公开(公告)号：US09279057B2

公开(公告)日：2016-03-08

申请号：US14270413

申请日：2014-05-06

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： Hsiu-Ming Chang ,  Shih-Chang Lin ,  Tzu-Ching Hung

IPC: C08L63/00 ,  C08L79/08 ,  C09D11/102

CPC classification number: C09D11/102 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/05

Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

Abstract translation: 一种制造耐热可焊性耐油墨的方法，包括以下步骤：聚合具有长碳链的脂族二胺单体，芳族二酐单体，具有羧酸基团的芳族二胺单体和具有 羧酸基团，得到多胺酸; 环化多胺酸得到聚酰亚胺; 并将聚酰亚胺和固化剂混合以得到可热固化的耐焊油墨。 通过上述步骤，由该方法制成的可热固化的耐焊锡墨水具有小于3.00的介电常数和小于0.01的介电损耗，因此可应用于高频电子设备。 另外，可热固化的耐焊锡墨水具有良好的电气性能，耐折叠性，耐焊接性，耐翘曲性，阻燃性，耐酸性，耐碱性，耐溶剂性和低吸水性。

公开(公告)号：US20150346402A1

公开(公告)日：2015-12-03

申请号：US14452704

申请日：2014-08-06

Applicant: TAIFLEX SCIENTIFIC CO ., LTD.

Inventor： Yu-Chih Kao ,  Chi-Yung Chang ,  Kuan-Yu Li ,  Tzu-Ching Hung

IPC: G02B5/20 ,  G02B1/04 ,  D01D5/08 ,  G02B5/22

CPC classification number: G02B5/208 ,  D01D5/08 ,  D01D5/24 ,  D01D5/253 ,  D01D5/32 ,  D01F1/10 ,  D01F1/106 ,  D02G3/44 ,  D10B2401/00 ,  D10B2401/04 ,  D10B2401/22 ,  G02B1/04 ,  G02B5/206 ,  G02B5/22 ,  C08L67/00 ,  C08L77/02 ,  C08L23/06 ,  C08L23/12

Abstract: The near-infrared radiation absorbing masterbatch provided is prepared by melt-extruding a mixture comprising near-infrared radiation absorbing particles and a first polymer. The particles have a near-infrared absorption at a wavelength ranging from 0.7 μm to 2 μm and a far-infrared emissivity equal to or more than 0.85. The near-infrared light radiated by the particles has a wavelength ranging from 2 μm to 22 μm. Accordingly, the product made from the masterbatch, such as the near-infrared radiation absorbing fiber, plate, or film can not only absorb sunlight and store heat, but also radiate far-infrared light. Hence, the product has a thermal effect for keeping the human body warm and can serve as indoor and outdoor heat storing products at the same time.

Abstract translation: 提供的近红外辐射吸收母料通过熔融挤出包含近红外辐射吸收颗粒和第一聚合物的混合物来制备。 颗粒在0.7μm至2μm的波长和远红外发射率等于或大于0.85的情况下具有近红外吸收。 由颗粒辐射的近红外光具有2μm至22μm的波长。 因此，由母粒制成的产品，例如近红外辐射吸收纤维，板或膜不仅可以吸收阳光并储存热量，还可以辐射远红外光。 因此，该产品具有保持人体温暖的热效应，并且可以同时用作室内和室外储热产品。

公开(公告)号：US20150257296A1

公开(公告)日：2015-09-10

申请号：US14200201

申请日：2014-03-07

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： Tzu-Ching Hung ,  Yu-Chen Shih ,  Feng-Jung Tien ,  Chen-Kuo Lu ,  Yu-Hsien Lee ,  Su-Ping Wu

IPC: H05K5/03

CPC classification number: H05K3/281 ,  H05K1/0209 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/2054 ,  Y10T428/24959

Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.

Abstract translation: 印刷电路板的覆盖层具有聚合物膜，反射复合层和粘合剂层。 聚合物膜的熔点大于260℃。反射复合层安装在聚合物膜的一个侧表面上并具有第一反射颜料。 粘合剂层安装在聚合物膜的另一侧表面上。 此外，在覆盖层的反射率大于89％的波长范围内，聚合物膜在相同波长范围内的吸收小于35％。 覆盖层层压在印刷电路板上，并且在160℃至320℃的温度范围内的表面贴装技术工艺之后，覆盖层的反射率超过89％，没有黄化和分层。

公开(公告)号：US20150108388A1

公开(公告)日：2015-04-23

申请号：US14058371

申请日：2013-10-21

Applicant: Taiflex Scientific Co., Ltd.

Inventor： Yu-Chih Kao ,  Chen-Kuo Lu ,  Tzu-Ching Hung

IPC: G02B1/04 ,  G02B5/20

CPC classification number: G02B1/04 ,  G02B1/041 ,  G02B5/206 ,  G02B5/208 ,  C08L67/00 ,  C08L69/00 ,  C08L2666/54

Abstract: Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles.

Abstract translation: 提供一种吸光组合物，其通过熔融挤出含有光吸收颗粒聚集体和聚合物的混合物制备。 光吸收粒子聚集体包含分散剂和被分散剂封端的光吸收颗粒，分散在光吸收组合物中的光吸收颗粒聚集体具有10纳米至800纳米的平均粒度。 因此，光吸收组合物可以有效地吸收近红外光并存储红外线，从而提供红外线吸收，隔热和蓄热的能力。 此外，由光吸收组合物制成的光吸收结构具有良好的透明性，更高的红外吸光度，光吸收和放热效率，从而有利于保持建筑物或车辆的温度平衡。