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    ELECTRONIC COMPONENT
    11.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190096576A1

    公开(公告)日：2019-03-28

    申请号：US16142212

    申请日：2018-09-26

    Applicant: TDK CORPORATION

    Inventor： Shinya ONODERA ,  Takehisa TAMURA ,  Atsushi TAKEDA ,  Ken MORITA

    IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18

    CPC classification number: H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/181

    Abstract: An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.

    ELECTRONIC COMPONENT
    13.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210043385A1

    公开(公告)日：2021-02-11

    申请号：US16986712

    申请日：2020-08-06

    Applicant: TDK CORPORATION

    Inventor： Yuichi NAGAI ,  Takehisa TAMURA ,  Shinya ONODERA ,  Ken MORITA ,  Atsushi TAKEDA

    IPC: H01G4/248 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.

    ELECTRONIC COMPONENT
    14.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210043378A1

    公开(公告)日：2021-02-11

    申请号：US16986588

    申请日：2020-08-06

    Applicant: TDK CORPORATION

    Inventor： Yuichi NAGAI ,  Takehisa TAMURA ,  Shinya ONODERA ,  Ken MORITA ,  Atsushi TAKEDA

    IPC: H01G4/008 ,  H01G4/232 ,  H01G4/30

    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1>0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.

    ELECTRONIC COMPONENT
    15.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200312563A1

    公开(公告)日：2020-10-01

    申请号：US16820138

    申请日：2020-03-16

    Applicant: TDK CORPORATION

    Inventor： Yuichi NAGAI ,  Atsushi TAKEDA ,  Takehisa TAMURA ,  Shinya ONODERA

    IPC: H01G4/232 ,  H01G4/248

    Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1≥0.11.

    ELECTRONIC COMPONENT
    16.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200211775A1

    公开(公告)日：2020-07-02

    申请号：US16724712

    申请日：2019-12-23

    Applicant: TDK CORPORATION

    Inventor： Shinya ONODERA ,  Takehisa TAMURA ,  Atsushi TAKEDA ,  Yuichi NAGAI

    IPC: H01G4/248 ,  H01G4/012 ,  H01G4/30

    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.

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