OLEOPHOBIC GLASS SUBSTRATES
    14.
    发明申请
    OLEOPHOBIC GLASS SUBSTRATES 有权
    多孔玻璃基材

    公开(公告)号:US20110206903A1

    公开(公告)日:2011-08-25

    申请号:US13027396

    申请日:2011-02-15

    Inventor: Prantik Mazumder

    Abstract: A glass substrate having an oleophobic surface. The surface is substantially free of features that form a reentrant geometry and includes a plurality of gas-trapping features extending from the surface to a depth below the surface and a coating comprising at least one of a fluoropolymer and a fluorosilane. The gas-trapping features are substantially isolated from each other, and trap gas below droplets to prevent wetting of the surface.

    Abstract translation: 具有疏油性表面的玻璃基板。 表面基本上没有形成折入几何形状的特征,并且包括从表面延伸到表面下方的深度的多个气体捕获特征以及包含含氟聚合物和氟硅烷中的至少一种的涂层。 气体捕获特征基本上彼此隔离,并将气体捕获在液滴之下以防止表面的润湿。

    METHOD OF EXOCASTING AN ARTICLE OF SEMICONDUCTING MATERIAL
    15.
    发明申请
    METHOD OF EXOCASTING AN ARTICLE OF SEMICONDUCTING MATERIAL 有权
    出售半导体材料的方法

    公开(公告)号:US20110135902A1

    公开(公告)日:2011-06-09

    申请号:US12631054

    申请日:2009-12-04

    CPC classification number: C30B15/007 C30B11/00 C30B19/062 C30B29/06

    Abstract: A method of making an article of a semiconducting material involves selecting a target thickness for the article and then submerging a mold into a molten semiconducting material for a submersion time effective to form a solid layer of semiconducting material over an external surface of the mold where the thickness of the solid layer is substantially equal to the target thickness. The submersion time is selected to be substantially equal to a transition time, which is determined from a plot of solid layer thickness versus submersion time for a mold having particular attributes, including mold composition, mold thickness and initial mold temperature. The transition time, and thus the submersion time, corresponds to a maximum in solid layer thickness in the solid layer thickness versus submersion time curve for the particular mold.

    Abstract translation: 制造半导体材料制品的方法包括选择制品的目标厚度,然后将模具浸入熔融半导体材料中以便浸入时间有效地在模具的外表面上形成半导体材料的固体层,其中 固体层的厚度基本上等于目标厚度。 浸入时间被选择为基本上等于转变时间,其从具有特定属性的模具的实心层厚度对浸没时间的图确定,包括模具成分,模具厚度和初始模具温度。 过渡时间,从而浸没时间对应于固体层厚度对于特定模具的固体层厚度与浸没时间曲线的最大值。

    COMPOSITE ACTIVE MOLDS AND METHODS OF MAKING ARTICLES OF SEMICONDUCTING MATERIAL
    19.
    发明申请
    COMPOSITE ACTIVE MOLDS AND METHODS OF MAKING ARTICLES OF SEMICONDUCTING MATERIAL 审中-公开
    复合材料的主要成分及制备方法

    公开(公告)号:US20120299218A1

    公开(公告)日:2012-11-29

    申请号:US13117440

    申请日:2011-05-27

    CPC classification number: C30B15/007 C30B15/36 C30B29/06

    Abstract: The disclosure relates to a substrate mold comprising a shell material having an external surface configured to engage with molten semiconducting material, and an internal surface configured as a thermal transfer surface to transfer heat therethrough, and a core defined within the shell material and configured to remove heat from the shell material through the thermal transfer surface of the shell material. The substrate mold is configured to be immersed into the molten semiconducting material, and the external surface of the shell material is configured to have solidified molten semiconducting material formed thereon.

    Abstract translation: 本公开涉及一种基材模具,其包括壳体材料,该外壳材料具有被配置为与熔融半导体材料接合的外表面,以及被配置为热转印表面以传递热量的内表面,以及限定在外壳材料内的构造物, 外壳材料通过外壳材料的热传递表面的热量。 衬底模具被配置为浸入熔融半导体材料中,并且外壳材料的外表面被配置为具有在其上形成的凝固的熔融半导体材料。

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