AUTOCLAVE SYSTEM, BLADDER ASSEMBLY, AND ASSOCIATED METHOD FOR FORMING A PART

    公开(公告)号:US20220212425A1

    公开(公告)日:2022-07-07

    申请号:US17556688

    申请日:2021-12-20

    Abstract: Disclosed herein is a bladder assembly for forming a part made of a fiber-reinforced polymeric material. The bladder assembly comprises a bladder comprising an interior having a hollow interior channel within the interior of the bladder. The bladder assembly also comprises an intake port fluidically coupled with the interior of the bladder and an exhaust port fluidically coupled with the interior of the bladder. The bladder assembly further comprises a pressure control device fluidically coupled with the exhaust port and configured to control a pressure drop across the interior of the bladder from the intake port to the exhaust port.

    Autoclave plenum
    12.
    发明授权

    公开(公告)号:US11161083B2

    公开(公告)日:2021-11-02

    申请号:US16410957

    申请日:2019-05-13

    Abstract: An autoclave comprises an elongate chamber enclosing an interior atmosphere, a floor configured to support one or more objects, and a plenum extending through a portion of the elongate chamber. The plenum includes an inlet as well as a plurality of outlets. The inlet is configured to receive a plenum flow of the interior atmosphere, while each of the plurality of outlets is configured to release a portion of the plenum flow to a different locus of the elongate chamber.

    Device for Emulating Temperature of a Composite Structure Through a Thermal Cure Cycle
    13.
    发明申请
    Device for Emulating Temperature of a Composite Structure Through a Thermal Cure Cycle 有权
    通过热固化循环模拟复合结构温度的装置

    公开(公告)号:US20150253202A1

    公开(公告)日:2015-09-10

    申请号:US14718688

    申请日:2015-05-21

    Inventor: Karl M. Nelson

    Abstract: A temperature emulator may include a stack assembly having a pair of end plates positioned at an uppermost and lowermost location of the stack assembly, a plurality of heat sink plates disposed between the pair of end plates, each of the heat sink plates having a plurality of heat sink cutouts, a plurality of shim plates separating adjacent pairs of the end plates and the heat sink plates, each of the shim plates having a shim cutout, an open cavity formed by a plurality of adjacent heat sink cutouts and shim cutouts, thermal insulation disposed within the cavity, and at least one temperature sensor coupled to at least one of the plurality of heat sink plates.

    Abstract translation: 温度仿真器可以包括堆叠组件,其具有位于堆组件的最上部和最下部位置处的一对端板,设置在该对端板之间的多个散热板,每个散热板具有多个 散热器切口,分隔相邻的端板和散热板的多个垫片板,每个垫板具有垫片切口,由多个相邻的散热器切口和垫片切口形成的开口腔,隔热层 设置在所述空腔内,以及耦合到所述多个散热板中的至少一个的至少一个温度传感器。

    TEST SYSTEM AND METHOD FOR CREATING CONTROLLED AND REPEATABLE OUT-OF-PLANE FIBER DISTORTION IN COMPOSITE LAMINATES

    公开(公告)号:US20200094497A1

    公开(公告)日:2020-03-26

    申请号:US16142093

    申请日:2018-09-26

    Abstract: In one version there is provided a test system including a layup tool having a layup surface, and two fairing bars attached to the layup surface. The test system includes the composite laminate having a plurality of stacked plies, and positioned between the two fairing bars. The test system includes fiber distortion initiator(s) positioned at one or more locations under, and adjacent to, one or more plies of the plurality of stacked plies. The test system includes two caul plates with a gap in between, and positioned over the composite laminate. When the test system undergoes a pressurized cure process with a vacuum compaction, a restricted outward expansion of the plurality of stacked plies by the fairing bars, and a pressure differential region formed by the one or more fiber distortion initiators at the one or more locations, create the controlled and repeatable out-of-plane fiber distortion in the composite laminate.

    Device for emulating temperature of a composite structure through a thermal cure cycle
    18.
    发明授权
    Device for emulating temperature of a composite structure through a thermal cure cycle 有权
    用于通过热固化循环模拟复合结构的温度的装置

    公开(公告)号:US09068894B2

    公开(公告)日:2015-06-30

    申请号:US13684694

    申请日:2012-11-26

    Inventor: Karl M. Nelson

    Abstract: A temperature emulator may include a stack assembly having a pair of end plates positioned at an uppermost and lowermost location of the stack assembly, a plurality of heat sink plates disposed between the pair of end plates, each of the heat sink plates having a plurality of heat sink cutouts, a plurality of shim plates separating adjacent pairs of the end plates and the heat sink plates, each of the shim plates having a shim cutout, an open cavity formed by a plurality of adjacent heat sink cutouts and shim cutouts, thermal insulation disposed within the cavity, and at least one temperature sensor coupled to at least one of the plurality of heat sink plates.

    Abstract translation: 温度仿真器可以包括堆叠组件,其具有位于堆组件的最上部和最下部位置处的一对端板,设置在该对端板之间的多个散热板,每个散热板具有多个 散热器切口,分隔相邻的端板和散热板的多个垫片板,每个垫板具有垫片切口,由多个相邻的散热器切口和垫片切口形成的开口腔,隔热层 设置在所述空腔内,以及耦合到所述多个散热板中的至少一个的至少一个温度传感器。

    Device for Emulating Temperature of an Exothermic Composite Structure Through a Thermal Cure Cycle
    19.
    发明申请
    Device for Emulating Temperature of an Exothermic Composite Structure Through a Thermal Cure Cycle 有权
    通过热固化循环模拟放热复合结构温度的装置

    公开(公告)号:US20140146855A1

    公开(公告)日:2014-05-29

    申请号:US13904363

    申请日:2013-05-29

    CPC classification number: G01K7/02 B29C35/0288 Y10T29/49004 Y10T29/49366

    Abstract: A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat sink plates, the exothermic charge assembly including an exotherm charge configured to react exothermally in response to a thermal cure cycle.

    Abstract translation: 温度仿真器可以包括堆叠的组件,其包括位于堆叠组件的最上部和最下部位置处的一对端板,定位在该对端板之间的多个散热板,多个垫片, 散热板和位于至少一对散热板之间的放热电荷组件,放热电荷组件包括构造为响应于热固化循环而放热反应的放热电荷。

    SYSTEMS AND METHODS OF CURING A THERMOSET COMPOSITE TO A DESIRED STATE OF CURE

    公开(公告)号:US20200009765A1

    公开(公告)日:2020-01-09

    申请号:US16484771

    申请日:2018-03-15

    Abstract: Systems and methods of curing a thermoset composite (TSC) to a target state of cure (SOC) are disclosed herein. The methods include heating the thermoset composite to greater than a threshold temperature. During the heating, the methods further include monitoring an actual temperature of the thermoset composite, determining a maximum temperature achieved by the thermoset composite, and determining an elapsed time that the actual temperature of the thermoset composite is greater than the threshold temperature. The methods further include ceasing the heating based, at least in part, on the maximum temperature of the TSC and the elapsed time. The systems include a heating assembly, a support mandrel, a thermoset composite, a temperature detector, and a controller programmed to perform the methods.

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