公开(公告)号：US20230223262A1

公开(公告)日：2023-07-13

申请号：US18000917

申请日：2021-08-20

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyungsoo MOON ,  Eunmi KANG ,  Jaehyun KIM ,  Jimin KIM ,  Taeho KIM ,  Changsoo WOO ,  Hwansung CHEON ,  Seungyong CHAE ,  Seung HAN

IPC: H01L21/027 ,  H01L21/3213 ,  H01L21/311

CPC classification number: H01L21/0274 ,  H01L21/32135 ,  H01L21/32139 ,  H01L21/31116

Abstract: Disclosed are a semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition. The semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent and a method of forming patterns using the same.

公开(公告)号：US20220197138A1

公开(公告)日：2022-06-23

申请号：US17454453

申请日：2021-11-10

Applicant: Samsung SDI Co., Ltd.

Inventor： Kyungsoo MOON ,  Eunmi KANG ,  Jaehyun KIM ,  Jimin KIM ,  Changsoo WOO ,  Hwansung CHEON ,  Seungyong CHAE ,  Seung HAN

IPC: G03F7/004 ,  C07F7/22

Abstract: A semiconductor photoresist composition and a method of forming patterns utilizing the same are provided. The semiconductor photoresist composition includes a condensed product produced by a condensation reaction between an organotin compound represented by Chemical Formula 1 and at least one organic acid compound selected from a substituted organic acid, an organic acid including at least two acid functional groups, and a substituted or unsubstituted sulfonic acid; and a solvent. Specific details of Chemical Formula 1 are as defined in the specification.

公开(公告)号：US20200041901A1

公开(公告)日：2020-02-06

申请号：US16211068

申请日：2018-12-05

Applicant: Samsung SDI Co., Ltd.

Inventor： Ran NAMGUNG ,  Jaehyun KIM ,  Yoong Hee NA ,  Kyung Soo MOON ,  Hwansung CHEON ,  Seungyong CHAE

IPC: G03F7/038 ,  H01L21/308 ,  G03F7/20 ,  G03F7/16 ,  G03F7/004

Abstract: This disclosure relates to a semiconductor resist composition including an organometallic compound including a structural unit represented by Chemical Formula 1 and a solvent, and to a method of forming patterns using the composition: wherein in Chemical Formula 1, carbon bonded with a central metal atom (M) forms a benzylic bond with a ring group having a conjugated structure, such as an aromatic ring group, a heteroaromatic ring group, or a combination thereof.