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公开(公告)号：US20220392674A1
公开(公告)日：2022-12-08
申请号：US17887375
申请日：2022-08-12
Applicant: TDK Electronics AG
Inventor： Thomas Stendel , Jan Ihle , Gerald Kloiber , Thomas Bernert
IPC: H01C1/14 , B23K26/21 , G01K1/14 , G01K7/22 , H01C7/04 , H01C17/28 , H01R4/02 , H01R12/53 , H01R43/02
Abstract: An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.
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公开(公告)号：US11085844B2
公开(公告)日：2021-08-10
申请号：US16650324
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.
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公开(公告)号：US12014852B2
公开(公告)日：2024-06-18
申请号：US17636286
申请日：2020-09-15
Applicant: TDK Electronics AG
Inventor： Jan Ihle , Thomas Bernert , Gerald Kloiber
IPC: H01C7/04 , G01K7/22 , H01C1/14 , H01C17/075
CPC classification number: H01C7/041 , G01K7/22 , H01C1/1413 , H01C7/048 , H01C17/075
Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
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公开(公告)号：US20220293305A1
公开(公告)日：2022-09-15
申请号：US17636286
申请日：2020-09-15
Applicant: TDK Electronics AG
Inventor： Jan Ihle , Thomas Bernert , Gerald Kloiber
IPC: H01C7/04 , H01C1/14 , G01K7/22 , H01C17/075
Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
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公开(公告)号：US20220283040A1
公开(公告)日：2022-09-08
申请号：US17637768
申请日：2020-09-16
Applicant: TDK Electronics AG
Inventor： Anke Weidenfelder , Jan Ihle , Thomas Stendel , Lutz Heiner Kirsten
Abstract: In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.
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Patent Agency Ranking
公开(公告)号：US20200292401A1
公开(公告)日：2020-09-17
申请号：US16650937
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing comprising a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall.
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公开(公告)号：US20200271534A1
公开(公告)日：2020-08-27
申请号：US16650324
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.
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公开(公告)号：US20200256751A1
公开(公告)日：2020-08-13
申请号：US16629663
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing having a housing wall, a sensor element arranged in the housing, a ceramic substrate configured to serve as a support for the sensor element and an electrical connection thereof and a first heating element arranged in an interior of the housing or in the housing wall.
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公开(公告)号：US20240344897A1
公开(公告)日：2024-10-17
申请号：US18579477
申请日：2022-07-04
Applicant: TDK Electronics AG
Inventor： Jan Ihle , Elisabeth Schwarz-Funder , Wolfgang Fail , Gerhard Hojas , Subramanian Ravichandran , Dhananjay Chavan
IPC: G01K7/22
CPC classification number: G01K7/22
Abstract: In an embodiment a NTC sensor include a chip, two parallel wires, each wire having contact points, and contact-connections between the chip and the contact points of each of the wires, wherein a maximum lateral dimension of the NTC sensor in any direction perpendicular to a direction of extension of the wires is equal to or less than a sum of the lateral dimensions of the chip and the wires.
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公开(公告)号：US20240096525A1
公开(公告)日：2024-03-21
申请号：US18524795
申请日：2023-11-30
Applicant: TDK Electronics AG
Inventor： Jan Ihle , Thomas Bernert , Gerald Kloiber
IPC: H01C7/04 , G01K7/22 , H01C1/14 , H01C17/075
CPC classification number: H01C7/041 , G01K7/22 , H01C1/1413 , H01C7/048 , H01C17/075
Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside, at least one functional layer arranged at the top side of the carrier layer and comprising a material having a temperature-dependent electrical resistance and at least one top electrode configured for electrically contacting the functional layer from a top side of the functional layer, wherein the top electrode is arranged directly on the functional layer, wherein the top electrode forms the top side of the sensor element, and wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system.
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