708A1
公开(公告)日:2021-10-28
申请号:US17365926
申请日:2021-07-01
Applicant: SAMSUNG SDI CO., LTD.
Inventor: Kyung Soo MOON , Jaehyun KIM , Yoong Hee NA , Ran NAMGUNG , Hwansung CHEON , Seungyong CHAE
IPC: G03F7/004 , H01L21/027 , G03F7/20 , H01L21/3213 , H01L21/311
Abstract: This disclosure relates to a semiconductor resist composition including an organometallic compound represented by Chemical Formula 1 and a solvent, and to a method of forming patterns using the composition:
Chemical Formula 1 wherein, in Chemical Formula 1, R1 is an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or an -alkyl-O-alkyl group, and R2 to R4 are each independently selected from —ORa and —OC(═O)Rb.-
公开(公告)号:US20210325781A1
公开(公告)日:2021-10-21
申请号:US17361235
申请日:2021-06-28
Applicant: SAMSUNG SDI CO., LTD.
Inventor: Kyung Soo MOON , Jaehyun KIM , Yoong Hee NA , Ran NAMGUNG , Hwansung CHEON , Seungyong CHAE
IPC: G03F7/004 , H01L21/02 , G03F7/09 , C07F7/22 , G03F7/075 , H01L21/467 , H01L21/475 , H01L21/47 , G03F1/22
Abstract: This disclosure relates to a semiconductor resist composition including an organometallic compound represented by Chemical Formula 1 and a solvent, and to a method of forming patterns using the composition:
Chemical Formula 1 wherein, in Chemical Formula 1, R1 is an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or an -alkylene-O-alkyl group, and R2 to R4 are each independently selected from —ORa and —OC(═O)Rb.-
3.
公开(公告)号:US20210311387A1
公开(公告)日:2021-10-07
申请号:US17217941
申请日:2021-03-30
Applicant: Samsung SDI Co., Ltd.
Inventor: Changsoo WOO , Eunmi KANG , Jaehyun KIM , Jimin KIM , Taeho KIM , Ran NAMGUNG , Kyungsoo MOON , Hwansung CHEON , Seungyong CHAE , Seung HAN
IPC: G03F7/004 , C07F7/22 , H01L21/027
Abstract: A semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1, a photoacid generator (PAG), and a solvent: In Chemical Formula 1, R is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C2 to C20 aliphatic unsaturated organic group including at least one double bond or triple bond, a substituted or unsubstituted C6 to C30 aryl group, an ethoxy group, a propoxy group, or a combination thereof; and X, Y, and Z are each independently —OR1 or —OC(═O)R2.
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4.
公开(公告)号:US20200041896A1
公开(公告)日:2020-02-06
申请号:US16211114
申请日:2018-12-05
Applicant: Samsung SDI Co., Ltd.
Inventor: Kyung Soo MOON , Jaehyun KIM , Yoong Hee NA , Ran NAMGUNG , Hwansung CHEON , Seungyong CHAE
IPC: G03F7/004 , H01L21/027 , H01L21/311 , H01L21/3213 , G03F7/20
Abstract: This disclosure relates to a semiconductor resist composition including an organometallic compound represented by Formula 1 and a solvent, and to a method of forming patterns using the composition: wherein L includes at least one alkylene group in the main chain. A pattern formed by using the semiconductor resist composition may not collapse while having a high aspect ratio.
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5.
公开(公告)号:US20210356861A1
公开(公告)日:2021-11-18
申请号:US17306820
申请日:2021-05-03
Applicant: Samsung SDI Co., Ltd.
Inventor: Seung HAN , Jaehyun KIM , Kyungsoo MOON , Changsoo WOO , Seungyong CHAE , Ran NAMGUNG , Hwansung CHEON
IPC: G03F7/004 , C07F7/22 , H01L21/027
Abstract: A semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1, an organic acid having a vapor pressure of less than or equal to about 1.0 mmHg at 25° C., and a pKa of about 3 to about 5, and a solvent. A method of forming photoresist patterns utilizes the composition.
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6.
公开(公告)号:US20210109442A1
公开(公告)日:2021-04-15
申请号:US17036693
申请日:2020-09-29
Applicant: Samsung SDI Co., Ltd.
Inventor: Kyungsoo MOON , Eunmi KANG , Jaehyun KIM , Jimin KIM , Ran NAMGUNG , Changsoo WOO , Hwansung CHEON , Seungyong CHAE , Seung HAN
IPC: G03F7/004 , C07F7/22 , H01L21/311 , H01L21/3213 , H01L21/027
Abstract: Disclosed are a semiconductor photoresist composition including an organometallic compound including at least one selected from compounds represented by Chemical Formulae 1 to 3 and a solvent, and a method of forming patterns using the semiconductor photoresist composition on an etching-objective layer to form a photoresist layer, patterning the photoresist layer to form a photoresist pattern, and etching the etching-objective layer using the photoresist pattern as an etching mask.
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7.
公开(公告)号:US20200041897A1
公开(公告)日:2020-02-06
申请号:US16211145
申请日:2018-12-05
Applicant: Samsung SDI Co., Ltd.
Inventor: Kyung Soo MOON , Jaehyun KIM , Yoong Hee NA , Ran NAMGUNG , Hwansung CHEON , Seungyong CHAE
IPC: G03F7/004 , H01L21/027 , H01L21/311 , H01L21/3213 , G03F7/20
Abstract: This disclosure relates to a semiconductor resist composition including an organometallic compound represented by Chemical Formula 1 and a solvent, and to a method of forming patterns using the composition: wherein, in Chemical Formula 1, R1 is an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or an -alkyl-O-alkyl group, and R2 to R4 are each independently selected from —ORa and —OC(═O)Rb.
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公开(公告)号:US20230223262A1
公开(公告)日:2023-07-13
申请号:US18000917
申请日:2021-08-20
Applicant: SAMSUNG SDI CO., LTD.
Inventor: Kyungsoo MOON , Eunmi KANG , Jaehyun KIM , Jimin KIM , Taeho KIM , Changsoo WOO , Hwansung CHEON , Seungyong CHAE , Seung HAN
IPC: H01L21/027 , H01L21/3213 , H01L21/311
CPC classification number: H01L21/0274 , H01L21/32135 , H01L21/32139 , H01L21/31116
Abstract: Disclosed are a semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition. The semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent and a method of forming patterns using the same.
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9.
公开(公告)号:US20220197138A1
公开(公告)日:2022-06-23
申请号:US17454453
申请日:2021-11-10
Applicant: Samsung SDI Co., Ltd.
Inventor: Kyungsoo MOON , Eunmi KANG , Jaehyun KIM , Jimin KIM , Changsoo WOO , Hwansung CHEON , Seungyong CHAE , Seung HAN
Abstract: A semiconductor photoresist composition and a method of forming patterns utilizing the same are provided. The semiconductor photoresist composition includes a condensed product produced by a condensation reaction between an organotin compound represented by Chemical Formula 1 and at least one organic acid compound selected from a substituted organic acid, an organic acid including at least two acid functional groups, and a substituted or unsubstituted sulfonic acid; and a solvent. Specific details of Chemical Formula 1 are as defined in the specification.
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公开(公告)号:US20210111244A1
公开(公告)日:2021-04-15
申请号:US17064454
申请日:2020-10-06
Applicant: Samsung SDI Co., Ltd.
Inventor: Yong Tae KIM , Bukeun OH , Gyeong Ryeong BAK , Taegeun SEONG , Sangkyun IM , Seol Hee LIM , Hwansung CHEON
IPC: H01L49/02 , C09D5/24 , C09D7/63 , H01L27/108
Abstract: Disclosed are a composition for depositing a thin film including an organometallic compound including strontium, barium, or a combination thereof; and at least one unshared electron pair-containing compound represented by Chemical Formula 1, a method of manufacturing a thin film using the composition for depositing the thin film, and the thin film manufactured from the composition for depositing the thin film, and a semiconductor device including the thin film.
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