摘要:
Disclosed herein is a device that includes a capacitor, a pumping circuit supplying a pumping signal changed between first and second potential to a first electrode of the capacitor, and an output circuit precharging a second electrode of the capacitor to a third potential different from the first and second potentials. The second electrode of the capacitor is thereby changed from the third potential to a fourth potential higher than the third potential when the pumping signal is changed from the first potential to the second potential.
摘要:
A device includes a first sense amplifier array including a plurality of first sense amplifiers arranged in a first direction, each of the first sense amplifiers including first and second nodes, a plurality of first global bit lines extending in a second direction crossing the first direction, the first global bit lines being arranged in the first direction on a left side of the first sense amplifier array so that the first global bit lines being operatively connected to the first node of an associated one of the first sense amplifiers, and a plurality of second global bit lines extending in the second direction, the second global bit lines being arranged in the first direction on a right side of the first sense amplifier array so that the second global bit lines being operatively connected to the second node of the associated one of the first sense amplifiers.
摘要:
A device includes a first sense amplifier array including a plurality of first sense amplifiers arranged in a first direction, each of the first sense amplifiers including first and second nodes, a plurality of first global bit lines extending in a second direction crossing the first direction, the first global bit lines being arranged in the first direction on a left side of the first sense amplifier array so that the first global bit lines being operatively connected to the first node of an associated one of the first sense amplifiers, and a plurality of second global bit lines extending in the second direction, the second global bit lines being arranged in the first direction on a right side of the first sense amplifier array so that the second global bit lines being operatively connected to the second node of the associated one of the first sense amplifiers.
摘要:
A semiconductor device in the present invention comprises pair transistors composed of a first transistor and a second transistor. The pair transistors are arrayed in a repeating pattern in the row direction. The first transistor and the second transistor are mutually related to each other so that the drain of one transistor is connected to the gate of the other transistor. The gate of the first transistor and the gate of the second transistor are offset in the row direction. The first transistor and the second transistor are in a diagonal positional relationship.
摘要:
To include memory mats each including a sense amplifier that amplifies a potential difference between global bit lines, a plurality of hierarchy switches connected to the global bit lines, and a plurality of local bit lines connected to the global bit lines via the hierarchy switches, and a control circuit that activates the hierarchy switches. The control circuit activates hierarchy switches that are located in the same distance from the sense amplifier along the global bit lines. According to the present invention, because there is no difference in the parasitic CR distributed constant regardless of a local bit line to be selected, it is possible to prevent the sensing sensitivity from being degraded.
摘要:
A semiconductor memory device includes multiple mats arranged in an array, each including multiple memory cells storing a charge as information, and multiple power-supply lines, one end of each line of the lines being connected in common to an internal power supply which decreases or increases a voltage which is supplied from an external power source. The power-supply lines extend in a given direction in an area in which the multiple mats are formed and the other end of each line of the multiple power-supply lines is connected in common on the edge mat.
摘要:
Disclosed is a semiconductor memory device in which pads on a chip which are wire-bonded to lands for solder-balls of a package, respectively, are arranged on first and second sides of the chip facing to each other and are disposed on a third side of the chip as well. Four sets of the pads for data signals are respectively disposed on four regions obtained by dividing the first and second sides into the four regions. Pads for command/address signals are arranged on the third side, thereby increasing layout space for bond fingers for the data signals and achieving uniformity in wiring for data signals.
摘要:
A semiconductor device in the present invention comprises pair transistors composed of a first transistor and a second transistor. The pair transistors are arrayed in a repeating pattern in the row direction. The first transistor and the second transistor are mutually related to each other so that the drain of one transistor is connected to the gate of the other transistor. The gate of the first transistor and the gate of the second transistor are offset in the row direction. The first transistor and the second transistor are in a diagonal positional relationship.
摘要:
A method for refreshing memory cells in a DRAM includes receiving a refresh command, receiving a refresh mode specifying signal in synchronization with the refresh command, refreshing a first quantity of memory cells when the refresh mode specifying signal has a first value, and refreshing a second quantity of memory cells, at least double the first quantity, when the refresh mode specifying signal has a second value.
摘要:
A method for sensing data in an open bit line dynamic random access memory includes activating a word line in a first memory block of a first memory mat to transfer charge from memory cells to first sub-bit lines, the first memory mat being between a second memory mat and a third memory mat, activating first hierarchy switches corresponding to the first memory block to transfer charge from first sub-bit lines to global bit lines of the first memory mat, and activating second hierarchy switches corresponding to a second memory block in a second memory mat, to connect sub-bit lines to global bit lines of the second memory mat, the first memory block and the second memory block being equidistant from a first sense amplifier array located between the first memory mat and the second memory mat.