公开(公告)号：US09111845B2

公开(公告)日：2015-08-18

申请号：US14468370

申请日：2014-08-26

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L29/00 ,  H01L23/00 ,  H01L49/02 ,  H01L23/28 ,  H01L23/522 ,  H05K1/16

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。

公开(公告)号：US08945986B2

公开(公告)日：2015-02-03

申请号：US14154916

申请日：2014-01-14

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L21/00 ,  H01L23/00 ,  H05K1/18 ,  H05K3/12 ,  H05K3/32 ,  H05K1/09

CPC classification number: H01L23/00 ,  B41M3/06 ,  H01L23/48 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H05K1/092 ,  H05K1/181 ,  H05K3/125 ,  H05K3/32 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10454 ,  Y02P70/611

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract translation: 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。

公开(公告)号：US20140127856A1

公开(公告)日：2014-05-08

申请号：US14154916

申请日：2014-01-14

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L23/00

CPC classification number: H01L23/00 ,  B41M3/06 ,  H01L23/48 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H05K1/092 ,  H05K1/181 ,  H05K3/125 ,  H05K3/32 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10454 ,  Y02P70/611

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract translation: 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。

公开(公告)号：US20140124939A1

公开(公告)日：2014-05-08

申请号：US13668901

申请日：2012-11-05

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/488

CPC classification number: H01L23/64 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L24/24 ,  H01L24/29 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24265 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/73217 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82102 ,  H01L2224/822 ,  H01L2224/8221 ,  H01L2224/82399 ,  H01L2224/8284 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/92144 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/27 ,  H01L2224/8312 ,  H01L2924/00

Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

Abstract translation: 一种制造电子设备的方法，其具有安装在电子管芯的表面上的分立器件，其中所述分立器件和所述管芯通过热固化的导电油墨连接并被固化的密封剂覆盖，包括将所述分立器件放置在所述管芯上; 并且将分立装置和模具中的每一个的温度保持在约200℃以下。还公开了一种将分立装置电连接到基板的方法，该方法包括将装置放置在基板上，施加连接至少一个 将端子连接到基板上的至少一个触点并固化导电油墨。 还公开了具有具有电端子的分立电气装置的IC封装; 电气基板，其表面上具有接触焊盘; 以及将至少一个电端子与至少一个接触焊盘连接的固化的导电油墨。