公开(公告)号：US20190139868A1

公开(公告)日：2019-05-09

申请号：US15808537

申请日：2017-11-09

Applicant: Texas Instruments Incorporated

Inventor： Robert Allan Neidorff ,  Benjamin Cook ,  Steven Alfred Kummerl ,  Barry Jon Male ,  Peter Smeys

IPC: H01L23/495 ,  H01L23/485

Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.

公开(公告)号：US11697135B2

公开(公告)日：2023-07-11

申请号：US16186072

申请日：2018-11-09

Applicant: Texas Instruments Incorporated

Inventor： Mohammad Hadi Motieian Najar ,  Peter Smeys

IPC: B06B1/06 ,  B06B1/02 ,  H10N30/87 ,  H10N30/88 ,  H10N30/00

CPC classification number: B06B1/0622 ,  B06B1/0215 ,  H10N30/1071 ,  H10N30/87 ,  H10N30/88

Abstract: In one embodiment, a transducer comprises a first piezoelectric stack comprising a piezoelectric material; a first layer in contact with the piezoelectric stack; and a base structure beneath the first layer. The first layer has a first displacement between a first portion of the base structure and the first layer, and the first displacement is configurable by a first bias voltage received by the transducer.

公开(公告)号：US11621694B2

公开(公告)日：2023-04-04

申请号：US16509224

申请日：2019-07-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo Segovia Fernandez ,  Peter Smeys

IPC: H03H9/145 ,  H03H9/02 ,  H03H9/25 ,  H01L41/053 ,  G01L3/10

Abstract: A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

公开(公告)号：US11296016B2

公开(公告)日：2022-04-05

申请号：US15808537

申请日：2017-11-09

Applicant: Texas Instruments Incorporated

Inventor： Robert Allan Neidorff ,  Benjamin Cook ,  Steven Alfred Kummerl ,  Barry Jon Male ,  Peter Smeys

IPC: H01L23/495 ,  H01L23/485 ,  H01L23/31 ,  B81C1/00

Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.

公开(公告)号：US20200186130A1

公开(公告)日：2020-06-11

申请号：US16446007

申请日：2019-06-19

Applicant: Texas Instruments Incorporated

Inventor： Jeronimo Segovia Fernandez ,  Peter Smeys ,  Ali Djabbari

IPC: H03J7/04 ,  H03B5/06

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to measure a resonant sensor based on detection of group delay. An example apparatus includes a modulation manager configured to query the resonant sensor with a modulated signal including a frequency; and a resonance determiner configured to determine a resonance frequency of the resonant sensor based on a group delay associated with the resonant sensor and the frequency.

公开(公告)号：US20250079340A1

公开(公告)日：2025-03-06

申请号：US18951320

申请日：2024-11-18

Applicant: Texas Instruments Incorporated

Inventor： Scott Robert Summerfelt ,  Thomas Dyer Bonifield ,  Sreeram Subramanyam Nasum ,  Peter Smeys ,  Benjamin Stassen Cook

IPC: H01L23/00 ,  H01L21/762 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  H01L23/64

Abstract: In some examples, a semiconductor device comprises a substrate, a trench, and a layer of a dielectric material. The substrate includes a semiconductor material and has opposing first and second surfaces. The trench extends between the first surface and the second surface, the trench having the dielectric material. The layer of the dielectric material is on the second surface of the substrate and is contiguous with the dielectric material in the trench.

公开(公告)号：US12148717B2

公开(公告)日：2024-11-19

申请号：US17583322

申请日：2022-01-25

Applicant: Texas Instruments Incorporated

Inventor： Scott Robert Summerfelt ,  Thomas Dyer Bonifield ,  Sreeram Subramanyam Nasum ,  Peter Smeys ,  Benjamin Stassen Cook

IPC: H01L23/00 ,  H01L21/762 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  H01L23/64

Abstract: In described examples of an integrated circuit (IC) there is a substrate of semiconductor material having a first region with a first transistor formed therein and a second region with a second transistor formed therein. An isolation trench extends through the substrate and separates the first region of the substrate from the second region of the substrate. An interconnect region having layers of dielectric is disposed on a top surface of the substrate. A dielectric polymer is disposed in the isolation trench and in a layer over the backside surface of the substrate. An edge of the polymer layer is separated from the perimeter edge of the substrate by a space.

公开(公告)号：US20230253951A1

公开(公告)日：2023-08-10

申请号：US18301324

申请日：2023-04-17

Applicant: Texas Instruments Incorporated

Inventor： Jeronimo Segovia Fernandez ,  Peter Smeys ,  Ting-Ta Yen

IPC: H03H9/17 ,  H03H9/05 ,  H03H9/02 ,  H03H9/64

CPC classification number: H03H9/175 ,  H03H9/0542 ,  H03H9/02275 ,  H03H9/64 ,  H03H2009/02299 ,  H03H2009/155

Abstract: A laterally vibrating bulk acoustic wave (LVBAW) resonator includes a piezoelectric plate sandwiched between first and second metal layers. The second metal layer is patterned into an interdigital transducer (IDT) with comb-shaped electrodes having interlocking fingers. The width and pitch of the fingers of the electrodes determine the resonant frequency. A combined thickness of the first and second metal layers and the piezoelectric layer is less than the pitch of the interlocking fingers.

公开(公告)号：US11489511B2

公开(公告)日：2022-11-01

申请号：US16236601

申请日：2018-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo Segovia Fernandez ,  Peter Smeys ,  Ting-Ta Yen

IPC: H03H3/02 ,  H03H9/17 ,  H03H9/13 ,  C23C16/455 ,  C23C14/35 ,  H01L41/316 ,  H01L41/29

Abstract: A resonator includes a substrate, an acoustic Bragg mirror disposed above the substrate, and a bottom metal layer disposed above the acoustic Bragg mirror. The resonator also includes a piezoelectric plate disposed above the bottom metal layer. The resonator further includes a top metal layer disposed above the piezoelectric plate. The top metal layer comprises multiple fingers within a single plane and the width of each of the fingers is between 75%-125% of a thickness of the piezoelectric plate.

公开(公告)号：US10727161B2

公开(公告)日：2020-07-28

申请号：US16055395

申请日：2018-08-06

Applicant: Texas Instruments Incorporated

Inventor： Peter Smeys ,  Ting-Ta Yen ,  Barry Jon Male ,  Paul Merle Emerson

IPC: H01L23/433 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: Described examples include microelectronic devices and integrated circuits with an active first circuit in a first segment of a first wafer, a second circuit in a second segment of the first wafer, and second and third wafers bonded to different surfaces of the first wafer to provide first and second cavities with surfaces spaced from the first segment. An opening extends through the first wafer between the first and second cavities to separate portions of the first and second segments and to form a sealed cavity that surrounds the first segment. A bridge segment of the first wafer supports the first segment in the sealed cavity and includes one or more conductive structures to electrically connect the first and second circuits.