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公开(公告)号：US11373804B2
公开(公告)日：2022-06-28
申请号：US16967610
申请日：2019-01-30
Applicant: Siemens Aktiengesellschaft
Inventor： Wilhelm Meyrath , Franz Pfleger , Peter Prankh , Jörg Strogies , Bernd Müller , Klaus Wilke , Matthias Heimann
Abstract: Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.
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公开(公告)号：US11289425B2
公开(公告)日：2022-03-29
申请号：US16633301
申请日：2018-07-03
Applicant: Siemens Aktiengesellschaft
Inventor： Rene Blank , Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Jörg Strogies , Klaus Wilke
Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.
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公开(公告)号：US20210242187A1
公开(公告)日：2021-08-05
申请号：US16967655
申请日：2019-01-14
Applicant: Siemens Aktiengesellschaft
Inventor： Wilhelm Meyrath , Franz Pfleger , Peter Prankh , Jörg Strogies , Bernd Müller , Klaus Wilke , Matthias Heimann
IPC: H01L25/11 , H01L23/473 , H01L23/495
Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
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公开(公告)号：US20200161246A1
公开(公告)日：2020-05-21
申请号：US16633301
申请日：2018-07-03
Applicant: Siemens Aktiengesellschaft
Inventor： Rene Blank , Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Jörg Strogies , Klaus Wilke
Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.
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公开(公告)号：US20250063708A1
公开(公告)日：2025-02-20
申请号：US18722375
申请日：2022-11-16
Applicant: Siemens Aktiengesellschaft
Inventor： Bernd Müller , Ulrich Wittreich , Kay Jarchoff , Michael Hanisch , Michael Erdmann , Carsten Borwieck
Abstract: Various embodiments of the teachings herein include a method for operating an electronics production line for producing electronic assemblies. The electronics production line comprises a device to apply joining material onto component carriers, an assembly device to place electronic components onto the component carriers, a joining device to join the electronic components to the component carriers, and a transport to transport the component carriers through the production line. An example method includes: transporting a process parameter acquisition system through the electronics production line on the transport; measuring actual process parameter values with the process parameter acquisition system; providing setpoint process parameter values; determining any deviations between actual and setpoint process parameter values; and providing a dataset including the deviations.
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Patent Agency Ranking
公开(公告)号：US20250061564A1
公开(公告)日：2025-02-20
申请号：US18807656
申请日：2024-08-16
Applicant: Siemens Aktiengesellschaft
Inventor： Ulrich Wittreich , Rene Blank , Michael Hanisch , Marco Matiwe , Dennis Sommerfeld , Kay Jarchoff , Bernd Müller
Abstract: Various embodiments of the teachings herein include a method for monitoring a flux application in a soldering process. An example includes: defining flux wetting surfaces in relation to an image of an application surface; generating a thermographic recording of the application surface selectively provided with liquid flux; defining adjustment points on the application surface which can be identified on the image and on the thermographic recording; superimposing the image and the thermographic recording on the basis of the adjustment points; and comparing the position of temperature anomalies on the application surface identified by the thermographic recording with the position of the flux wetting surfaces on the image.
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公开(公告)号：US20220285311A1
公开(公告)日：2022-09-08
申请号：US17630030
申请日：2020-06-15
Applicant: Siemens Aktiengesellschaft
Inventor： Matthias Heimann , Bernd Müller , Christian Nachtigall-Schellenberg , Jörg Strogies , Klaus Wilke
IPC: H01L23/00 , H01L23/498 , H01L21/48 , H01L21/683
Abstract: Various embodiments include a method for installing an electronic assembly having a die and a substrate with a reference plane. The method may include: providing a product carrier having recesses with varying dimensions different from one another; and arranging planar molded parts, joining materials, and the die on the product carrier. The die is in electrical contact with at least one planar molded part and at least one joining material. The method further includes forming functional elements from the planar molded parts and/or the die and the joining materials, the functional elements supporting the substrate and electrically contacting the reference plane.
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公开(公告)号：US11373984B2
公开(公告)日：2022-06-28
申请号：US17046974
申请日：2019-04-17
Applicant: Siemens Aktiengesellschaft
Inventor： Jörg Strogies , Klaus Wilke , Bernd Müller
IPC: H01L25/07 , H01L23/367 , H01L23/48 , H01L23/498
Abstract: Various embodiments include a power module comprising: a first power electronics device arranged on a first substrate board; and a second power electronics device mounted on a second substrate board. The first substrate board, the first device, the second substrate board, and the second device are arranged on a first baseplate stacked above one another or in planar fashion beside one another.
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公开(公告)号：US11282822B2
公开(公告)日：2022-03-22
申请号：US16967655
申请日：2019-01-14
Applicant: Siemens Aktiengesellschaft
Inventor： Wilhelm Meyrath , Franz Pfleger , Peter Prankh , Jörg Strogies , Bernd Müller , Klaus Wilke , Matthias Heimann
IPC: H01L25/16 , H01L25/18 , H01L25/11 , H01L23/64 , H01L23/473 , H01L23/495
Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
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公开(公告)号：US11212918B2
公开(公告)日：2021-12-28
申请号：US16631651
申请日：2018-06-19
Applicant: Siemens Aktiengesellschaft
Inventor： Rene Blank , Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Jörg Strogies , Klaus Wilke
Abstract: Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.
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