公开(公告)号：US12165901B2

公开(公告)日：2024-12-10

申请号：US18231751

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M. C. Lin ,  C. C. Chien ,  Hsuan Lee ,  Boris Huang

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/304 ,  H01L21/66

Abstract: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.

公开(公告)号：US11459190B2

公开(公告)日：2022-10-04

申请号：US17087216

申请日：2020-11-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Yi-Fam Shiu ,  Chueng-Jen Wang ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: B65G47/86 ,  B65G15/28

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

公开(公告)号：US11004720B2

公开(公告)日：2021-05-11

申请号：US15987581

申请日：2018-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Chen ,  Meng-Chen Lin ,  Chung-Hsin Chien ,  Hsuan Lee ,  Boris Huang

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

公开(公告)号：US10510573B2

公开(公告)日：2019-12-17

申请号：US15880567

申请日：2018-01-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Hsuan Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Chih-Hung Huang ,  Yang-Ann Chu

IPC: H01L21/677 ,  H01L21/67

Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.

公开(公告)号：US20230386887A1

公开(公告)日：2023-11-30

申请号：US18231751

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M.C. Lin ,  C.C. Chien ,  Hsuan Lee ,  Boris Huang

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L22/34 ,  H01L21/02043 ,  H01L2221/68327

Abstract: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.

公开(公告)号：US11820607B2

公开(公告)日：2023-11-21

申请号：US17884065

申请日：2022-08-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Yi-Fam Shiu ,  Chueng-Jen Wang ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: B65G47/36 ,  B65G15/28 ,  H01L21/67 ,  H01L21/677 ,  H01L21/683 ,  H01L21/66 ,  B65G47/86

CPC classification number: B65G47/842 ,  B65G15/28 ,  H01L21/67271 ,  H01L21/67294 ,  H01L21/67706 ,  H01L21/67736 ,  H01L21/6838 ,  H01L22/34

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

公开(公告)号：US20230063707A1

公开(公告)日：2023-03-02

申请号：US17984096

申请日：2022-11-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US10854490B2

公开(公告)日：2020-12-01

申请号：US16396426

申请日：2019-04-26

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Ming-Hsien Tsai ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/67 ,  H01L21/677 ,  B65G47/91

Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.

公开(公告)号：US20200156884A1

公开(公告)日：2020-05-21

申请号：US16598109

申请日：2019-10-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Yi-Fam Shiu ,  Chueng-Jen Wang ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: B65G47/86 ,  B65G15/28

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.