Lead Frame for Multi-Chip Modules With Integrated Surge Protection

    公开(公告)号:US20210159192A1

    公开(公告)日:2021-05-27

    申请号:US16697617

    申请日:2019-11-27

    Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

    Sense circuit for voltage converter

    公开(公告)号:US09748842B1

    公开(公告)日:2017-08-29

    申请号:US15213217

    申请日:2016-07-18

    Abstract: A system including a first power transistor including a gate, a second power transistor including a gate and connected in series with the first power transistor, wherein the connection between the transistors defines a switch node is disclosed. The system further includes a pulse width modulator (PWM) controller configured to assert control signals to the gates of the first and second power transistors, a high side sensing circuit coupled to the gate and a drain of the first power transistor. The system further includes a low side sensing circuit coupled to the gate and a drain of the second power transistor, and a track and hold circuit coupled to the high and low side sensing circuits and configured to couple sense signals from the high and low side sensing circuits.

    DYNAMIC BIASING CIRCUITS FOR LOW DROP OUT (LDO) REGULATORS
    16.
    发明申请
    DYNAMIC BIASING CIRCUITS FOR LOW DROP OUT (LDO) REGULATORS 有权
    用于低压降(LDO)调节器的动态偏置电路

    公开(公告)号:US20160349774A1

    公开(公告)日:2016-12-01

    申请号:US14930906

    申请日:2015-11-03

    CPC classification number: G05F1/56 G05F1/465 G05F1/575

    Abstract: Dynamic biasing circuits for low drop out (LDO) regulators are described. In some embodiments, an electronic circuit may include a low drop out (LDO) regulator; and a biasing circuit coupled to the LDO regulator, the biasing circuit configured to: monitor a first electrical current and a second electrical current; select a greater of the first or second electrical currents; and provide the selected electrical current to the LDO regulator. In other embodiments, a method may include: providing a digital core and a low drop out (LDO) regulator coupled to the digital core, wherein the digital core is configured to operate in an active mode and in a standby mode; monitoring, via a current selector circuit coupled to the LDO regulator, a first current and a second current; selecting a greater of the first or second electrical currents; and providing the selected current as a biasing current to the LDO regulator.

    Abstract translation: 描述了用于低压降(LDO)调节器的动态偏置电路。 在一些实施例中,电子电路可以包括低压降(LDO)调节器; 以及耦合到所述LDO调节器的偏置电路,所述偏置电路被配置为:监视第一电流和第二电流; 选择较大的第一或第二电流; 并将所选择的电流提供给LDO调节器。 在其他实施例中,方法可以包括:提供耦合到数字核心的数字核心和低压降(LDO)调节器,其中所述数字核心被配置为以活动模式和待机模式操作; 通过耦合到LDO调节器的电流选择器电路监测第一电流和第二电流; 选择较大的第一或第二电流; 并将所选择的电流作为偏置电流提供给LDO调节器。

    Lead frame for multi-chip modules with integrated surge protection

    公开(公告)号:US11380631B2

    公开(公告)日:2022-07-05

    申请号:US16697617

    申请日:2019-11-27

    Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

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