HOLLOW MICROBALLOON
    11.
    发明公开
    HOLLOW MICROBALLOON 审中-公开

    公开(公告)号:US20240101751A1

    公开(公告)日:2024-03-28

    申请号:US18274188

    申请日:2022-01-27

    CPC classification number: C08G18/4883 B24B37/24 C08G18/7621 C08L29/04

    Abstract: The hollow microballoon of the invention includes a resin produced by polymerizing a polymerizing composition that contains a cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof and a polymerizable monomer other than the cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof. According to the invention, there are provided hollow microballoon capable of imparting not only polishing characteristics but also excellent durability to a CMP polishing pad using the hollow microballoon.

    URETHANE RESIN COMPRISING A POLYROTAXANE AND POLISHING PAD

    公开(公告)号:US20190263961A1

    公开(公告)日:2019-08-29

    申请号:US16344599

    申请日:2017-11-16

    Abstract: To provide a urethane resin for sliding members which has high abrasion resistance and is considered that crosslinking points are uniformly dispersed so that molecular motion is suitably possible. Particularly, to provide the urethane resin can be advantageously used as a polishing pad.There is provided the urethane resin for polishing is obtained by polymerizing a polymerizable composition comprising (A) a polyrotaxane having a composite molecular structure formed by an axial molecule and a plurality of cyclic molecules clathrating the axial molecule and side chains having an active hydrogen group introduced into at least some of the cyclic molecules and (B) a polyiso(thio)cyanate compound.

    LAMINATED POLISHING PAD
    17.
    发明公开

    公开(公告)号:US20230211454A1

    公开(公告)日:2023-07-06

    申请号:US17927669

    申请日:2021-05-27

    CPC classification number: B24B37/22 B24B37/24

    Abstract: The CMP laminated polishing pad of the present invention includes at least a polishing layer and an under layer, wherein the under layer contains a resin obtained by polymerizing a polymerizable composition containing: (A) a polyrotaxane monomer having at least two polymerizable functional groups in a molecule; and (B) a polymerizable monomer other than the polyrotaxane monomer having at least two polymerizable functional groups in a molecule. According to the present invention, a polishing pad having not only good wear resistance but also excellent polishing characteristics (high polishing rate, low scratch property, and high flatness) can be provided.

Patent Agency Ranking